ES349930A1 - Un procedimiento de disposicion electrolitica de un deposi-to de niquel semibrillante. - Google Patents

Un procedimiento de disposicion electrolitica de un deposi-to de niquel semibrillante.

Info

Publication number
ES349930A1
ES349930A1 ES349930A ES349930A ES349930A1 ES 349930 A1 ES349930 A1 ES 349930A1 ES 349930 A ES349930 A ES 349930A ES 349930 A ES349930 A ES 349930A ES 349930 A1 ES349930 A1 ES 349930A1
Authority
ES
Spain
Prior art keywords
copper
aldehyde
bath
alkyl
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES349930A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Publication of ES349930A1 publication Critical patent/ES349930A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
ES349930A 1967-01-30 1968-01-30 Un procedimiento de disposicion electrolitica de un deposi-to de niquel semibrillante. Expired ES349930A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61236267A 1967-01-30 1967-01-30

Publications (1)

Publication Number Publication Date
ES349930A1 true ES349930A1 (es) 1969-11-16

Family

ID=24452840

Family Applications (1)

Application Number Title Priority Date Filing Date
ES349930A Expired ES349930A1 (es) 1967-01-30 1968-01-30 Un procedimiento de disposicion electrolitica de un deposi-to de niquel semibrillante.

Country Status (8)

Country Link
US (1) US3486989A (de)
CH (1) CH536880A (de)
DE (1) DE1696082B2 (de)
ES (1) ES349930A1 (de)
FR (1) FR1553326A (de)
GB (1) GB1168225A (de)
NL (1) NL6801370A (de)
SE (1) SE341649B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2450527C2 (de) * 1974-10-24 1982-09-16 Henkel KGaA, 4000 Düsseldorf Wäßriges, saures Bad zur galvanischen Abscheidung von halbglänzenden Nickelüberzügen
NZ235983A (en) * 1989-11-08 1993-01-27 Novo Nordisk As Process for hydrolysis of resins in lignocellulosic pulp using enzymes simultaneously with peroxy bleaching; ctmp fluff-pulp and absorbent articles produced therefrom
TWI291322B (en) * 2003-05-20 2007-12-11 Laird Technologies Inc Method for manufacturing an EMI shielding element

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA476452A (en) * 1951-08-28 Alan Hoffman Raymond Electroplating
US2085754A (en) * 1934-07-30 1937-07-06 Du Pont Addition agents for nickel plating
GB525848A (en) * 1939-03-02 1940-09-05 Udylite Corp Improvements in or relating to the electro-deposition of nickel
US2795540A (en) * 1954-04-05 1957-06-11 Udylite Res Corp Electrodeposition of nickel

Also Published As

Publication number Publication date
CH536880A (de) 1973-05-15
DE1696082A1 (de) 1971-11-18
SE341649B (de) 1972-01-10
NL6801370A (de) 1968-07-31
FR1553326A (de) 1969-01-10
DE1696082B2 (de) 1976-06-24
GB1168225A (en) 1969-10-22
US3486989A (en) 1969-12-30

Similar Documents

Publication Publication Date Title
GB1232582A (de)
US2961384A (en) Electrolytic polymerization of phenol
ES349930A1 (es) Un procedimiento de disposicion electrolitica de un deposi-to de niquel semibrillante.
US2828252A (en) Electrodeposition of bright zinc, copper, or nickel
ES384095A1 (es) Un procedimiento para depositar electroliticamente un re- vestimiento de cromo sobre un metal de base.
US3530050A (en) Electrodeposition of palladium
US3891520A (en) Acid, galvanic zinc bath
ES475996A1 (es) Un metodo de producir depositos electroliticos de zinc bri- llantes.
ES470940A1 (es) Un procedimiento mejorado para la preparacion de un depositoelectrolitico
US3778359A (en) Zinc electroplating baths and process
US3795592A (en) Nickel electroplating composition and process
ES346650A1 (es) Un procedimiento de producir depositos de cinc brillantes.
US3296104A (en) Electrodeposition of zinc from pyrophosphate solutions
US3429790A (en) Acidic tin depositing bath
US3414491A (en) Electrodeposition of nickel
US4417957A (en) Aqueous acid plating bath and brightener mixture for producing semibright to bright electrodeposits of tin
US3806431A (en) Zinc electroplating bath having low cyanide content
ES320950A1 (es) Un procedimiento deformar por chapeado electrolitico un deposito de niquel semibrillante.
US2048594A (en) Electrodepositing metals
US3041254A (en) Nickel plating
ES401329A1 (es) Un procedimiento para depositar por galvanoplastia una pla-ca de niquel exenta de azufre y semibrillante sobre un metalbase.
ES332766A1 (es) Un procedimiento para depositar por galvanoplastia un deposito de niquel semibrillante.
US3075898A (en) Electrodeposition of nickel
GB1202827A (en) Improvements in or relating to nickel plating
US2744063A (en) Electrodeposition of tin-antimonycopper alloys