ES365811A1 - Un dispositivo semiconductor. - Google Patents

Un dispositivo semiconductor.

Info

Publication number
ES365811A1
ES365811A1 ES365811A ES365811A ES365811A1 ES 365811 A1 ES365811 A1 ES 365811A1 ES 365811 A ES365811 A ES 365811A ES 365811 A ES365811 A ES 365811A ES 365811 A1 ES365811 A1 ES 365811A1
Authority
ES
Spain
Prior art keywords
plunger
wall
dimples
spring
tools
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES365811A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of ES365811A1 publication Critical patent/ES365811A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacture Of Switches (AREA)
  • Die Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
ES365811A 1968-04-10 1969-04-09 Un dispositivo semiconductor. Expired ES365811A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72006268A 1968-04-10 1968-04-10

Publications (1)

Publication Number Publication Date
ES365811A1 true ES365811A1 (es) 1971-03-16

Family

ID=24892482

Family Applications (1)

Application Number Title Priority Date Filing Date
ES365811A Expired ES365811A1 (es) 1968-04-10 1969-04-09 Un dispositivo semiconductor.

Country Status (8)

Country Link
BE (1) BE731255A (enrdf_load_html_response)
CH (1) CH503371A (enrdf_load_html_response)
DE (1) DE1916699A1 (enrdf_load_html_response)
ES (1) ES365811A1 (enrdf_load_html_response)
FR (1) FR2005999A1 (enrdf_load_html_response)
GB (1) GB1258008A (enrdf_load_html_response)
IE (1) IE32747B1 (enrdf_load_html_response)
NL (1) NL6905444A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149448U (enrdf_load_html_response) * 1984-09-03 1986-04-03
JPH0642337Y2 (ja) * 1984-07-05 1994-11-02 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
NL6905444A (enrdf_load_html_response) 1969-10-14
IE32747B1 (en) 1973-11-14
BE731255A (enrdf_load_html_response) 1969-09-15
DE1916699A1 (de) 1969-10-30
CH503371A (de) 1971-02-15
IE32747L (en) 1969-10-10
GB1258008A (enrdf_load_html_response) 1971-12-22
FR2005999A1 (enrdf_load_html_response) 1969-12-19

Similar Documents

Publication Publication Date Title
DK108561C (da) Tørbarbermaskine med mindst én skæreplade, der kan forskydes aksialt mod en fjederkraft.
ES365811A1 (es) Un dispositivo semiconductor.
CN205651251U (zh) 一种定位设备
GB1342578A (en) Swaging apparatus
AT250462B (de) Gehäuse, insbesondere Mikrophongehäuse mit beweglichem Fuß
ES428149A1 (es) Perfeccionamientos en maquinas estampadoras de bastidor vertical movil.
US2666266A (en) Device for positioning articles by coaction with apertures or recesses therein
US2605842A (en) Strip centering device for punch presses
US2777184A (en) Device for making structural clay tile panels
US3325161A (en) Static locating arbor
US936832A (en) Table for punch-presses.
JPS5789534A (en) Fitting device for parts
SU1608040A1 (ru) Механизм базировани и зажима заготовок в деревообрабатывающем станке
US1830488A (en) Machine and method of flattening flanges of banjo frames
KOLTSOV Bending of a circular plate on a combined base under nonaxisymmetric load(Bending of circular plates with combined base under nonaxisymmetric load taking into account base surface structure)
CH381978A (de) Kinokamera, deren Auslöse- und Abschaltvorgang über eine Federschnappvorrichtung gesteuert werden
PANASIUK et al. A contact problem of elasticity theory for a plate with a circular hole(Elastic plate with circular hole, solving contact problem in elasticity theory with integrodifferential equation)
GB775866A (en) Improvements in resilient stops or buffers and other resilient devices
ES294021A1 (es) Dispositivo de fabricación de haces de radiadores
US2999919A (en) Vibrator devices
SU365235A1 (ru) ПАТЕЙТНО-ТаШИЕ!:»*! БИБЛИОТЕКА
IT1023316B (it) Perfezionamento nelle tastiere in particolare di tipo alea numerico
GB1115773A (en) A lapping machine
EFIMTSOV et al. Excitation of multispan plates in a random acoustical field(Random vibrations of infinite-span plate on rigid supports during cylindrical bending)
MAKAROV Equation of the motion of a sphere in an ideal medium in the case of radial deformation of the sphere(Radially deforming sphere dynamic behavior during translational motion in infinite incompressible static medium)