ES8308737A1 - Una instalacion y un procedimiento de soldadura de alcumbre - Google Patents

Una instalacion y un procedimiento de soldadura de alcumbre

Info

Publication number
ES8308737A1
ES8308737A1 ES511699A ES511699A ES8308737A1 ES 8308737 A1 ES8308737 A1 ES 8308737A1 ES 511699 A ES511699 A ES 511699A ES 511699 A ES511699 A ES 511699A ES 8308737 A1 ES8308737 A1 ES 8308737A1
Authority
ES
Spain
Prior art keywords
wire
welding
welded
automatic wire
wire welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES511699A
Other languages
English (en)
Other versions
ES511699A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Camera and Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera and Instrument Corp filed Critical Fairchild Camera and Instrument Corp
Publication of ES511699A0 publication Critical patent/ES511699A0/es
Publication of ES8308737A1 publication Critical patent/ES8308737A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

INSTALACION Y PROCEDIMIENTO PARA SOLDADURA CON ALAMBRE Y CONJUNTO DE ELECTRODOS CORRESPONDIENTE. EL CONJUNTO DE ELECTRODOS (10) DE SOLDADURA CON ALAMBRE (14), LA INSTALACION O SISTEMA Y EL PROCEDIMIENTO DE SOLDADURA, UTILIZAN EL ALAMBRE A SOLDAR COMO UNO DE LOS ELECTRODOS DE SOLDADURA. EL SISTEMA Y EL PROCEDIMIENTO PROPORCIONAN UN SEGMENTO DE ALAMBRE ENTRE APENDICES DE SOLDAR (16) Y TERMINALES EXTERNOS (32) DE UN PAQUETE (34) DE CIRCUITOS ELECTRONICOS CON UN SUBSTRATO CERAMICO DEL PAQUETE MONTADO EN SU ALOJAMIENTO. HAY PREVISTAS CUCHILLAS DE CORTE PIVOTANTES EN EL SISTEMA PARA CORTAR EL ALAMBRE DESPUES DE QUE HA SIDO SOLDADO ENTRE DOS PUNTOS. EL SISTEMA ES, PREFERIBLEMENTE, PROGRAMABLE, PARA ACOMODAR UNA DIVERSIDAD DE CONFIGURACIONES DE APENDICES DE SOLDAR Y DE TERMINALES EN DISTINTOS PAQUETES DE CIRCUITOS.
ES511699A 1981-04-27 1982-04-26 Una instalacion y un procedimiento de soldadura de alcumbre Expired ES8308737A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25807481A 1981-04-27 1981-04-27

Publications (2)

Publication Number Publication Date
ES511699A0 ES511699A0 (es) 1983-10-01
ES8308737A1 true ES8308737A1 (es) 1983-10-01

Family

ID=22978989

Family Applications (1)

Application Number Title Priority Date Filing Date
ES511699A Expired ES8308737A1 (es) 1981-04-27 1982-04-26 Una instalacion y un procedimiento de soldadura de alcumbre

Country Status (4)

Country Link
EP (1) EP0064010A3 (es)
JP (1) JPS57181780A (es)
AU (1) AU8301582A (es)
ES (1) ES8308737A1 (es)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002084A (en) * 1959-01-28 1961-09-26 Union Carbide Corp Electric arc working
US3596044A (en) * 1969-03-03 1971-07-27 California Inst Of Techn Through insulation welding system
US3673681A (en) * 1969-04-01 1972-07-04 Inforex Electrical circuit board wiring
US3637972A (en) * 1970-04-01 1972-01-25 Gte Laboratories Inc Method and apparatus for forming an ohmic contact to high-resistivity silicon
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
US4179597A (en) * 1978-07-31 1979-12-18 Odetics, Inc. Continuous thru-wire welding machine

Also Published As

Publication number Publication date
EP0064010A3 (en) 1986-06-11
ES511699A0 (es) 1983-10-01
AU8301582A (en) 1982-11-04
EP0064010A2 (en) 1982-11-03
JPS57181780A (en) 1982-11-09

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