FI20030838A0 - Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely - Google Patents
Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestelyInfo
- Publication number
- FI20030838A0 FI20030838A0 FI20030838A FI20030838A FI20030838A0 FI 20030838 A0 FI20030838 A0 FI 20030838A0 FI 20030838 A FI20030838 A FI 20030838A FI 20030838 A FI20030838 A FI 20030838A FI 20030838 A0 FI20030838 A0 FI 20030838A0
- Authority
- FI
- Finland
- Prior art keywords
- liquid cooling
- cooling elements
- coupling arrangements
- elements
- arrangements
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030838A FI117838B (fi) | 2003-06-04 | 2003-06-04 | Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely |
US10/856,831 US7320359B2 (en) | 2003-06-04 | 2004-06-01 | Liquid cooling element and connection arrangement of liquid cooling element |
EP04102449A EP1484954A3 (en) | 2003-06-04 | 2004-06-02 | Liquid cooling element and connection arrangement of liquid cooling element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030838 | 2003-06-04 | ||
FI20030838A FI117838B (fi) | 2003-06-04 | 2003-06-04 | Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20030838A0 true FI20030838A0 (fi) | 2003-06-04 |
FI20030838A FI20030838A (fi) | 2004-12-05 |
FI117838B FI117838B (fi) | 2007-03-15 |
Family
ID=8566203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20030838A FI117838B (fi) | 2003-06-04 | 2003-06-04 | Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely |
Country Status (3)
Country | Link |
---|---|
US (1) | US7320359B2 (fi) |
EP (1) | EP1484954A3 (fi) |
FI (1) | FI117838B (fi) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI122741B (fi) * | 2006-09-29 | 2012-06-15 | Vacon Oyj | Tehomuuttajan tehokomponenttien jäähdytys |
FI124731B (fi) * | 2009-12-18 | 2014-12-31 | Vacon Oyj | Järjestely nestejäähdyttimessä |
US8869877B2 (en) * | 2010-10-11 | 2014-10-28 | Hamilton Sundstrand Space Systems International, Inc. | Monolithic cold plate configuration |
US20120138281A1 (en) * | 2010-12-06 | 2012-06-07 | Transistor Devices, Inc. D/B/A Tdi Power | Heat Exchanger for Electronic Assemblies |
US9295185B2 (en) | 2013-03-13 | 2016-03-22 | Transistor Devices, Inc. | Sealed enclosure for power electronics incorporating a heat exchanger |
KR101546450B1 (ko) | 2013-12-26 | 2015-08-27 | 주식회사 효성 | 초고압 직류 송전시스템의 모듈냉각장치 |
US9516794B2 (en) | 2014-10-31 | 2016-12-06 | Transistor Devices, Inc. | Modular scalable liquid cooled power system |
WO2016180626A1 (en) | 2015-05-13 | 2016-11-17 | Vacon Oy | Arrangement for oscillation dampening |
EP3116292B1 (de) * | 2015-07-06 | 2021-03-17 | EDAG Engineering AG | Elektronikmodul mit generativ erzeugtem kühlkörper |
CN107093834B (zh) * | 2017-05-27 | 2018-10-19 | 深圳市创鑫激光股份有限公司 | 一种光纤激光器及其液冷板 |
US10840167B2 (en) | 2018-11-19 | 2020-11-17 | Advanced Micro Devices, Inc. | Integrated heat spreader with configurable heat fins |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1602287A (en) * | 1923-03-06 | 1926-10-05 | Standard Dev Co | Heat exchanger |
US1818387A (en) * | 1928-07-23 | 1931-08-11 | Southwark Foundry & Machine Co | Steam platen |
US1884612A (en) * | 1930-03-14 | 1932-10-25 | Southwark Foundry & Machine Co | Steam platen |
US1929824A (en) * | 1931-05-12 | 1933-10-10 | French Oil Mill Machinery | Press plate or the like and method of making the same |
US1980627A (en) * | 1934-04-11 | 1934-11-13 | Charles H Leach | Heat exchange apparatus |
US2877992A (en) * | 1956-02-13 | 1959-03-17 | Tobias O Niemi | Milk strainer and cooler |
US4210199A (en) * | 1978-06-14 | 1980-07-01 | Doucette Industries, Inc. | Heat exchange system |
DE4116960A1 (de) | 1991-05-24 | 1992-11-26 | Abb Patent Gmbh | Kuehlvorrichtung fuer mindestens einen kondensator und verfahren zu ihrer herstellung |
GB2263161B (en) * | 1991-12-17 | 1995-04-05 | Apv Corp Ltd | Heat exchange device |
US5269372A (en) * | 1992-12-21 | 1993-12-14 | International Business Machines Corporation | Intersecting flow network for a cold plate cooling system |
DE9309428U1 (de) * | 1993-06-24 | 1993-08-12 | Siemens AG, 80333 München | Stromrichtermodul |
US6032726A (en) * | 1997-06-30 | 2000-03-07 | Solid State Cooling Systems | Low-cost liquid heat transfer plate and method of manufacturing therefor |
IT1293021B1 (it) * | 1997-07-10 | 1999-02-11 | Sme Elettronica Spa | Modulo di potenza a semiconduttori. |
US5871042A (en) * | 1997-11-04 | 1999-02-16 | Teradyne, Inc. | Liquid cooling apparatus for use with electronic equipment |
US6313991B1 (en) * | 2000-07-24 | 2001-11-06 | General Motors Corporation | Power electronics system with fully-integrated cooling |
-
2003
- 2003-06-04 FI FI20030838A patent/FI117838B/fi not_active IP Right Cessation
-
2004
- 2004-06-01 US US10/856,831 patent/US7320359B2/en active Active
- 2004-06-02 EP EP04102449A patent/EP1484954A3/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
FI20030838A (fi) | 2004-12-05 |
US7320359B2 (en) | 2008-01-22 |
EP1484954A3 (en) | 2008-11-12 |
EP1484954A2 (en) | 2004-12-08 |
US20050039886A1 (en) | 2005-02-24 |
FI117838B (fi) | 2007-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Patent granted |
Ref document number: 117838 Country of ref document: FI |
|
PC | Transfer of assignment of patent |
Owner name: VACON OY |
|
MM | Patent lapsed |