JPS563670B2 - - Google Patents

Info

Publication number
JPS563670B2
JPS563670B2 JP11238976A JP11238976A JPS563670B2 JP S563670 B2 JPS563670 B2 JP S563670B2 JP 11238976 A JP11238976 A JP 11238976A JP 11238976 A JP11238976 A JP 11238976A JP S563670 B2 JPS563670 B2 JP S563670B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11238976A
Other languages
Japanese (ja)
Other versions
JPS5239375A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5239375A publication Critical patent/JPS5239375A/en
Publication of JPS563670B2 publication Critical patent/JPS563670B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP11238976A 1975-09-19 1976-09-18 Semiconductor device Granted JPS5239375A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752541971 DE2541971A1 (en) 1975-09-19 1975-09-19 Electrical circuit component including semiconductor - which is in elastic insulating ring and has internal sealing surfaces resting on edge of semiconductor

Publications (2)

Publication Number Publication Date
JPS5239375A JPS5239375A (en) 1977-03-26
JPS563670B2 true JPS563670B2 (en) 1981-01-26

Family

ID=5956967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11238976A Granted JPS5239375A (en) 1975-09-19 1976-09-18 Semiconductor device

Country Status (4)

Country Link
JP (1) JPS5239375A (en)
DE (1) DE2541971A1 (en)
ES (1) ES451614A1 (en)
IT (1) IT1070808B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029664U (en) * 1983-08-02 1985-02-28 大塚　興二 binder

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3327992A1 (en) * 1983-08-03 1985-02-21 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
JP3550243B2 (en) * 1996-01-30 2004-08-04 株式会社東芝 Internal pressure welding type semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091665U (en) * 1973-12-27 1975-08-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029664U (en) * 1983-08-02 1985-02-28 大塚　興二 binder

Also Published As

Publication number Publication date
IT1070808B (en) 1985-04-02
JPS5239375A (en) 1977-03-26
DE2541971A1 (en) 1977-03-24
ES451614A1 (en) 1977-07-16

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