FI44819C - Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaan - Google Patents

Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaan

Info

Publication number
FI44819C
FI44819C FI681257A FI125768A FI44819C FI 44819 C FI44819 C FI 44819C FI 681257 A FI681257 A FI 681257A FI 125768 A FI125768 A FI 125768A FI 44819 C FI44819 C FI 44819C
Authority
FI
Finland
Prior art keywords
sides
semiconductor elements
cooling semiconductor
cooling
elements
Prior art date
Application number
FI681257A
Other languages
English (en)
Swedish (sv)
Other versions
FI44819B (fi
Inventor
Mattsson Hugo
Mellgren Gunnar
Original Assignee
Allmaenna Svenska Elek Ska
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allmaenna Svenska Elek Ska filed Critical Allmaenna Svenska Elek Ska
Application granted granted Critical
Publication of FI44819B publication Critical patent/FI44819B/fi
Publication of FI44819C publication Critical patent/FI44819C/fi

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
FI681257A 1967-05-08 1968-05-03 Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaan FI44819C (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE06373/67A SE334947B (fi) 1967-05-08 1967-05-08

Publications (2)

Publication Number Publication Date
FI44819B FI44819B (fi) 1971-09-30
FI44819C true FI44819C (fi) 1972-01-10

Family

ID=20268507

Family Applications (1)

Application Number Title Priority Date Filing Date
FI681257A FI44819C (fi) 1967-05-08 1968-05-03 Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaan

Country Status (7)

Country Link
US (1) US3536133A (fi)
BE (1) BE714821A (fi)
DK (1) DK119069B (fi)
FI (1) FI44819C (fi)
GB (1) GB1216422A (fi)
NO (1) NO121731B (fi)
SE (1) SE334947B (fi)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2103982C3 (de) * 1971-01-28 1980-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Mit isolierender Flüssigkeit gekühlter Stromrichter
US3710193A (en) * 1971-03-04 1973-01-09 Lambda Electronics Corp Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
JPS5295982A (en) * 1976-02-09 1977-08-12 Hitachi Ltd Semiconductor commutation stack
JPS583304Y2 (ja) * 1981-10-28 1983-01-20 株式会社日立製作所 半導体整流スタツク
US5093982A (en) * 1987-06-01 1992-03-10 Reliability Incorporated Automated burn-in system
US4902969A (en) * 1987-06-01 1990-02-20 Reliability Incorporated Automated burn-in system
CN114650716B (zh) * 2022-05-20 2022-07-29 江苏海鋆自动化技术有限公司 一种数据中心配套用模块化水冷散热装置

Also Published As

Publication number Publication date
BE714821A (fi) 1968-09-30
NO121731B (fi) 1971-04-05
DK119069B (da) 1970-11-09
GB1216422A (en) 1970-12-23
US3536133A (en) 1970-10-27
SE334947B (fi) 1971-05-10
FI44819B (fi) 1971-09-30

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