ES537559A0 - Dispositivo para el deposito electrolitico en continuo y con elevada densidad de corriente, de una capa de un metal de recubrimiento - Google Patents

Dispositivo para el deposito electrolitico en continuo y con elevada densidad de corriente, de una capa de un metal de recubrimiento

Info

Publication number
ES537559A0
ES537559A0 ES537559A ES537559A ES537559A0 ES 537559 A0 ES537559 A0 ES 537559A0 ES 537559 A ES537559 A ES 537559A ES 537559 A ES537559 A ES 537559A ES 537559 A0 ES537559 A0 ES 537559A0
Authority
ES
Spain
Prior art keywords
layer
current density
high current
coating metal
continuous electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES537559A
Other languages
English (en)
Other versions
ES8604322A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ArcelorMittal Liege Upstream SA
Original Assignee
Cockerill Sambre SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Sambre SA filed Critical Cockerill Sambre SA
Publication of ES537559A0 publication Critical patent/ES537559A0/es
Publication of ES8604322A1 publication Critical patent/ES8604322A1/es
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0657Conducting rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
ES537559A 1983-11-11 1984-11-08 Dispositivo para el deposito electrolitico en continuo y con elevada densidad de corriente, de una capa de un metal de recubrimiento Expired ES8604322A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LU85086A LU85086A1 (fr) 1983-11-11 1983-11-11 Dispositif pour le depot electrolytique d'une couche d'un metal de recouvrement sur une bande metallique

Publications (2)

Publication Number Publication Date
ES537559A0 true ES537559A0 (es) 1986-01-16
ES8604322A1 ES8604322A1 (es) 1986-01-16

Family

ID=19730171

Family Applications (1)

Application Number Title Priority Date Filing Date
ES537559A Expired ES8604322A1 (es) 1983-11-11 1984-11-08 Dispositivo para el deposito electrolitico en continuo y con elevada densidad de corriente, de una capa de un metal de recubrimiento

Country Status (15)

Country Link
US (1) US4559123A (es)
JP (1) JPS60169592A (es)
AT (1) AT381959B (es)
BE (1) BE901001A (es)
CA (1) CA1239616A (es)
DE (1) DE3440457C2 (es)
DZ (1) DZ698A1 (es)
ES (1) ES8604322A1 (es)
FR (1) FR2554833B1 (es)
GB (1) GB2149820B (es)
IE (1) IE56097B1 (es)
IT (1) IT1177122B (es)
LU (1) LU85086A1 (es)
NL (1) NL8403361A (es)
SE (1) SE457802B (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661213A (en) * 1986-02-13 1987-04-28 Dorsett Terry E Electroplate to moving metal
DE3745088B4 (de) * 1986-07-05 2004-09-30 Luk Lamellen Und Kupplungsbau Beteiligungs Kg Einrichtung zum Dämpfen von Schwingungen
EP0362512B1 (de) * 1988-09-01 1993-05-19 Siemens Nixdorf Informationssysteme Aktiengesellschaft Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
BE1006106A3 (fr) * 1990-11-08 1994-05-17 Cockerill Rech & Dev Procede et dispositif de reglage de l'epaisseur d'un revetement depose par electrolyse sur une plaque ou feuille metallique.
GB2266727A (en) * 1992-04-27 1993-11-10 Kevin Oswald Laidler Conveyorised system for electroplating PCBs or plates e.g. with photoresist
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE10323660A1 (de) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten
DE102005038450A1 (de) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
EP1865094B1 (de) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem
US11459666B2 (en) 2017-12-15 2022-10-04 Sumitomo Electric Toyama Co., Ltd. Method for producing metal porous body, and plating apparatus
WO2019116632A1 (ja) * 2017-12-15 2019-06-20 富山住友電工株式会社 金属多孔体の製造方法、及びめっき処理装置
WO2019116633A1 (ja) * 2017-12-15 2019-06-20 富山住友電工株式会社 金属多孔体の製造方法、及びめっき処理装置
CN114481268A (zh) * 2022-02-09 2022-05-13 安徽奋进环保科技有限公司 一种钢带用电镀设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2271735A (en) * 1938-07-16 1942-02-03 Hanson Van Winkle Munning Co Machine for electroprocessing metal strip
US2446548A (en) * 1939-01-16 1948-08-10 John S Nachtman Contact roll construction
US2341157A (en) * 1939-01-16 1944-02-08 John S Nachtman Electroplating apparatus
SE335038B (es) * 1968-05-06 1971-05-10 Wennberg Ab C
US4183799A (en) * 1978-08-31 1980-01-15 Production Machinery Corporation Apparatus for plating a layer onto a metal strip
LU80496A1 (fr) * 1978-11-09 1980-06-05 Cockerill Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole

Also Published As

Publication number Publication date
SE8405345L (sv) 1985-05-12
GB2149820B (en) 1988-02-10
IT8423471A1 (it) 1986-05-07
DZ698A1 (fr) 2004-09-13
FR2554833B1 (fr) 1989-10-27
FR2554833A1 (fr) 1985-05-17
US4559123A (en) 1985-12-17
GB8427329D0 (en) 1984-12-05
IT1177122B (it) 1987-08-26
CA1239616A (en) 1988-07-26
DE3440457A1 (de) 1985-05-23
JPS60169592A (ja) 1985-09-03
NL8403361A (nl) 1985-06-03
BE901001A (fr) 1985-03-01
IE842888L (en) 1985-05-11
DE3440457C2 (de) 1994-11-03
ATA356884A (de) 1986-05-15
LU85086A1 (fr) 1985-07-17
GB2149820A (en) 1985-06-19
IT8423471A0 (it) 1984-11-07
ES8604322A1 (es) 1986-01-16
AT381959B (de) 1986-12-29
SE457802B (sv) 1989-01-30
IE56097B1 (en) 1991-04-10
SE8405345D0 (sv) 1984-10-25

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