ES392679A1 - Electrolytic gold plating solutions and methods for using same - Google Patents

Electrolytic gold plating solutions and methods for using same

Info

Publication number
ES392679A1
ES392679A1 ES392679A ES392679A ES392679A1 ES 392679 A1 ES392679 A1 ES 392679A1 ES 392679 A ES392679 A ES 392679A ES 392679 A ES392679 A ES 392679A ES 392679 A1 ES392679 A1 ES 392679A1
Authority
ES
Spain
Prior art keywords
gold plating
methods
same
plating solutions
electrolytic gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES392679A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sel Rex Corp
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Publication of ES392679A1 publication Critical patent/ES392679A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Procedure for the deposition of uniform gold plating, characterized in that it comprises electrolyzing a cyanide-gold plating electrolytic solution containing a gold cyanide complex, from 1 to 140 mg of thallium per liter of solution and sufficient conductive materials and buffer effect to provide a pH in said solution of at least 6.5. (Machine-translation by Google Translate, not legally binding)
ES392679A 1970-06-29 1971-06-26 Electrolytic gold plating solutions and methods for using same Expired ES392679A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5096970A 1970-06-29 1970-06-29

Publications (1)

Publication Number Publication Date
ES392679A1 true ES392679A1 (en) 1974-07-16

Family

ID=21968602

Family Applications (1)

Application Number Title Priority Date Filing Date
ES392679A Expired ES392679A1 (en) 1970-06-29 1971-06-26 Electrolytic gold plating solutions and methods for using same

Country Status (13)

Country Link
US (1) US3644184A (en)
JP (1) JPS5534235B1 (en)
AT (1) AT313663B (en)
BE (1) BE768886A (en)
CA (1) CA929481A (en)
CH (1) CH525963A (en)
DE (1) DE2131815A1 (en)
DK (1) DK133791B (en)
ES (1) ES392679A1 (en)
FR (1) FR2096799B1 (en)
GB (1) GB1349796A (en)
NL (1) NL149861B (en)
SE (1) SE360888B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833488A (en) * 1971-08-20 1974-09-03 Auric Corp Gold electroplating baths and process
US4435253A (en) * 1983-01-28 1984-03-06 Omi International Corporation Gold sulphite electroplating solutions and methods
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts
DE3905705A1 (en) * 1989-02-24 1990-08-30 Degussa BATHROOM FOR GALVANIC DEPOSITION OF FINE GOLD COATINGS
US5755947A (en) * 1996-01-31 1998-05-26 The United States Of America As Represented By The Secretary Of The Navy Adhesion enhancement for underplating problem
CN102517614B (en) * 2011-12-20 2014-11-19 安徽华东光电技术研究所 Plating solution formula for electroplating gold on aluminum-silicon alloy and electroplating method thereof

Also Published As

Publication number Publication date
FR2096799A1 (en) 1972-02-25
AT313663B (en) 1974-01-15
CA929481A (en) 1973-07-03
FR2096799B1 (en) 1976-02-06
DE2131815A1 (en) 1972-01-05
DK133791B (en) 1976-07-19
NL149861B (en) 1976-06-15
GB1349796A (en) 1974-04-10
BE768886A (en) 1971-11-03
JPS5534235B1 (en) 1980-09-05
NL7108893A (en) 1971-12-31
DK133791C (en) 1976-12-06
SE360888B (en) 1973-10-08
US3644184A (en) 1972-02-22
CH525963A (en) 1972-07-31

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