FI119307B - Menetelmä mikromekaanisen liikeanturin valmistamiseksi ja mikromekaaninen liikeanturi - Google Patents

Menetelmä mikromekaanisen liikeanturin valmistamiseksi ja mikromekaaninen liikeanturi Download PDF

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Publication number
FI119307B
FI119307B FI20055324A FI20055324A FI119307B FI 119307 B FI119307 B FI 119307B FI 20055324 A FI20055324 A FI 20055324A FI 20055324 A FI20055324 A FI 20055324A FI 119307 B FI119307 B FI 119307B
Authority
FI
Finland
Prior art keywords
motion sensor
micromechanical
wafer
component
structures
Prior art date
Application number
FI20055324A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20055324A (fi
FI20055324A0 (fi
Inventor
Anssi Blomqvist
Original Assignee
Vti Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vti Technologies Oy filed Critical Vti Technologies Oy
Publication of FI20055324A0 publication Critical patent/FI20055324A0/fi
Priority to FI20055324A priority Critical patent/FI119307B/fi
Priority to KR1020087001143A priority patent/KR20080031282A/ko
Priority to EP06764497A priority patent/EP1891668A1/en
Priority to CNA2006800217799A priority patent/CN101199047A/zh
Priority to JP2008516360A priority patent/JP2008544513A/ja
Priority to PCT/FI2006/050258 priority patent/WO2006134233A1/en
Priority to CA002612283A priority patent/CA2612283A1/en
Priority to US11/453,914 priority patent/US7682861B2/en
Publication of FI20055324A publication Critical patent/FI20055324A/fi
Priority to IL187939A priority patent/IL187939A0/en
Priority to NO20080337A priority patent/NO20080337L/no
Application granted granted Critical
Publication of FI119307B publication Critical patent/FI119307B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C3/00—Measuring distances in line of sight; Optical rangefinders
    • G01C3/02—Details
    • G01C3/06—Use of electric means to obtain final indication
    • G01C3/08—Use of electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5656—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
FI20055324A 2005-06-17 2005-06-17 Menetelmä mikromekaanisen liikeanturin valmistamiseksi ja mikromekaaninen liikeanturi FI119307B (fi)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20055324A FI119307B (fi) 2005-06-17 2005-06-17 Menetelmä mikromekaanisen liikeanturin valmistamiseksi ja mikromekaaninen liikeanturi
JP2008516360A JP2008544513A (ja) 2005-06-17 2006-06-13 微小機械モーションセンサーを製造する方法、および、微小機械モーションセンサー
EP06764497A EP1891668A1 (en) 2005-06-17 2006-06-13 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
CNA2006800217799A CN101199047A (zh) 2005-06-17 2006-06-13 微机械运动传感器的制造方法以及微机械运动传感器
KR1020087001143A KR20080031282A (ko) 2005-06-17 2006-06-13 초소형 기계식 운동 센서 제조 방법 및 초소형 기계식 운동센서
PCT/FI2006/050258 WO2006134233A1 (en) 2005-06-17 2006-06-13 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
CA002612283A CA2612283A1 (en) 2005-06-17 2006-06-13 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
US11/453,914 US7682861B2 (en) 2005-06-17 2006-06-16 Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor
IL187939A IL187939A0 (en) 2005-06-17 2007-12-06 Method of manufacturing a micromechanical motion sensor and a micromechanical motion sensor
NO20080337A NO20080337L (no) 2005-06-17 2008-01-16 Metode for a fremstille en mikromekanisk bevegelsessensor, og en mikromekanisk bevelgelsessensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20055324 2005-06-17
FI20055324A FI119307B (fi) 2005-06-17 2005-06-17 Menetelmä mikromekaanisen liikeanturin valmistamiseksi ja mikromekaaninen liikeanturi

Publications (3)

Publication Number Publication Date
FI20055324A0 FI20055324A0 (fi) 2005-06-17
FI20055324A FI20055324A (fi) 2007-03-01
FI119307B true FI119307B (fi) 2008-09-30

Family

ID=34778460

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20055324A FI119307B (fi) 2005-06-17 2005-06-17 Menetelmä mikromekaanisen liikeanturin valmistamiseksi ja mikromekaaninen liikeanturi

Country Status (10)

Country Link
US (1) US7682861B2 (ja)
EP (1) EP1891668A1 (ja)
JP (1) JP2008544513A (ja)
KR (1) KR20080031282A (ja)
CN (1) CN101199047A (ja)
CA (1) CA2612283A1 (ja)
FI (1) FI119307B (ja)
IL (1) IL187939A0 (ja)
NO (1) NO20080337L (ja)
WO (1) WO2006134233A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8322216B2 (en) * 2009-09-22 2012-12-04 Duli Yu Micromachined accelerometer with monolithic electrodes and method of making the same
CN109634036B (zh) * 2017-10-09 2022-02-18 中强光电股份有限公司 投影装置及其照明系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758824A (en) * 1985-08-22 1988-07-19 Heinz Jurgen Bernhard Fechner Alarm for a blind
GB2198231B (en) * 1986-11-28 1990-06-06 Stc Plc Rotational motion sensor
US4926695A (en) * 1987-09-15 1990-05-22 Rosemount Inc. Rocking beam vortex sensor
US5022269A (en) * 1989-12-26 1991-06-11 Lew Hyok S Resonance frequency position sensor
JPH06331649A (ja) * 1993-05-18 1994-12-02 Murata Mfg Co Ltd 加速度センサおよびその製造方法
DE19541388A1 (de) * 1995-11-07 1997-05-15 Telefunken Microelectron Mikromechanischer Beschleunigungssensor
WO2002023630A2 (en) * 2000-09-13 2002-03-21 Applied Materials, Inc. Micromachined silicon block vias for transferring electrical signals to the backside of a silicon wafer
JP2002286746A (ja) * 2001-03-23 2002-10-03 Tdk Corp 圧電センサの製造方法
US6956268B2 (en) * 2001-05-18 2005-10-18 Reveo, Inc. MEMS and method of manufacturing MEMS
KR100452818B1 (ko) * 2002-03-18 2004-10-15 삼성전기주식회사 칩 패키지 및 그 제조방법
US6829937B2 (en) * 2002-06-17 2004-12-14 Vti Holding Oy Monolithic silicon acceleration sensor

Also Published As

Publication number Publication date
WO2006134233A9 (en) 2007-10-25
NO20080337L (no) 2008-03-14
CN101199047A (zh) 2008-06-11
US20070012108A1 (en) 2007-01-18
WO2006134233A1 (en) 2006-12-21
IL187939A0 (en) 2008-03-20
FI20055324A (fi) 2007-03-01
JP2008544513A (ja) 2008-12-04
KR20080031282A (ko) 2008-04-08
EP1891668A1 (en) 2008-02-27
FI20055324A0 (fi) 2005-06-17
CA2612283A1 (en) 2006-12-21
US7682861B2 (en) 2010-03-23

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Owner name: MURATA ELECTRONICS OY

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