ES511040A0 - Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato. - Google Patents

Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato.

Info

Publication number
ES511040A0
ES511040A0 ES511040A ES511040A ES511040A0 ES 511040 A0 ES511040 A0 ES 511040A0 ES 511040 A ES511040 A ES 511040A ES 511040 A ES511040 A ES 511040A ES 511040 A0 ES511040 A0 ES 511040A0
Authority
ES
Spain
Prior art keywords
stano
deposition
copper
substrate
rhodium alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES511040A
Other languages
English (en)
Spanish (es)
Other versions
ES8306194A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Hooker Chemicals and Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals and Plastics Corp filed Critical Hooker Chemicals and Plastics Corp
Publication of ES8306194A1 publication Critical patent/ES8306194A1/es
Publication of ES511040A0 publication Critical patent/ES511040A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
ES511040A 1981-04-02 1982-04-01 Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato. Granted ES511040A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/250,373 US4347107A (en) 1981-04-02 1981-04-02 Electroplating tin and tin alloys and baths therefor

Publications (2)

Publication Number Publication Date
ES8306194A1 ES8306194A1 (es) 1983-05-01
ES511040A0 true ES511040A0 (es) 1983-05-01

Family

ID=22947464

Family Applications (1)

Application Number Title Priority Date Filing Date
ES511040A Granted ES511040A0 (es) 1981-04-02 1982-04-01 Un metodo para la deposicion de estano metalico brillante o de aleaciones de estano con cobre o rodio sobre un sustrato.

Country Status (13)

Country Link
US (1) US4347107A (US07202987-20070410-C00007.png)
JP (1) JPS57177987A (US07202987-20070410-C00007.png)
BE (1) BE892731A (US07202987-20070410-C00007.png)
BR (1) BR8201863A (US07202987-20070410-C00007.png)
CA (1) CA1184872A (US07202987-20070410-C00007.png)
DE (1) DE3211329A1 (US07202987-20070410-C00007.png)
ES (1) ES511040A0 (US07202987-20070410-C00007.png)
FR (1) FR2503192A1 (US07202987-20070410-C00007.png)
GB (1) GB2096175B (US07202987-20070410-C00007.png)
HK (1) HK67786A (US07202987-20070410-C00007.png)
IT (1) IT8248133A0 (US07202987-20070410-C00007.png)
NL (1) NL8201278A (US07202987-20070410-C00007.png)
SE (1) SE8201736L (US07202987-20070410-C00007.png)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405412A (en) * 1982-03-29 1983-09-20 Dart Industries Inc. Removal of copper contamination from tin plating baths
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
JPS62274087A (ja) * 1986-05-22 1987-11-28 Permelec Electrode Ltd 耐久性を有する電解用電極及びその製造方法
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
US6562220B2 (en) 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
US6251253B1 (en) 1999-03-19 2001-06-26 Technic, Inc. Metal alloy sulfate electroplating baths
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
US20020166774A1 (en) * 1999-12-10 2002-11-14 Shipley Company, L.L.C. Alloy composition and plating method
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
GB0106131D0 (en) * 2001-03-13 2001-05-02 Macdermid Plc Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
CN101243210A (zh) * 2005-07-11 2008-08-13 技术公司 具有最小化锡晶须生长性能或特性的锡电沉积物
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
WO2009061984A2 (en) * 2007-11-09 2009-05-14 Technic, Inc. Method of metallizing solar cell conductors by electroplating with minimal attack on underlying materials of construction
US8226807B2 (en) 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
US10072347B2 (en) 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616291A (en) * 1969-09-16 1971-10-26 Vulcan Materials Co Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method
US3905878A (en) * 1970-11-16 1975-09-16 Hyogo Prefectural Government Electrolyte for and method of bright electroplating of tin-lead alloy
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
SU445708A1 (ru) * 1972-11-04 1974-10-05 Предприятие П/Я А-7284 Электролит дл осаждени сплава олово-свинец
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead

Also Published As

Publication number Publication date
DE3211329A1 (de) 1982-10-14
ES8306194A1 (es) 1983-05-01
CA1184872A (en) 1985-04-02
SE8201736L (sv) 1982-10-03
GB2096175A (en) 1982-10-13
JPS57177987A (en) 1982-11-01
IT8248133A0 (it) 1982-03-31
FR2503192B1 (US07202987-20070410-C00007.png) 1984-11-30
FR2503192A1 (fr) 1982-10-08
HK67786A (en) 1986-09-18
BE892731A (fr) 1982-10-01
NL8201278A (nl) 1982-11-01
US4347107A (en) 1982-08-31
GB2096175B (en) 1984-06-13
BR8201863A (pt) 1983-03-08

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19991108