FI20195982A1 - Apparatus and method for polishing a part - Google Patents

Apparatus and method for polishing a part Download PDF

Info

Publication number
FI20195982A1
FI20195982A1 FI20195982A FI20195982A FI20195982A1 FI 20195982 A1 FI20195982 A1 FI 20195982A1 FI 20195982 A FI20195982 A FI 20195982A FI 20195982 A FI20195982 A FI 20195982A FI 20195982 A1 FI20195982 A1 FI 20195982A1
Authority
FI
Finland
Prior art keywords
polishing
polishing pad
measuring
suspension
sensor
Prior art date
Application number
FI20195982A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Inventor
Arto Peltola
Tatu Peltola
Teemu Simola
Original Assignee
Turun Yliopisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Turun Yliopisto filed Critical Turun Yliopisto
Priority to FI20195982A priority Critical patent/FI20195982A1/en
Priority to CA3161142A priority patent/CA3161142A1/en
Priority to EP20815891.5A priority patent/EP4061576A1/en
Priority to KR1020227020723A priority patent/KR20220134521A/ko
Priority to AU2020385654A priority patent/AU2020385654A1/en
Priority to US17/776,794 priority patent/US20220395955A1/en
Priority to JP2022529095A priority patent/JP2023503280A/ja
Priority to CN202080079861.7A priority patent/CN114728397A/zh
Priority to PCT/FI2020/050764 priority patent/WO2021099681A1/en
Priority to TW109140205A priority patent/TW202122213A/zh
Publication of FI20195982A1 publication Critical patent/FI20195982A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FI20195982A 2019-11-18 2019-11-18 Apparatus and method for polishing a part FI20195982A1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20195982A FI20195982A1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a part
CA3161142A CA3161142A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
EP20815891.5A EP4061576A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
KR1020227020723A KR20220134521A (ko) 2019-11-18 2020-11-16 시편을 연마하기 위한 장치 및 방법
AU2020385654A AU2020385654A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
US17/776,794 US20220395955A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
JP2022529095A JP2023503280A (ja) 2019-11-18 2020-11-16 試料を研磨する装置及び方法
CN202080079861.7A CN114728397A (zh) 2019-11-18 2020-11-16 用于抛光试样的装置和方法
PCT/FI2020/050764 WO2021099681A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
TW109140205A TW202122213A (zh) 2019-11-18 2020-11-18 用於拋光樣品的裝置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20195982A FI20195982A1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a part

Publications (1)

Publication Number Publication Date
FI20195982A1 true FI20195982A1 (en) 2021-05-19

Family

ID=73598895

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20195982A FI20195982A1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a part

Country Status (10)

Country Link
US (1) US20220395955A1 (ja)
EP (1) EP4061576A1 (ja)
JP (1) JP2023503280A (ja)
KR (1) KR20220134521A (ja)
CN (1) CN114728397A (ja)
AU (1) AU2020385654A1 (ja)
CA (1) CA3161142A1 (ja)
FI (1) FI20195982A1 (ja)
TW (1) TW202122213A (ja)
WO (1) WO2021099681A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023242481A1 (en) * 2022-06-15 2023-12-21 Turun Yliopisto Device and method for moistening a polishing pad

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
US6626736B2 (en) * 2000-06-30 2003-09-30 Ebara Corporation Polishing apparatus
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
DE10303407A1 (de) * 2003-01-27 2004-08-19 Friedrich-Schiller-Universität Jena Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten
WO2005043132A1 (en) * 2003-10-31 2005-05-12 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
KR102643278B1 (ko) * 2018-03-07 2024-03-07 어플라이드 머티어리얼스, 인코포레이티드 연마 유체 첨가제 농도 측정 장치 및 그에 관련된 방법들
CN111836700A (zh) * 2019-02-20 2020-10-27 应用材料公司 用于cmp温度控制的装置及方法

Also Published As

Publication number Publication date
CN114728397A (zh) 2022-07-08
US20220395955A1 (en) 2022-12-15
WO2021099681A1 (en) 2021-05-27
KR20220134521A (ko) 2022-10-05
JP2023503280A (ja) 2023-01-27
CA3161142A1 (en) 2021-05-27
AU2020385654A1 (en) 2022-05-26
EP4061576A1 (en) 2022-09-28
TW202122213A (zh) 2021-06-16

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