FI120128B - Elektroniikkalaitteen jäähdytyslaitteisto sekä menetelmä - Google Patents

Elektroniikkalaitteen jäähdytyslaitteisto sekä menetelmä Download PDF

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Publication number
FI120128B
FI120128B FI20055029A FI20055029A FI120128B FI 120128 B FI120128 B FI 120128B FI 20055029 A FI20055029 A FI 20055029A FI 20055029 A FI20055029 A FI 20055029A FI 120128 B FI120128 B FI 120128B
Authority
FI
Finland
Prior art keywords
air
cooling element
cooling
electronic
space
Prior art date
Application number
FI20055029A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20055029A0 (fi
FI20055029A (fi
Inventor
Mika Silvennoinen
Matti Kauranen
Mika Sares
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20055029A priority Critical patent/FI120128B/fi
Publication of FI20055029A0 publication Critical patent/FI20055029A0/fi
Priority to DE602006000099T priority patent/DE602006000099T2/de
Priority to AT06100023T priority patent/ATE373412T1/de
Priority to EP06100023A priority patent/EP1684565B1/de
Priority to US11/335,271 priority patent/US7372696B2/en
Publication of FI20055029A publication Critical patent/FI20055029A/fi
Priority to US11/812,254 priority patent/US20070242429A1/en
Application granted granted Critical
Publication of FI120128B publication Critical patent/FI120128B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI20055029A 2005-01-20 2005-01-20 Elektroniikkalaitteen jäähdytyslaitteisto sekä menetelmä FI120128B (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20055029A FI120128B (fi) 2005-01-20 2005-01-20 Elektroniikkalaitteen jäähdytyslaitteisto sekä menetelmä
DE602006000099T DE602006000099T2 (de) 2005-01-20 2006-01-03 Kühlungssystem und Verfahren für ein elektronisches Gerät
AT06100023T ATE373412T1 (de) 2005-01-20 2006-01-03 Kühlungssystem und verfahren für ein elektronisches gerät
EP06100023A EP1684565B1 (de) 2005-01-20 2006-01-03 Kühlungssystem und Verfahren für ein elektronisches Gerät
US11/335,271 US7372696B2 (en) 2005-01-20 2006-01-20 Cooling device and method for electronic apparatus
US11/812,254 US20070242429A1 (en) 2005-01-20 2007-06-15 Cooling device for electronic apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20055029 2005-01-20
FI20055029A FI120128B (fi) 2005-01-20 2005-01-20 Elektroniikkalaitteen jäähdytyslaitteisto sekä menetelmä

Publications (3)

Publication Number Publication Date
FI20055029A0 FI20055029A0 (fi) 2005-01-20
FI20055029A FI20055029A (fi) 2006-07-21
FI120128B true FI120128B (fi) 2009-06-30

Family

ID=34112680

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20055029A FI120128B (fi) 2005-01-20 2005-01-20 Elektroniikkalaitteen jäähdytyslaitteisto sekä menetelmä

Country Status (5)

Country Link
US (2) US7372696B2 (de)
EP (1) EP1684565B1 (de)
AT (1) ATE373412T1 (de)
DE (1) DE602006000099T2 (de)
FI (1) FI120128B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009053583B3 (de) * 2009-11-17 2011-03-31 Semikron Elektronik Gmbh & Co. Kg Modular aufgebaute Stromrichteranordnung
EP2339906B1 (de) 2009-12-22 2012-06-27 ABB Oy Leistungselektronikvorrichtung mit Kühlanordnung
EP2339905B1 (de) 2009-12-22 2012-06-27 ABB Oy Leistungselektronikvorrichtungen mit Kühlanordnungen
US8169781B2 (en) * 2010-04-06 2012-05-01 Fsp Technology Inc. Power supply and heat dissipation module thereof
CN103701299B (zh) * 2013-12-10 2016-07-06 深圳市正弦电气股份有限公司 一种变频器
JP6504832B2 (ja) 2014-01-28 2019-04-24 ゼネラル・エレクトリック・カンパニイ 統合された取り付けおよび冷却の装置、電子装置、および車両
US10073512B2 (en) 2014-11-19 2018-09-11 General Electric Company System and method for full range control of dual active bridge

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68920513T2 (de) * 1988-08-31 1995-05-04 Hitachi Ltd Wechselrichtervorrichtung.
US5440450A (en) * 1990-09-14 1995-08-08 Next, Inc. Housing cooling system
JPH076578A (ja) * 1992-10-15 1995-01-10 Ricoh Co Ltd 外部記憶装置
US5309725A (en) * 1993-07-06 1994-05-10 Cayce James L System and method for high-efficiency air cooling and dehumidification
JPH0795771A (ja) * 1993-09-20 1995-04-07 Sansha Electric Mfg Co Ltd 電源装置の冷却構造
US5463967A (en) * 1994-07-21 1995-11-07 Airflow Sciences Corporation Static mixer device for improving homogeneity of a characteristic of a mixture stream created from fluid streams separately entering the device
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
DE69630677T2 (de) * 1996-05-14 2004-09-30 Hewlett-Packard Co. (N.D.Ges.D.Staates Delaware), Palo Alto Einrichtung zur Kühlung von Komponenten in einem elektrischen Gerät mit interner Stromversorgungseinheit
JPH11112177A (ja) 1997-10-02 1999-04-23 Nippon Columbia Co Ltd 電子機器の冷却装置
US7251889B2 (en) * 2000-06-30 2007-08-07 Swales & Associates, Inc. Manufacture of a heat transfer system
US7708053B2 (en) * 2000-06-30 2010-05-04 Alliant Techsystems Inc. Heat transfer system
US6611428B1 (en) * 2002-08-12 2003-08-26 Motorola, Inc. Cabinet for cooling electronic modules
DE20300689U1 (de) * 2003-01-16 2003-03-20 Siemens AG, 80333 München Elektrische Baugruppe
US6955212B1 (en) * 2004-04-20 2005-10-18 Adda Corporation Water-cooler radiator module

Also Published As

Publication number Publication date
DE602006000099D1 (de) 2007-10-25
EP1684565A1 (de) 2006-07-26
EP1684565B1 (de) 2007-09-12
FI20055029A0 (fi) 2005-01-20
FI20055029A (fi) 2006-07-21
US20060158847A1 (en) 2006-07-20
US20070242429A1 (en) 2007-10-18
ATE373412T1 (de) 2007-09-15
US7372696B2 (en) 2008-05-13
DE602006000099T2 (de) 2008-06-12

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