FI20155031A - Puolijohdemoduuli - Google Patents
PuolijohdemoduuliInfo
- Publication number
- FI20155031A FI20155031A FI20155031A FI20155031A FI20155031A FI 20155031 A FI20155031 A FI 20155031A FI 20155031 A FI20155031 A FI 20155031A FI 20155031 A FI20155031 A FI 20155031A FI 20155031 A FI20155031 A FI 20155031A
- Authority
- FI
- Finland
- Prior art keywords
- semiconductor module
- semiconductor
- module
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20155031A FI127831B (fi) | 2015-01-15 | 2015-01-15 | Menetelmä puolijohdemoduulin valmistamiseksi |
| CN201580073283.5A CN107408512A (zh) | 2015-01-15 | 2015-12-30 | 半导体模块 |
| PCT/FI2015/050958 WO2016113461A1 (en) | 2015-01-15 | 2015-12-30 | A semiconductor module |
| EP15826040.6A EP3245671A1 (en) | 2015-01-15 | 2015-12-30 | A semiconductor module |
| US15/543,922 US10262921B2 (en) | 2015-01-15 | 2015-12-30 | Semiconductor module |
| KR1020177020119A KR20170101944A (ko) | 2015-01-15 | 2015-12-30 | 반도체 모듈 |
| JP2017536320A JP6748082B2 (ja) | 2015-01-15 | 2015-12-30 | 半導体モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20155031A FI127831B (fi) | 2015-01-15 | 2015-01-15 | Menetelmä puolijohdemoduulin valmistamiseksi |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI20155031A true FI20155031A (fi) | 2016-07-16 |
| FI127831B FI127831B (fi) | 2019-03-29 |
Family
ID=55177972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20155031A FI127831B (fi) | 2015-01-15 | 2015-01-15 | Menetelmä puolijohdemoduulin valmistamiseksi |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10262921B2 (fi) |
| EP (1) | EP3245671A1 (fi) |
| JP (1) | JP6748082B2 (fi) |
| KR (1) | KR20170101944A (fi) |
| CN (1) | CN107408512A (fi) |
| FI (1) | FI127831B (fi) |
| WO (1) | WO2016113461A1 (fi) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016112289B4 (de) * | 2016-07-05 | 2020-07-30 | Danfoss Silicon Power Gmbh | Leiterrahmen und Verfahren zur Herstellung desselben |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5839044A (ja) * | 1981-08-14 | 1983-03-07 | ゼロツクス・コ−ポレ−シヨン | 半導体装置用集積パツケ−ジ・薄膜熱交換器 |
| JPH0682768B2 (ja) * | 1985-03-25 | 1994-10-19 | 株式会社東芝 | 放熱制御装置 |
| US5317478A (en) | 1991-11-12 | 1994-05-31 | Hughes Aircraft Company | Hermetic sealing of flexprint electronic packages |
| US5268814A (en) | 1992-05-20 | 1993-12-07 | International Business Machines Corporation | Module packaging |
| WO1995008844A1 (de) | 1993-09-21 | 1995-03-30 | Siemens Aktiengesellschaft | Kühlvorrichtung für ein leistungshalbleitermodul |
| JPH09307040A (ja) * | 1996-05-15 | 1997-11-28 | Hitachi Ltd | 半導体装置、インバータ装置、および半導体装置の製造方法 |
| WO2001095688A1 (en) | 2000-06-05 | 2001-12-13 | The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon | Multiscale transport apparatus and methods |
| US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
| DE20115922U1 (de) * | 2001-01-11 | 2002-01-17 | Siemens Ag | Kunststoff-Schaltplatte eines hydraulischen Kraftfahrzeug-Getriebesteuergerätes |
| US6606251B1 (en) * | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
| US6992888B1 (en) * | 2004-03-08 | 2006-01-31 | Lockheed Martin Corporation | Parallel cooling of heat source mounted on a heat sink by means of liquid coolant |
| US7139172B2 (en) | 2004-07-01 | 2006-11-21 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
| US7140753B2 (en) * | 2004-08-11 | 2006-11-28 | Harvatek Corporation | Water-cooling heat dissipation device adopted for modulized LEDs |
| JP4410065B2 (ja) * | 2004-09-08 | 2010-02-03 | 株式会社東芝 | 電子部品放熱用のコールドプレート |
| US7353859B2 (en) * | 2004-11-24 | 2008-04-08 | General Electric Company | Heat sink with microchannel cooling for power devices |
| US20070131659A1 (en) * | 2005-12-09 | 2007-06-14 | Durocher Kevin M | Method of making an electronic device cooling system |
| US8269341B2 (en) * | 2008-11-21 | 2012-09-18 | Infineon Technologies Ag | Cooling structures and methods |
| KR101255935B1 (ko) * | 2011-07-08 | 2013-04-23 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조방법 |
| US8804782B2 (en) * | 2012-10-29 | 2014-08-12 | Coherent, Inc. | Macro-channel water-cooled heat-sink for diode-laser bars |
| US9480149B2 (en) * | 2013-12-10 | 2016-10-25 | Brocade Communications Systems, Inc. | Printed circuit board with fluid flow channels |
| US9941189B2 (en) * | 2015-12-21 | 2018-04-10 | International Business Machines Corporation | Counter-flow expanding channels for enhanced two-phase heat removal |
-
2015
- 2015-01-15 FI FI20155031A patent/FI127831B/fi not_active IP Right Cessation
- 2015-12-30 EP EP15826040.6A patent/EP3245671A1/en not_active Withdrawn
- 2015-12-30 KR KR1020177020119A patent/KR20170101944A/ko unknown
- 2015-12-30 JP JP2017536320A patent/JP6748082B2/ja not_active Expired - Fee Related
- 2015-12-30 CN CN201580073283.5A patent/CN107408512A/zh active Pending
- 2015-12-30 WO PCT/FI2015/050958 patent/WO2016113461A1/en active Application Filing
- 2015-12-30 US US15/543,922 patent/US10262921B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016113461A1 (en) | 2016-07-21 |
| CN107408512A (zh) | 2017-11-28 |
| US20180012822A1 (en) | 2018-01-11 |
| JP6748082B2 (ja) | 2020-08-26 |
| US10262921B2 (en) | 2019-04-16 |
| EP3245671A1 (en) | 2017-11-22 |
| FI127831B (fi) | 2019-03-29 |
| KR20170101944A (ko) | 2017-09-06 |
| JP2018502460A (ja) | 2018-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Transfer of assignment of patent |
Owner name: LAPPEENRANNAN-LAHDEN TEKNILLINEN YLIOPISTO LUT |
|
| FG | Patent granted |
Ref document number: 127831 Country of ref document: FI Kind code of ref document: B |
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| MM | Patent lapsed |