ES451614A1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
ES451614A1
ES451614A1 ES451614A ES451614A ES451614A1 ES 451614 A1 ES451614 A1 ES 451614A1 ES 451614 A ES451614 A ES 451614A ES 451614 A ES451614 A ES 451614A ES 451614 A1 ES451614 A1 ES 451614A1
Authority
ES
Spain
Prior art keywords
ring
edge
semiconductor
steps
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES451614A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES451614A1 publication Critical patent/ES451614A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Improvements in semiconductor components of the type provided with a semiconducting arrangement disposed inside a ring of elastic insulating material, with a semiconductor element having an edge and main faces, the ring being provided on its underside with sealing surfaces that adhere against the edge of the semiconductor element, and at least one feed electrode, characterized in that the inner sides of the ring and the edge of the semiconductor arrangement are provided with steps such that the outer diameter of the semiconductor arrangement and the inner diameter of the ring they decrease in one and the same direction, because the steps have surfaces that are at least approximately parallel and at least approximately perpendicular to the main surfaces and because at least the surfaces of the steps parallel to the main surfaces, make contact on the sides interiors of the ring and the edge of the semiconductor arrangement. (Machine-translation by Google Translate, not legally binding)
ES451614A 1975-09-19 1976-09-17 Semiconductor device Expired ES451614A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752541971 DE2541971A1 (en) 1975-09-19 1975-09-19 Electrical circuit component including semiconductor - which is in elastic insulating ring and has internal sealing surfaces resting on edge of semiconductor

Publications (1)

Publication Number Publication Date
ES451614A1 true ES451614A1 (en) 1977-07-16

Family

ID=5956967

Family Applications (1)

Application Number Title Priority Date Filing Date
ES451614A Expired ES451614A1 (en) 1975-09-19 1976-09-17 Semiconductor device

Country Status (4)

Country Link
JP (1) JPS5239375A (en)
DE (1) DE2541971A1 (en)
ES (1) ES451614A1 (en)
IT (1) IT1070808B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029664U (en) * 1983-08-02 1985-02-28 大塚　興二 binder
DE3327992A1 (en) * 1983-08-03 1985-02-21 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
JP3550243B2 (en) * 1996-01-30 2004-08-04 株式会社東芝 Internal pressure welding type semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091665U (en) * 1973-12-27 1975-08-02

Also Published As

Publication number Publication date
JPS5239375A (en) 1977-03-26
DE2541971A1 (en) 1977-03-24
IT1070808B (en) 1985-04-02
JPS563670B2 (en) 1981-01-26

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