ES526684A0 - Metodo para conexiones electricas de un semiconductor con un circuito electrico externo. - Google Patents

Metodo para conexiones electricas de un semiconductor con un circuito electrico externo.

Info

Publication number
ES526684A0
ES526684A0 ES526684A ES526684A ES526684A0 ES 526684 A0 ES526684 A0 ES 526684A0 ES 526684 A ES526684 A ES 526684A ES 526684 A ES526684 A ES 526684A ES 526684 A0 ES526684 A0 ES 526684A0
Authority
ES
Spain
Prior art keywords
semiconductor
electrical circuit
electrical connections
external
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES526684A
Other languages
English (en)
Other versions
ES8502573A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abbott Laboratories
Original Assignee
Abbott Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abbott Laboratories filed Critical Abbott Laboratories
Publication of ES526684A0 publication Critical patent/ES526684A0/es
Publication of ES8502573A1 publication Critical patent/ES8502573A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/414Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L24/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Immunology (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Pathology (AREA)
  • Geometry (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
ES526684A 1982-10-21 1983-10-21 Metodo para conexiones electricas de un semiconductor con un circuito electrico externo. Expired ES8502573A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43584582A 1982-10-21 1982-10-21

Publications (2)

Publication Number Publication Date
ES526684A0 true ES526684A0 (es) 1985-01-01
ES8502573A1 ES8502573A1 (es) 1985-01-01

Family

ID=23730047

Family Applications (2)

Application Number Title Priority Date Filing Date
ES526684A Expired ES8502573A1 (es) 1982-10-21 1983-10-21 Metodo para conexiones electricas de un semiconductor con un circuito electrico externo.
ES1984282913U Expired ES282913Y (es) 1982-10-21 1984-11-26 Dispositivo transistor de efecto de campo sensible a substancias quimicas

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES1984282913U Expired ES282913Y (es) 1982-10-21 1984-11-26 Dispositivo transistor de efecto de campo sensible a substancias quimicas

Country Status (5)

Country Link
EP (1) EP0116117B1 (es)
JP (1) JPS5994432A (es)
CA (1) CA1218468A (es)
DE (1) DE3380082D1 (es)
ES (2) ES8502573A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686492A (en) * 1985-03-04 1987-08-11 Tektronix, Inc. Impedance match connection using multiple layers of bond wires
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
US4889612A (en) * 1987-05-22 1989-12-26 Abbott Laboratories Ion-selective electrode having a non-metal sensing element
JPH05251513A (ja) * 1991-05-28 1993-09-28 Oki Electric Ind Co Ltd 半導体装置
GB9404090D0 (en) * 1994-03-03 1994-04-20 Neotronics Ltd Method of fabricating a gas sensor
US6117292A (en) * 1998-05-06 2000-09-12 Honeywell International Inc Sensor packaging having an integral electrode plug member
US6153070A (en) * 1998-05-07 2000-11-28 Honeywell Inc Sensor packaging using heat staking technique
JP4653703B2 (ja) * 2006-07-21 2011-03-16 株式会社堀場製作所 Fetセンサ
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EP0116117A3 (en) 1985-09-18
ES8502573A1 (es) 1985-01-01
JPH047589B2 (es) 1992-02-12
JPS5994432A (ja) 1984-05-31
EP0116117A2 (en) 1984-08-22
ES282913U (es) 1985-06-16
ES282913Y (es) 1986-04-01
DE3380082D1 (en) 1989-07-20
EP0116117B1 (en) 1989-06-14
CA1218468A (en) 1987-02-24

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