ES274595Y - Carcasa para componente electronico. - Google Patents

Carcasa para componente electronico.

Info

Publication number
ES274595Y
ES274595Y ES1982274595U ES274595U ES274595Y ES 274595 Y ES274595 Y ES 274595Y ES 1982274595 U ES1982274595 U ES 1982274595U ES 274595 U ES274595 U ES 274595U ES 274595 Y ES274595 Y ES 274595Y
Authority
ES
Spain
Prior art keywords
housing
electronic component
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES1982274595U
Other languages
English (en)
Other versions
ES274595U (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES274595U publication Critical patent/ES274595U/es
Application granted granted Critical
Publication of ES274595Y publication Critical patent/ES274595Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
ES1982274595U 1981-07-23 1982-07-22 Carcasa para componente electronico. Expired ES274595Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813129134 DE3129134A1 (de) 1981-07-23 1981-07-23 Elektronische bauteile

Publications (2)

Publication Number Publication Date
ES274595U ES274595U (es) 1984-05-16
ES274595Y true ES274595Y (es) 1985-01-01

Family

ID=6137586

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1982274595U Expired ES274595Y (es) 1981-07-23 1982-07-22 Carcasa para componente electronico.

Country Status (5)

Country Link
US (1) US4507710A (es)
EP (1) EP0071827B1 (es)
DE (2) DE3129134A1 (es)
ES (1) ES274595Y (es)
FI (1) FI78213B (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5113314A (en) * 1991-01-24 1992-05-12 Hewlett-Packard Company High-speed, high-density chip mounting
JP3622862B2 (ja) * 1994-08-24 2005-02-23 協伸工業株式会社 ワイヤホルダおよびワイヤホルダ組合せ体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1227995A (es) * 1968-03-21 1971-04-15
FR2044193A5 (es) * 1969-05-12 1971-02-19 Radiotechnique Compelec
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US4044201A (en) * 1974-09-17 1977-08-23 E. I. Du Pont De Nemours And Company Lead frame assembly
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
US4068910A (en) * 1976-03-23 1978-01-17 Honeywell Inc. Bus board connection apparatus
US4378902A (en) * 1981-02-17 1983-04-05 The Jade Corporation Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices

Also Published As

Publication number Publication date
EP0071827A3 (en) 1984-05-30
DE3278380D1 (en) 1988-05-26
FI822593A0 (fi) 1982-07-22
FI78213B (fi) 1989-02-28
EP0071827A2 (de) 1983-02-16
ES274595U (es) 1984-05-16
EP0071827B1 (de) 1988-04-20
FI822593L (fi) 1983-01-24
US4507710A (en) 1985-03-26
DE3129134A1 (de) 1983-02-03

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