FI20050976A0 - Sähköinen liitäntäkomponentti - Google Patents

Sähköinen liitäntäkomponentti

Info

Publication number
FI20050976A0
FI20050976A0 FI20050976A FI20050976A FI20050976A0 FI 20050976 A0 FI20050976 A0 FI 20050976A0 FI 20050976 A FI20050976 A FI 20050976A FI 20050976 A FI20050976 A FI 20050976A FI 20050976 A0 FI20050976 A0 FI 20050976A0
Authority
FI
Finland
Prior art keywords
coupling component
electrical coupling
electrical
component
coupling
Prior art date
Application number
FI20050976A
Other languages
English (en)
Swedish (sv)
Other versions
FI20050976A (fi
FI121157B (fi
Inventor
Tomishige Tai
Seiya Takahashi
Original Assignee
Japan Aviation Electron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electron filed Critical Japan Aviation Electron
Publication of FI20050976A0 publication Critical patent/FI20050976A0/fi
Publication of FI20050976A publication Critical patent/FI20050976A/fi
Application granted granted Critical
Publication of FI121157B publication Critical patent/FI121157B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/2938—Coating on discrete and individual rods, strands or filaments
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
FI20050976A 2003-03-31 2005-09-29 Sähköliitäntäkomponentti FI121157B (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003093835A JP3610400B2 (ja) 2003-03-31 2003-03-31 電気接続部品
JP2003093835 2003-03-31
PCT/JP2004/003721 WO2004089047A1 (ja) 2003-03-31 2004-03-19 電気接続部品
JP2004003721 2004-03-19

Publications (3)

Publication Number Publication Date
FI20050976A0 true FI20050976A0 (fi) 2005-09-29
FI20050976A FI20050976A (fi) 2005-11-28
FI121157B FI121157B (fi) 2010-07-30

Family

ID=33127371

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050976A FI121157B (fi) 2003-03-31 2005-09-29 Sähköliitäntäkomponentti

Country Status (5)

Country Link
US (1) US7323245B2 (fi)
JP (1) JP3610400B2 (fi)
CN (1) CN100391317C (fi)
FI (1) FI121157B (fi)
WO (1) WO2004089047A1 (fi)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009047329A1 (de) * 2009-12-01 2011-06-09 Robert Bosch Gmbh Flexible Leiterplatte sowie elektrische Vorrichtung
US20140218637A1 (en) * 2013-02-06 2014-08-07 Nanchang O-Film Tech. Co., Ltd. Conductive film, manufacturing method thereof, and touch screen including the conducting film
KR101473312B1 (ko) * 2013-05-31 2014-12-16 삼성디스플레이 주식회사 플렉시블 터치스크린패널과 그것을 구비한 플렉시블 디스플레이 장치
KR20150008764A (ko) * 2013-07-15 2015-01-23 지미숙 저전압차동신호용 플렉시블 플랫 케이블
KR102152101B1 (ko) * 2018-11-02 2020-09-07 진영글로벌 주식회사 차량 전장용 디바이스

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3057952A (en) * 1960-10-31 1962-10-09 Sanders Associates Inc Multi-ply flexible wiring unit
US3215574A (en) * 1963-03-25 1965-11-02 Hughes Aircraft Co Method of making thin flexible plasticsealed printed circuits
US4306925A (en) * 1977-01-11 1981-12-22 Pactel Corporation Method of manufacturing high density printed circuit
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
US5219640A (en) * 1991-02-08 1993-06-15 Rogers Corporation Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof
JPH07336026A (ja) * 1994-06-09 1995-12-22 Hitachi Chem Co Ltd カバーレイフィルム付フレキシブル印刷配線板の製造法
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
JPH10341065A (ja) * 1997-06-06 1998-12-22 Sony Corp 補強板付きプリント配線板
DE19812880A1 (de) * 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
JP3110408B2 (ja) * 1998-12-25 2000-11-20 静岡日本電気株式会社 携帯機器の液晶表示デバイス保持構造
JP2000223835A (ja) 1999-01-29 2000-08-11 Canon Inc 多層配線板
WO2000054324A1 (fr) 1999-03-11 2000-09-14 Seiko Epson Corporation Substrat de cablage flexible, bande porte-puces, dispositif a semiconducteur de type bande, dispositif a semiconducteur, procede de fabrication d'un dispositif a semiconducteur, carte de circuit imprime, et dispositif electronique.
JP3694825B2 (ja) * 1999-11-18 2005-09-14 日本航空電子工業株式会社 導体パターンの形成方法及びコネクタ、フレキシブルプリント配線板、異方導電性部材
JP2002124741A (ja) * 2000-10-16 2002-04-26 Nec Saitama Ltd フレキシブルプリント基板
CN1193261C (zh) * 2001-06-08 2005-03-16 那纳须株式会社 液晶显示装置及其制造方法
US6815126B2 (en) * 2002-04-09 2004-11-09 International Business Machines Corporation Printed wiring board with conformally plated circuit traces
JP2004039543A (ja) 2002-07-05 2004-02-05 Matsushita Electric Ind Co Ltd 平板状配線ケーブル及び磁気記録装置

Also Published As

Publication number Publication date
JP2004303888A (ja) 2004-10-28
FI20050976A (fi) 2005-11-28
CN100391317C (zh) 2008-05-28
WO2004089047A1 (ja) 2004-10-14
FI121157B (fi) 2010-07-30
CN1765159A (zh) 2006-04-26
US7323245B2 (en) 2008-01-29
JP3610400B2 (ja) 2005-01-12
US20060180338A1 (en) 2006-08-17

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