FI20106065A0 - Menetelmä ja mitta-anturi lämpötilan mittaamiseksi - Google Patents
Menetelmä ja mitta-anturi lämpötilan mittaamiseksiInfo
- Publication number
- FI20106065A0 FI20106065A0 FI20106065A FI20106065A FI20106065A0 FI 20106065 A0 FI20106065 A0 FI 20106065A0 FI 20106065 A FI20106065 A FI 20106065A FI 20106065 A FI20106065 A FI 20106065A FI 20106065 A0 FI20106065 A0 FI 20106065A0
- Authority
- FI
- Finland
- Prior art keywords
- gauge
- measuring temperature
- measuring
- temperature
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20106065A FI126956B (fi) | 2010-10-14 | 2010-10-14 | Menetelmä ja mitta-anturi lämpötilan mittaamiseksi |
DE102011084387A DE102011084387A1 (de) | 2010-10-14 | 2011-10-13 | Verfahren und Sensor zur Messung der Temperatur |
US13/273,907 US9063020B2 (en) | 2010-10-14 | 2011-10-14 | Method and device for measuring temperature having a separate structure for terminal areas arranged in unrestricted thermal contact with a process liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20106065A FI126956B (fi) | 2010-10-14 | 2010-10-14 | Menetelmä ja mitta-anturi lämpötilan mittaamiseksi |
Publications (4)
Publication Number | Publication Date |
---|---|
FI20106065A0 true FI20106065A0 (fi) | 2010-10-14 |
FI20106065L FI20106065L (fi) | 2012-04-15 |
FI20106065A FI20106065A (fi) | 2012-04-15 |
FI126956B FI126956B (fi) | 2017-08-31 |
Family
ID=43064223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20106065A FI126956B (fi) | 2010-10-14 | 2010-10-14 | Menetelmä ja mitta-anturi lämpötilan mittaamiseksi |
Country Status (3)
Country | Link |
---|---|
US (1) | US9063020B2 (fi) |
DE (1) | DE102011084387A1 (fi) |
FI (1) | FI126956B (fi) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105067135B (zh) * | 2015-08-18 | 2017-10-24 | 四川华宇瑞得科技有限公司 | 动态物料测温仪 |
CN105067149B (zh) * | 2015-08-18 | 2017-10-24 | 四川华宇瑞得科技有限公司 | 动态物料测温装置 |
WO2022004098A1 (ja) * | 2020-06-30 | 2022-01-06 | アルプスアルパイン株式会社 | センサーユニットおよびその取り付け構造 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2188158A1 (fi) | 1972-06-14 | 1974-01-18 | Bailey Meter Co | |
DE2235676A1 (de) | 1972-07-20 | 1974-02-07 | Inter Control Koehler Hermann | Vorrichtung zur bestimmung der temperatur eines mediums in einem gehaeuse |
US4129848A (en) * | 1975-09-03 | 1978-12-12 | Raytheon Company | Platinum film resistor device |
US4215577A (en) | 1978-08-28 | 1980-08-05 | Purdue Research Foundation | Utilization of diodes as wide range responsive thermometers |
US4243968A (en) | 1979-04-25 | 1981-01-06 | Robertshaw Controls Company | Temperature sensing unit, parts therefor and methods of making the same |
DE3009108A1 (de) | 1980-03-10 | 1981-09-24 | Hoechst Ag, 6000 Frankfurt | Temperaturfuehler |
DE3134166A1 (de) | 1981-08-28 | 1983-03-10 | Robert Bosch Gmbh, 7000 Stuttgart | Temperaturfuehler |
IN165267B (fi) | 1984-07-31 | 1989-09-09 | Rosemount Inc | |
US4791398A (en) * | 1986-02-13 | 1988-12-13 | Rosemount Inc. | Thin film platinum resistance thermometer with high temperature diffusion barrier |
US5141334A (en) * | 1991-09-24 | 1992-08-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Sub-kelvin resistance thermometer |
KR100228046B1 (ko) | 1997-03-19 | 1999-11-01 | 정명세 | 고온정밀백금저항온도센서 |
DE19905384A1 (de) | 1999-02-10 | 2000-08-17 | Holzschuh Gmbh & Co Kg | Sensor und Verfahren zu dessen Herstellung |
US6354736B1 (en) * | 1999-03-24 | 2002-03-12 | Honeywell International Inc. | Wide temperature range RTD |
US6970644B2 (en) | 2000-12-21 | 2005-11-29 | Mattson Technology, Inc. | Heating configuration for use in thermal processing chambers |
DE10109828A1 (de) | 2001-03-01 | 2002-09-05 | Xcellsis Gmbh | Elekrische Temperaturmessvorrichtung |
US6695886B1 (en) | 2002-08-22 | 2004-02-24 | Axcelis Technologies, Inc. | Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of RTP tool |
JP4062263B2 (ja) | 2004-02-19 | 2008-03-19 | 株式会社デンソー | 温度センサ |
US7665890B2 (en) * | 2006-06-22 | 2010-02-23 | Watlow Electric Manufacturing Company | Temperature sensor assembly and method of manufacturing thereof |
US20090066353A1 (en) * | 2007-08-29 | 2009-03-12 | Heetronix | Probe assemblies and methods for housing and providing electrical contact to planar or chip-type sensors and heaters |
US8079758B2 (en) | 2007-10-25 | 2011-12-20 | Sebacs Co., Ltd. | Temperature computing instrument and method for calibrating temperature of sensor part used therefor |
JP5248360B2 (ja) * | 2009-02-10 | 2013-07-31 | 矢崎総業株式会社 | 温度検出用回路体構造 |
-
2010
- 2010-10-14 FI FI20106065A patent/FI126956B/fi not_active IP Right Cessation
-
2011
- 2011-10-13 DE DE102011084387A patent/DE102011084387A1/de active Pending
- 2011-10-14 US US13/273,907 patent/US9063020B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9063020B2 (en) | 2015-06-23 |
FI126956B (fi) | 2017-08-31 |
FI20106065L (fi) | 2012-04-15 |
US20120093192A1 (en) | 2012-04-19 |
DE102011084387A1 (de) | 2012-04-19 |
FI20106065A (fi) | 2012-04-15 |
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Legal Events
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