ES553263A0 - Procedimiento para la produccion de estructuras electricamente conductoras sobre materiales no conductores - Google Patents

Procedimiento para la produccion de estructuras electricamente conductoras sobre materiales no conductores

Info

Publication number
ES553263A0
ES553263A0 ES553263A ES553263A ES553263A0 ES 553263 A0 ES553263 A0 ES 553263A0 ES 553263 A ES553263 A ES 553263A ES 553263 A ES553263 A ES 553263A ES 553263 A0 ES553263 A0 ES 553263A0
Authority
ES
Spain
Prior art keywords
procedure
production
electrically conductive
conductive materials
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES553263A
Other languages
English (en)
Other versions
ES8704140A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of ES553263A0 publication Critical patent/ES553263A0/es
Publication of ES8704140A1 publication Critical patent/ES8704140A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)
ES553263A 1985-03-22 1986-03-21 Procedimiento para la produccion de estructuras electricamente conductoras sobre materiales no conductores Expired ES8704140A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853510982 DE3510982A1 (de) 1985-03-22 1985-03-22 Herstellung metallischer strukturen auf nichtleitern

Publications (2)

Publication Number Publication Date
ES553263A0 true ES553263A0 (es) 1987-04-01
ES8704140A1 ES8704140A1 (es) 1987-04-01

Family

ID=6266398

Family Applications (1)

Application Number Title Priority Date Filing Date
ES553263A Expired ES8704140A1 (es) 1985-03-22 1986-03-21 Procedimiento para la produccion de estructuras electricamente conductoras sobre materiales no conductores

Country Status (8)

Country Link
US (1) US4717587A (es)
EP (1) EP0195223B1 (es)
JP (1) JPS61221367A (es)
CN (1) CN1005240B (es)
AT (1) AT397328B (es)
CA (1) CA1282367C (es)
DE (2) DE3510982A1 (es)
ES (1) ES8704140A1 (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694592B2 (ja) * 1986-04-22 1994-11-24 日産化学工業株式会社 無電解メッキ法
DE3716235C2 (de) * 1987-05-12 1995-11-30 Atotech Deutschland Gmbh Herstellung von Polymer-Metallverbindungen durch Abscheidung in Glimmentladungszonen
DE3717955A1 (de) * 1987-05-25 1988-12-08 Schering Ag Verfahren zur herstellung von duennen molybdaen-filmen durch abscheidung in glimmentladungszonen
JPH0627327B2 (ja) * 1987-06-30 1994-04-13 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン Ｉｂ族金属の付着方法
DE3744062A1 (de) * 1987-12-22 1989-07-13 Schering Ag Verfahren zur herstellung fest haftender metallischer strukturen auf fluor-polymeren und thermoplastischen kunststoffen
DE3806587A1 (de) * 1988-02-26 1989-09-07 Schering Ag Verfahren zur herstellung fest haftender metallischer strukturen auf polyimid
JPH01301865A (ja) * 1988-05-30 1989-12-06 Nippon Telegr & Teleph Corp <Ntt> 薄膜成長方法および薄膜成長装置
DE3828211A1 (de) * 1988-08-16 1990-02-22 Schering Ag Verfahren zur haftfesten abscheidung von silberfilmen
DE3905417C2 (de) * 1989-02-22 1997-07-10 Sueddeutsche Kalkstickstoff Verfahren zur Herstellung von dünnen Niob- und/oder Nioboxidfilmen
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
EP0597670B1 (en) 1992-11-09 1998-02-18 Chugai Ings Co., Ltd Method of manufacturing electromagnetic wave shielding plastic molding
US5516458A (en) * 1994-08-30 1996-05-14 Eastman Kodak Company Coating composition used to prepare an electrically-conductive layer formed by a glow discharge process containing tin carboxylate, antimony alkoxide and film-forming binder
DE4438791C2 (de) * 1994-10-18 1996-09-05 Atotech Deutschland Gmbh Mit metallisierten Polyimidoberflächen versehenes Substrat
DE4438777A1 (de) * 1994-10-18 1996-05-02 Atotech Deutschland Gmbh Verfahren zur Herstellung elektrischer Schaltungsträger
JP3210675B2 (ja) * 1994-10-18 2001-09-17 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 金属層の析出方法
DE4438799A1 (de) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen
GB9717368D0 (en) * 1997-08-18 1997-10-22 Crowther Jonathan Cold plasma metallization
DE19745601C2 (de) * 1997-10-08 2001-07-12 Fraunhofer Ges Forschung Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung
DE19817388A1 (de) * 1998-04-20 1999-10-28 Atotech Deutschland Gmbh Verfahren zum Herstellen von metallisierten Substratmaterialien
JP4694771B2 (ja) * 2003-03-12 2011-06-08 財団法人国際科学振興財団 ポンプおよびポンプ部材の製造方法
CN1320163C (zh) * 2003-10-28 2007-06-06 尚志精密化学股份有限公司 电泳涂装上漆方法
US20070077193A1 (en) * 2005-10-03 2007-04-05 Te-Chu Chan Method of using plasma to disintegrate an iron-compounded material to form ferric oxide
DE102008011249A1 (de) * 2008-02-26 2009-09-10 Maschinenfabrik Reinhausen Gmbh Verfahren zur Herstellung strukturierter Oberflächen
JP5352024B1 (ja) * 2013-05-22 2013-11-27 田中貴金属工業株式会社 有機ニッケル化合物からなる化学蒸着用原料及び該化学蒸着用原料を用いた化学蒸着法
US11712667B2 (en) 2021-03-23 2023-08-01 Applied Membrane Technology, Inc. Anti-microbial metal coatings for filters

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2919207A (en) * 1956-01-24 1959-12-29 Max Braun Method of applying a ferromagnetic surface to a base utilizing iron carbonyl and oxygen
NL265528A (es) * 1960-06-02
JPS5847464B2 (ja) * 1975-05-12 1983-10-22 富士通株式会社 アルミニウムノキソウセイチヨウホウホウ
DD120473A1 (es) * 1975-10-02 1976-06-12
NL183380C (nl) * 1979-12-27 1988-10-03 Asahi Chemical Ind Van een patroon voorziene en een dikke laag omvattende geleiderconstructie en werkwijze voor het vervaardigen daarvan.
DE3362659D1 (en) * 1982-05-21 1986-04-30 Hewlett Packard Co Method of making printed circuits
US4606788A (en) * 1984-04-12 1986-08-19 Moran Peter L Methods of and apparatus for forming conductive patterns on a substrate

Also Published As

Publication number Publication date
CN86101886A (zh) 1986-11-19
AT397328B (de) 1994-03-25
EP0195223A3 (en) 1987-06-03
CN1005240B (zh) 1989-09-20
DE3510982A1 (de) 1986-09-25
ATA74086A (de) 1993-07-15
DE3680691D1 (de) 1991-09-12
EP0195223A2 (de) 1986-09-24
ES8704140A1 (es) 1987-04-01
US4717587A (en) 1988-01-05
CA1282367C (en) 1991-04-02
EP0195223B1 (de) 1991-08-07
JPS61221367A (ja) 1986-10-01

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20051118