JPS563670B2 - - Google Patents
Info
- Publication number
- JPS563670B2 JPS563670B2 JP11238976A JP11238976A JPS563670B2 JP S563670 B2 JPS563670 B2 JP S563670B2 JP 11238976 A JP11238976 A JP 11238976A JP 11238976 A JP11238976 A JP 11238976A JP S563670 B2 JPS563670 B2 JP S563670B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752541971 DE2541971A1 (en) | 1975-09-19 | 1975-09-19 | Electrical circuit component including semiconductor - which is in elastic insulating ring and has internal sealing surfaces resting on edge of semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5239375A JPS5239375A (en) | 1977-03-26 |
JPS563670B2 true JPS563670B2 (en) | 1981-01-26 |
Family
ID=5956967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11238976A Granted JPS5239375A (en) | 1975-09-19 | 1976-09-18 | Semiconductor device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5239375A (en) |
DE (1) | DE2541971A1 (en) |
ES (1) | ES451614A1 (en) |
IT (1) | IT1070808B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6029664U (en) * | 1983-08-02 | 1985-02-28 | 大塚 興二 | binder |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3327992A1 (en) * | 1983-08-03 | 1985-02-21 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Semiconductor device |
JP3550243B2 (en) * | 1996-01-30 | 2004-08-04 | 株式会社東芝 | Internal pressure welding type semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5091665U (en) * | 1973-12-27 | 1975-08-02 |
-
1975
- 1975-09-19 DE DE19752541971 patent/DE2541971A1/en not_active Withdrawn
-
1976
- 1976-09-16 IT IT2724676A patent/IT1070808B/en active
- 1976-09-17 ES ES451614A patent/ES451614A1/en not_active Expired
- 1976-09-18 JP JP11238976A patent/JPS5239375A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6029664U (en) * | 1983-08-02 | 1985-02-28 | 大塚 興二 | binder |
Also Published As
Publication number | Publication date |
---|---|
IT1070808B (en) | 1985-04-02 |
DE2541971A1 (en) | 1977-03-24 |
JPS5239375A (en) | 1977-03-26 |
ES451614A1 (en) | 1977-07-16 |