ES379888A1 - Procedimiento para revestir piezas constructivas electricasy electronicas con masas a base de organopolisiloxanos. - Google Patents

Procedimiento para revestir piezas constructivas electricasy electronicas con masas a base de organopolisiloxanos.

Info

Publication number
ES379888A1
ES379888A1 ES379888A ES379888A ES379888A1 ES 379888 A1 ES379888 A1 ES 379888A1 ES 379888 A ES379888 A ES 379888A ES 379888 A ES379888 A ES 379888A ES 379888 A1 ES379888 A1 ES 379888A1
Authority
ES
Spain
Prior art keywords
harden
masses
form flexible
flexible structures
organopolysiloxanes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES379888A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of ES379888A1 publication Critical patent/ES379888A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
ES379888A 1969-05-23 1970-05-21 Procedimiento para revestir piezas constructivas electricasy electronicas con masas a base de organopolisiloxanos. Expired ES379888A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691926575 DE1926575A1 (de) 1969-05-23 1969-05-23 Verfahren zum Umhuellen von elektrischen und elektronischen Bauteilen

Publications (1)

Publication Number Publication Date
ES379888A1 true ES379888A1 (es) 1972-09-16

Family

ID=5735099

Family Applications (1)

Application Number Title Priority Date Filing Date
ES379888A Expired ES379888A1 (es) 1969-05-23 1970-05-21 Procedimiento para revestir piezas constructivas electricasy electronicas con masas a base de organopolisiloxanos.

Country Status (11)

Country Link
JP (1) JPS5328471B1 (es)
AT (1) AT307044B (es)
BE (1) BE750805A (es)
CA (1) CA953869A (es)
CH (1) CH559412A5 (es)
DE (1) DE1926575A1 (es)
ES (1) ES379888A1 (es)
FR (1) FR2044817B1 (es)
GB (1) GB1309299A (es)
NO (1) NO128134B (es)
SE (1) SE368293B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2746296C3 (de) * 1977-10-13 1980-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kabelgarnitur für kunststoffisolierte Starkstromkabel
US4352119A (en) * 1979-09-17 1982-09-28 Beckman Instruments, Inc. Electrical device and method for particle entrapment device for an electrical component
US4582556A (en) * 1982-11-22 1986-04-15 Olin Corporation Adhesion primers for encapsulating epoxies
US4525422A (en) * 1982-11-22 1985-06-25 Olin Corporation Adhesion primers for encapsulating epoxies
US4521469A (en) * 1982-11-22 1985-06-04 Olin Corporation Casing for electronic components
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
US20130189475A1 (en) * 2012-01-19 2013-07-25 Raytheon Company Polysiloxane skinned fleece

Also Published As

Publication number Publication date
FR2044817B1 (es) 1973-07-13
CA953869A (en) 1974-09-03
AT307044B (de) 1973-05-10
FR2044817A1 (es) 1971-02-26
BE750805A (fr) 1970-11-23
NO128134B (es) 1973-10-01
GB1309299A (en) 1973-03-07
CH559412A5 (es) 1975-02-28
DE1926575A1 (de) 1970-11-26
JPS5328471B1 (es) 1978-08-15
SE368293B (es) 1974-06-24

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