FI44819C - Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaan - Google Patents
Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaanInfo
- Publication number
- FI44819C FI44819C FI681257A FI125768A FI44819C FI 44819 C FI44819 C FI 44819C FI 681257 A FI681257 A FI 681257A FI 125768 A FI125768 A FI 125768A FI 44819 C FI44819 C FI 44819C
- Authority
- FI
- Finland
- Prior art keywords
- sides
- semiconductor elements
- cooling semiconductor
- cooling
- elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE06373/67A SE334947B (fi) | 1967-05-08 | 1967-05-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
FI44819B FI44819B (fi) | 1971-09-30 |
FI44819C true FI44819C (fi) | 1972-01-10 |
Family
ID=20268507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI681257A FI44819C (fi) | 1967-05-08 | 1968-05-03 | Laite puolijohde-elementtien jäähdyttämiseksi kahdelta sivultaan |
Country Status (7)
Country | Link |
---|---|
US (1) | US3536133A (fi) |
BE (1) | BE714821A (fi) |
DK (1) | DK119069B (fi) |
FI (1) | FI44819C (fi) |
GB (1) | GB1216422A (fi) |
NO (1) | NO121731B (fi) |
SE (1) | SE334947B (fi) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2103982C3 (de) * | 1971-01-28 | 1980-01-17 | Brown, Boveri & Cie Ag, 6800 Mannheim | Mit isolierender Flüssigkeit gekühlter Stromrichter |
US3710193A (en) * | 1971-03-04 | 1973-01-09 | Lambda Electronics Corp | Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components |
US3912001A (en) * | 1974-03-11 | 1975-10-14 | Gen Electric | Water cooled heat sink assembly |
JPS5295982A (en) * | 1976-02-09 | 1977-08-12 | Hitachi Ltd | Semiconductor commutation stack |
JPS583304Y2 (ja) * | 1981-10-28 | 1983-01-20 | 株式会社日立製作所 | 半導体整流スタツク |
US5093982A (en) * | 1987-06-01 | 1992-03-10 | Reliability Incorporated | Automated burn-in system |
US4902969A (en) * | 1987-06-01 | 1990-02-20 | Reliability Incorporated | Automated burn-in system |
CN114650716B (zh) * | 2022-05-20 | 2022-07-29 | 江苏海鋆自动化技术有限公司 | 一种数据中心配套用模块化水冷散热装置 |
-
1967
- 1967-05-08 SE SE06373/67A patent/SE334947B/xx unknown
-
1968
- 1968-04-25 DK DK187968AA patent/DK119069B/da unknown
- 1968-04-26 NO NO1625/68A patent/NO121731B/no unknown
- 1968-05-01 US US725880A patent/US3536133A/en not_active Expired - Lifetime
- 1968-05-03 FI FI681257A patent/FI44819C/fi active
- 1968-05-07 GB GB21558/68A patent/GB1216422A/en not_active Expired
- 1968-05-08 BE BE714821D patent/BE714821A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
BE714821A (fi) | 1968-09-30 |
NO121731B (fi) | 1971-04-05 |
DK119069B (da) | 1970-11-09 |
GB1216422A (en) | 1970-12-23 |
US3536133A (en) | 1970-10-27 |
SE334947B (fi) | 1971-05-10 |
FI44819B (fi) | 1971-09-30 |
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