ES2974357A1 - Die bonding device and die bonding method - Google Patents

Abstract

Disclosed are a die bonding device and a die bonding method. The die bonding device comprises a bearing platform, wafer discs, and swing arms; the bearing platform is configured to bear a target substrate, the bearing platform is provided with a first driving mechanism, and the first driving mechanism is configured to drive the target substrate, which is placed on the bearing platform, to move; there are a plurality of wafer discs, each wafer disc is configured to place a wafer, and a wafer placed on the at least one wafer disc is different from those placed on other wafer discs; there are a plurality of swing arms, each swing arm corresponds to one wafer disc, and the plurality of swing arms respectively correspond to a plurality of wafer positions in one wafer position unit group of the target substrate; each swing arm has a second driving mechanism, and each second driving mechanism is configured to drive a corresponding swing arm to move; and the plurality of swing arms are configured to respectively take wafers at corresponding wafer discs, and to sequentially transfer, at a die bonding station, the wafers to corresponding wafer positions of a wafer position unit group located at the die bonding station on the target substrate.

Description

DESCRIPTION

Chip bonding equipment and chip bonding methods

References to related requests

The PATENT CLAIMS were filed on June 18, 2021 with the State Intellectual Property Administration of the People's Republic of China with application number 202110680675.5, in which all rights and interests of the invention "Union Equipment" are claimed. Chips and Chip Joining Methods", which is incorporated by reference in the PATENT CLAIMS.

Fields

The patent claims relate generally to the field of semiconductor processes and equipment, and more specifically to Chip Bonding Equipment and Chip Bonding Methods.

Background

Chip bonding machine is a key equipment in the LED assembly production line, whose functions are to transfer and install the LED chips on the wafer to the installation position of the LED chips on the LED board (for example, a Mini LED display panel or a Micro LED display panel). Usually, the LED chips that need to be transferred and installed on the LED board include red LED chips, green LED chips and blue LED chips.

The existing chip bonding machine used to transfer and install red LED chips, green LED chips and blue LED chips on LED boards includes carrier platform, wafer disks and swing arms. Among them, the carrier platform is used to place the motherboard on which the LED chips will be installed. There are multiple chip positions on the motherboard that are usually arranged in a matrix, and each position is used to place an LED chip. These can be divided into three types, which are respectively used to place red LED chips, green LED chips and blue LED chips while the adjacent positions are used to place a chip unit consisting of red LED chip, green LED chip and blue LED chip. The three wafer discs are used to respectively place wafers with red LED chips, green LED chips and blue LED chips. The swing arms are equipped with a driving mechanism, which can drive the swing arms to swing between the wafer disk with red LED chips, the wafer disk with green LED chips, the wafer disk with blue LED chips and the carrier platform. . The swing arms allow to take the red LED chip when in the wafer disk position with the red LED chip, the green LED chip when in the wafer disk position with the green LED chip and the green LED chip when in the position of the wafer disk with the blue LED chip. When the swing arms are in the chip bonding station, the red LED chip, the green LED chip or the blue LED chip can be transferred to the motherboard of the chip. The laptop platform also has a drive mechanism, which is used to drive the movement of the motherboard. After a chip position on the motherboard is transferred and installed with an LED chip, the drive mechanism drives the motherboard to move causing the next chip position on the motherboard to move to the bonding station. chips, waiting for the LED chip to be transferred and installed at this chip position.

To optimize the chip bonding efficiency, the above-mentioned existing chip bonding machine generally performs the chip bonding process as follows: the driving mechanism first drives the swing arms to swing between the wafer with the red LED chip. and the carrier platform, then transfer all the red LED chips and install them on the wafer positions to place the red LED chips on the motherboard on the carrier platform; the number of wafer positions required to place red LED chips on the motherboard is assumed to be n (assuming that in the initial state of the motherboard, none of the wafer positions required to place red LED chips are on the station chip bonding), during this process, the motherboard must be moved by the drive mechanism n times. After that, the driving mechanism makes the swing arms swing between the wafer with green LED chips and the carrier platform, transferring and installing all the green LED chips at the same time to the chip positions to place the green LED chips on the board. base of the carrier platform. During this process, the base plate must be moved by the drive mechanism n times. After that, the driving mechanism makes the swing arms swing between the wafer with blue LED chips and the carrier platform, transferring and installing all the green LED chips at the same time to the chip positions to place the blue LED chips on the board. base of the carrier platform. During this process, the base plate must be moved by the drive mechanism n times.

General description

The claims of the patent refer to a chip bonding equipment for assembling wafers on a target motherboard, which is composed of a carrier platform, wafer disks and swing arms; among them, the carrier platform is configured to carry the target motherboard and equipped with a first driving mechanism, which is configured to cause the target motherboard placed on the carrier platform to move, making each chip position included in the Wafer drive on the target motherboard is moved to the chip bonding station; the wafer disks are multiple and each of them is configured to place a wafer, and the wafer placed on at least one wafer disk is different from other wafer disks; the number of swing arms is multiple, each swing arm corresponds to a wafer disk, and multiple swing arms respectively correspond to several chip positions in a unit of chip positions on the target motherboard; Each swing arm has a second drive mechanism, which is configured to drive the corresponding swing arm moving in sequence from the wafer disk corresponding to the swing arm to the chip bonding station, and from the chip bonding station to the chip disk. wafer corresponding to the swing arm; and each of the swing arms is configured to pick up a chip on the corresponding wafer disk, and to transfer the chips in order to the corresponding chip positions in units of chip positions of the chip bonding station on the motherboard aim.

In some solutions, the number of wafer disks is three, and which are respectively configured to place wafers with red LED chips, wafers with green LED chips and wafers with blue LED chips.

In some solutions, an image collection device is provided in the chip bonding station, which is configured to collect an image of the target motherboard.

In some solutions, the chip bonding equipment further includes a control mechanism configured to control multiple second drive mechanisms, which control each swing arm to reach corresponding chip positions in chip position units located in the bonding station. of target motherboard chips.

In some solutions, the number of swing arms is three, which are responsible for picking up wafers from three wafer disks.

The patent claims also refer to chip bonding methods, including:

Determine the corresponding relationship between the wafer disk, swing arms and wafer position on the target motherboard drives;

The control system controls the movement of the carrier platform until the chip bonding camera confirms that the units of chip positions on the target motherboard match the image preset by the system;

Control the selected swing arm to pick up the chips from the corresponding wafer disk and transfer and install the picked chips in order to the corresponding chip position in the chip position unit on the target motherboard in the chip bonding station; and

The control system controls the movement of the carrier platform so that each chip position included in the next unit of chip positions on the target motherboard arrives at the chip bonding station, and repeats the previous step until all Chip positions in the unit set on the target motherboard are transferred and installed with chips.

In some solutions, each chip position unit includes three chip positions; These positions require the transfer and assembly of red LED chips, green LED chips, and blue LED chips, respectively.

In certain solutions, the chip bonding method also includes:

After moving the target motherboard, detect whether each chip position in the chip position unit on the target motherboard reaches the chip bonding station.

In some solutions, whether each chip position in the detection target motherboard chip positions unit reaches the chip binding station is determined based on the image of the target motherboard collected by the collection device. of images arranged in the chip bonding station.

Some solutions of the present claim provide a chip bonding equipment, including a carrier, which is equipped with a first driving mechanism, by which the target motherboard placed on the carrier platform can be moved, so that the different units of chip positions on the target motherboard are transferred to the chip bonding station. The number of swing arms is multiple. Each swing arm corresponds to one wafer disk and one chip position in a unit of chip positions on the target motherboard. Each swing arm can move to the corresponding wafer disk by the second drive, take the chip from the disk move to the chip bonding station on the carrier platform under the driving of the second drive, transfer and install the chip to the position of chip corresponding to the swing arm on the target board and in the chip position unit located in the chip bonding station. For multiple wafer disks, at least one wafer placed on the wafer disk must be different from the others, that is, the wafers on the wafer disks must be at least two different chips. The number of types of wafers placed on multiple wafer disks and the type of wafers placed on each wafer disk can be configured as needed, so that each swing arm can pick up wafers on its corresponding wafer disk, and the picked wafer be consistent with the type of wafer that should be placed in the chip position corresponding to the swing arm. In this case, if each chip included in a chip position unit on the target motherboard is located on the chip bonding station, multiple swing arms can pick up each chip on the corresponding wafer disk, and transfer and install it correspondingly on the corresponding position of the wafer in the unit of chip positions in the chip bonding station. In this process, there is no need to move the target base plate by the first driving mechanism. After finishing the transfer and installation of the chips in each chip position included in a chip position unit on the target motherboard, it is necessary to move the target motherboard through the first drive mechanism to move the chips to the position of chip in the chip bonding station of each chip position included in the next chip position unit, then the corresponding chips are transferred and installed using multiple swing arms to transfer and install the wafer in the chip position unit. The above process is repeated to complete the transfer and installation of chips in all chip positions on the target motherboard. Therefore, on the one hand, there is no need to perform the operation of transferring and installing the next type of chips to the chip positions on the target motherboard after transferring and installing all the chips of one type to the corresponding chip positions. on the target motherboard at once; Also, during this process, the number of times and displacement of the first driving mechanism moving the target base plate are greatly reduced, which can achieve higher efficiency.

Some solutions of the present claims provide a chip attachment method that takes a chip position unit on the target motherboard as a unit and transfers and installs the chip corresponding to each chip position unit into a chip position unit. At the same time, during the process, there is no need to move the target motherboard; After transferring and installing the chips from each chip position into a chip position unit, the target motherboard is moved making each chip position included in the next chip position unit on the target motherboard be in the station. of chip bonding, then the chips corresponding to each chip position are transferred and installed in the next unit of chip positions, this process is repeated until all the chip positions on the target motherboard are transferred and installed with chips . The chip bonding method provided by some solutions of the present claim, on the one hand, does not need to transfer and install all wafers of one type to the corresponding wafer positions on the target motherboard at once, and then perform the operation of transferring and installing the next wafer into the corresponding wafer positions on the target motherboard; On the other hand, the displacement number of the target motherboard is reduced, which can achieve higher efficiency.

BRIEF DESCRIPTIVE MEMORY OF THE ATTACHED FIGURES

The attached incorporated figures constitute part of this specification, which show solutions consistent with the claim and, together with the specification, serve to explain the principles of the claim.

To explain more clearly the technical solutions of the present claim, the figures that should be used in the present claim will be briefly presented below. Obviously, for those with ordinary experience in the technical field, they can obtain other attached figures based on the present ones without exercising creative work.

Figure 1 is a structural diagram of the chip bonding equipment provided by a solution of the present claim;

Figure 2 is a structural diagram of the swing arm and wafer disk in the chip bonding equipment shown in Figure 1;

Figure 3 is a top view schematic of the chip bonding equipment shown in Figure 1; and

Figure 4 is a flow chart of the chip bonding method provided by a solution of the present claim.

DETAILED DESCRIPTIVE MEMORY

To clarify the objective, technical solutions and advantages of the present claims, the technical solutions herein will be clearly and completely described below together with the figures attached in the solutions of the present claim. Obviously, the solutions described are some, but not all, solutions of the present claim. According to the solutions of the claims, all other solutions obtained by ordinary technicians in this field without doing creative work are within the scope of protection of this claim.

(1) Chip bonding equipment implementation solution.

In certain solutions, chip bonding equipment is used to install chips onto a target motherboard. As shown in Figures 1-3, the chip bonding equipment includes a carrier platform (not shown in the figures), a wafer disk 20 and a swing arm 30.

The carrier platform is used to load the target base plate (not shown in the Figure), and is configured with the first driving mechanism (not shown in the Figure), which is used to drive the movement of the target base plate placed on the carrier platform, causing each chip arrangement included in the chip position unit on the target motherboard to move to the chip bonding station. In some solutions, the first drive mechanism may move the target motherboard so that different units of chip layouts on the target motherboard are at the chip bonding station.

In some solutions, the first drive mechanism includes two subdrive mechanisms, which are respectively used to drive the target base plate to move in two mutually perpendicular directions in the horizontal plane; Through the two subdrive mechanisms, the first drive mechanism can make the target motherboard move in any direction in the horizontal plane, so that each chip arrangement included in the chip positions unit on the target motherboard moves to the chip bonding station.

The number of wafer disks 20 are multiple and each is used to place wafers and there must be at least one wafer disk 20 on which wafers other than other wafer disks 20 are placed. In some solutions, each wafer disk Wafer 20 is equipped with an ejector pin mechanism, which is used to lift the chips on the wafers placed on the wafer disk 20 so that the lifted chip is picked up when the swing arm 30 moves to the wafer disk 20.

The number of swing arms 30 are multiple, and each corresponds to a wafer disk 20, and multiple swing arms 30 respectively correspond to various chip positions in the chip position unit on the target motherboard. Each swing arm 30 has a second drive mechanism 31. Each second drive mechanism 31 is used to drive move the corresponding wafer disk 20 of the swing arm 30 (automatic swing arm 30) to the chip bonding station in sequence, and the station of automatic chip bonding to the wafer disk 20 corresponding to the swing arm 30. Multiple swing arms 30 are used to respectively pick up chips from the corresponding wafer disks 20 and to transfer in the chip bonding station in sequence the chips to the positions corresponding chip positions of a unit of chip positions on the target motherboard. In some solutions, in addition to the second drive mechanism 31, each swing arm 30 also has another drive mechanism for driving the swing arms 30 to move in the vertical direction; When the swing arm 30 reaches the wafer disk 20 to pick up the chip, this driving mechanism drives the swing arm 30 to move in a vertical direction, and transfers the chip lifted by the ejection pin mechanism to the swing arm 30, picking up so the chip.

The chip bonding equipment of some solutions includes a carrier platform, and a first driving mechanism is provided on the carrier platform. Through the first driving mechanism, the target base plate placed on the carrier platform can move, so that different groups of wafer bit units on the target base plate can move. Move to the chip bonding station. The number of swing arms 30 are multiple. Each swing arm 30 corresponds to a wafer disk 20 and a chip position in a unit of chip positions on the target motherboard. Each swing arm 30 can move to the wafer disk 20 corresponding to the swing arm 30 by the second driving mechanism to pick up the chip on the wafer disk 20, and move to the chip attachment station on the carrier platform under the driving of the second drive mechanism, transfer and install the chip to the chip position corresponding to the swing arm 30 on the target plate and to the chip position unit located in the chip bonding station. For multiple wafer disks 20, at least one wafer placed on the wafer disk 20 must be different from the others, that is, the wafers on the wafer disks 20 must be at least two different chips. The number of types of wafers placed on multiple wafer disks 20 and the type of wafers placed on each wafer disk 20 can be configured as necessary, so that each swing arm 30 can pick up wafers on its corresponding wafer disk, and the picked wafer is consistent with the type of wafer that should be placed in the chip position corresponding to the swing arm 30. In this case, if each chip included in a unit of chip positions on the target motherboard is located in the station of chip bonding, multiple swing arms 30 can pick up each chip on the corresponding wafer disk 20, and transfer and install it correspondingly on the corresponding position of the wafer in the chip position unit in the chip bonding station. In this process, there is no need to move the target base plate by the first driving mechanism. After finishing the transfer and installation of the chips in each chip position included in a chip position unit on the target motherboard, it is necessary to move the target motherboard through the first drive mechanism to move the chips to the position of chip in the chip bonding station of each chip position included in the next chip position unit, then the corresponding chips are transferred and installed using multiple swing arms 30 to transfer and install the wafer in the chip position unit. The above process is repeated to complete the transfer and installation of chips in all chip positions on the target motherboard. Therefore, on the one hand, there is no need to perform the operation of transferring and installing the next type of chips to the chip positions on the target motherboard after transferring and installing all the chips of one type to the corresponding chip positions. on the target motherboard at once; Also, during this process, the number of times the first drive mechanism moves the target base plate is greatly reduced, which can achieve higher efficiency.

In some solutions, the number of wafer disks 20 is three, and which are respectively configured to place wafers with red LED chips, wafers with green LED chips and wafers with blue LED chips.

A unit of chip positions on the target motherboard has three chip positions, which need to be transferred and installed, respectively, red LED chip, green LED chip and blue LED chip.

The number of swing arms 30 is three, corresponding respectively to the three wafer disks 20 and the three chip positions included in a unit of chip positions on the target motherboard. When the chip positions included in a unit of chip positions on the target motherboard are located at the chip bonding station, the first swing arm 30 is used to pick up the red LED chip at the location of the wafer disk 20 with the red LED chip and in the chip bonding station transfer and install the picked red LED chip in the corresponding chip position to place such chip in the chip position unit on the target motherboard; the second swing arm 30 is used to pick up the green LED chip at the location of the wafer disk 20 with the green LED chip and at the chip bonding station transfer and install the picked up green LED chip at the corresponding chip position to place such chip in the chip positions unit on the target motherboard; the third swing arm 30 is used to pick up the blue LED chip at the location of the wafer disk 20 with the blue LED chip and at the chip bonding station transfer and install the picked up blue LED chip at the corresponding chip position to place such chip in the chip positions unit on the target motherboard;

In some solutions, an image collection device 40 is provided in the chip bonding station, which is configured to collect an image of the target motherboard. The image of the target motherboard collected by the image collection device 40 can be used to determine whether the moved target motherboard meets the requirement that the chip positions included in the next unit of chip positions be in the collecting station. chip bonding after the first drive has driven the target motherboard. If it has not met, it is necessary to further adjust the position of the target base plate, for example, drive the target base plate with the first drive mechanism to keep it moving. If it has complied, multiple swing arms 30 can transfer and install the chips corresponding to each chip position in the chip position unit located in the chip bonding station.

In some solutions, the images collected by the image collection device 40 include not only photographs, but also dynamic videos, and may also be real-time continuous video tracking information.

The principles and processes of the chip bonding process performed by the chip bonding equipment in certain solutions will be exemplified below with reference to the attached figures.

Step 1: The first oscillating arm 30 moves driven by its corresponding second drive mechanism to the first wafer disk 20 corresponding to the first oscillating arm 30. The wafer with red LED chip is placed on the wafer disk 20. The first swing arm 30 picks up the red LED chip from the first wafer disk 20.

Step 2: The second drive mechanism drives the first swing arm 30 to move to the chip bonding station; At this time, the target motherboard placed on the carrier platform has been driven and moved by the first driving mechanism to a position of the chip bonding station in a unit of chip positions on the target motherboard.

Step 3: In the chip bonding station, the first swing arm 30 installs the red LED chip in the required position to place the red LED chip in the chip positions unit in the chip bonding station on the target motherboard .

Step 4: The second drive mechanism drives the first swing arm 30 to move from the chip bonding station to the first wafer disk 20 to pick up the red LED chip for use.

Step 5: The second oscillating arm 30 moves driven by its corresponding second drive mechanism to the second wafer disk 20 corresponding to the first oscillating arm 30. The wafer with green LED chip is placed on the wafer disk 20. The second swing arm 30 picks up the green LED chip from the second wafer disk 20.

Step 6: The second drive mechanism drives the second swing arm 30 to move to the chip bonding station on the carrier platform.

Step 7: In the chip bonding station, the second swing arm 30 transfers and installs the green LED chip in the required position to place the green LED chip in the chip positions unit in the chip bonding station on the board target base.

Step 8: The second drive mechanism drives the second swing arm 30 to move from the chip bonding station to the second wafer disk 20 to pick up the green LED chip for use.

Step 9: The third oscillating arm 30 moves driven by its corresponding second drive mechanism to the third wafer disk 20 corresponding to the third oscillating arm 30. The wafer with blue LED chip is placed on the wafer disk 20. The third swing arm 30 picks up the blue LED chip from the third wafer disk 20.

Step 10: The second drive mechanism drives the third swing arm 30 to move to the chip bonding station on the carrier platform.

Step 11: In the chip bonding station, the third swing arm 30 transfers and installs the blue LED chip at the required position to place the blue LED chip in the chip positions unit in the chip bonding station on the board target base.

Step 12: The second drive mechanism drives the third swing arm 30 to move from the chip bonding station to the third wafer disk 20 to pick up the blue LED chip for use.

Step 13: The first drive mechanism moves by driving the target motherboard, so that each chip position included in the next unit of chip positions on the target motherboard is in the chip bonding station.

Step 14: The image collection device located in the chip bonding station collects the images of the target motherboard, based on which, it is determined whether each chip position included in the next unit of chip positions on the board target base is at the chip bonding station. If it is on the chip bonding station, it means that the target motherboard has been moved into place. If it is not in the chip bonding station, it means that the target motherboard has not been moved into place and further adjustments need to be made to the position of the target motherboard. The first drive can make additional adjustments to the position of the target base plate.

Step 15: Repeat the above steps starting from step 1, to transfer and install the corresponding red LED chips, green LED chips and blue LED chips in each chip position to the next unit of chip positions on the target motherboard . Likewise, the above steps are repeated until the corresponding LED chips are transferred and installed in all chip position units on the target motherboard.

All of the above describes the principles and processes of chip bonding performed by the chip bonding equipment in certain solutions based on the example that the three swing arms 30 respectively pick up the red LED chip, the green LED chip and the LED chip. blue of the three wafer disks 20 and install them respectively in the three chip positions in the chip positions unit on the target motherboard. This description is only exemplary, and various adaptive changes and adjustments may be made to other different solutions. In particular, the above steps can be performed simultaneously to increase speed. For example, when the first swing arm is on the way to the chip bonding station, the second swing arm may be picking chip from a wafer disk, and the third swing arm may be on the way back from the chip bonding station. bonding chips to wafer disk. In this way, the steps are performed at the same time to improve speed.

In some solutions, to improve process efficiency, the chip bonding equipment also includes a control mechanism for controlling multiple second drive mechanisms 31. Such control mechanism controls the travel of the two swing arms 30 to the chip bonding station. chips under the driving of the second drive mechanism 31.

In summary, the chip bonding equipment of some solutions in the claims includes a carrier platform, and the first driving mechanism is provided on the carrier platform. Through the first driving mechanism, the target motherboard placed on the carrier platform can be moved so that different units of chip positions on the target motherboard are moved to the chip bonding station. The number of swing arms are multiples 30. Each swing arm 30 corresponds to a wafer disk 20 and a chip position in a unit of chip positions on the target motherboard. Each swing arm 30 can move to the wafer disk 20 corresponding to the swing arm 30 by the second driving mechanism to pick up the chip on the wafer disk 20, and move to the chip attachment station on the carrier platform under the driving of the second drive mechanism, transfer and install the chip to the chip position corresponding to the swing arm 30 on the target plate and to the chip position unit located in the chip bonding station. For multiple wafer disks 20, at least one wafer placed on the wafer disk 20 must be different from the others, that is, the wafers on the wafer disks 20 must be at least two different chips. The number of types of wafers placed on multiple wafer disks 20 and the type of wafers placed on each wafer disk 20 can be configured as necessary, so that each swing arm 30 can pick up wafers on its corresponding wafer disk, and the picked wafer is consistent with the type of wafer that should be placed in the chip position corresponding to the swing arm 30. In this case, if each chip included in a unit of chip positions on the target motherboard is located in the station of chip bonding, multiple swing arms 30 can pick up each chip on the corresponding wafer disk 20, and transfer and install it correspondingly on the corresponding position of the wafer in the chip position unit in the chip bonding station. In this process, there is no need to move the target base plate by the first driving mechanism. After finishing the transfer and installation of the chips in each chip position included in a chip position unit on the target motherboard, it is necessary to move the target motherboard through the first drive mechanism to move the chips to the position of chip in the chip bonding station of each chip position included in the next chip position unit, then the corresponding chips are transferred and installed using multiple swing arms 30 to transfer and install the wafer in the chip position unit. The above process is repeated to complete the transfer and installation of chips in all chip positions on the target motherboard. Therefore, on the one hand, there is no need to perform the operation of transferring and installing the next type of chips to the chip positions on the target motherboard after transferring and installing all the chips of one type to the corresponding chip positions. on the target motherboard at once; Also, during this process, the number of times the first drive mechanism moves the target base plate is greatly reduced, which can achieve higher efficiency.

(2) Chip bonding method implementation solution

In some solutions, as shown in Figure 4, chip bonding methods include:

51. Obtain the information of the type of chips that should be placed in various chip positions in the chip positions unit on the target motherboard;

52. Select the wafer disk 20 on which the corresponding chip of multiple wafer disks 20 and swing arms 30 is placed, and the swing arm 30 corresponding to the wafer disk 20;

53. Control the selected swing arm 30 to pick up the chips from the corresponding wafer disk 20 and move in sequence to the chip bonding station, at the same time, transfer and install the picked chips in order to the corresponding chip position on the drive chip positions on the target motherboard at the chip bonding station; and

S4. Move the target motherboard, so that each chip position included in the next unit of chip positions on the target motherboard reaches the chip binding station, and repeat the above step S3 until all chip positions in The mentioned unit on the target motherboard be transferred and installed with chips.

In some solutions, the target motherboard typically includes several units of chip positions, and each of them includes several chip positions, and each chip position has preset requirements for the type of chips to be placed, which is usually determined by the type and parameters of the motherboard. Furthermore, generally several chip positions of each chip position unit require the placement of different chips. In step S1, each chip position unit includes three chip positions; These positions require the transfer and assembly of red LED chips, green LED chips, and blue LED chips, respectively.

In some solutions, for different types of target motherboards, the number of chip positions included in each chip position unit is different. Some may have two while others may have three, and even four or more.

In some solutions, as mentioned above, each chip position unit includes three chip positions; Red LED chips, green LED chips and blue LED chips should be placed in these positions, respectively. In this case, three wafer disks 20 and three swing arms 30 are selected, and wafers with red LED chips, wafers with green LED chips and wafers with blue LED chips are placed on the wafer disks 20, respectively. Likewise, the selected swing arms 30 must be those corresponding to the three wafer disks 20, and the selected swing arms 30 corresponding to the wafer disks 20 can pick up the corresponding type of chips on the wafer disk 20.

In some solutions, the first swing arm 30 picks up the red LED chip from the corresponding wafer disk 20, moves it to the chip bonding station and transfers and installs the red LED chip at the chip position to which the LED chip is to be placed. red on the chip positions drive on the chip bonding station and on the target motherboard. After the first swing arm 30, the second swing arm picks up the green LED chip from the corresponding wafer disk 20, moves it to the chip bonding station and transfers and installs the green LED chip at the chip position to be placed. The green LED chip in the chip positions unit in the chip bonding station and on the target motherboard. After the second swing arm 30, the third swing arm picks up the blue LED chip from the corresponding wafer disk 20, moves it to the chip bonding station, and transfers and installs the blue LED chip at the chip position to be placed. The blue LED chip in the chip positions unit in the chip bonding station and on the target motherboard.

In step S3, the transfer and installation of the chips of all chip positions in the previous chip position unit on the target motherboard have been completed. In step S4, through the movement of the target motherboard, all the chip positions in the chip position unit on the target motherboard of the chip unit station have been transferred, and the chip positions have been moved. chip in the next drive chip positions on the target motherboard to the chip drive station; then, step S3 is repeated to complete the transfer and installation of the chips of each chip position into this chip position unit on the target motherboard. Therefore, through moving the target motherboard and repeating step S3, chips can be transferred and installed at all chip positions on the target motherboard.

The chip attachment method of some solutions of the present claims takes a chip position unit on the target motherboard as a unit and transfers and installs the chip corresponding to each chip position unit into a chip position unit a At the same time, during the process, it is not necessary to move the target motherboard; After transferring and installing the chips from each chip position into a chip position unit, the target motherboard is moved making each chip position included in the next chip position unit on the target motherboard be in the station. of chip bonding, then the chips corresponding to each chip position are transferred and installed in the next unit of chip positions, this process is repeated until all the chip positions on the target motherboard are transferred and installed with chips . The chip bonding method provided by some solutions of the present claim, on the one hand, does not need to transfer and install all wafers of one type to the corresponding wafer positions on the target motherboard at once, and then perform the operation of transferring and installing the next wafer into the corresponding wafer positions on the target motherboard; On the other hand, the displacement number of the target motherboard is reduced, which can achieve higher efficiency.

It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or sequence between these entities or operations. operations. Furthermore, the terms "includes", "includes" or any other variant thereof are intended to cover a non-exclusive inclusion, so that the process, method, article or equipment that includes a series of elements includes not only those elements, but also those elements not expressly listed, or elements inherent to the process, method, article or equipment. Without further limitations, an element defined by the structure "includes a..." does not exclude the presence of additional identical elements in a process, method, article or equipment that includes the indicated element.

The above descriptions are only specific solutions to the present claims, which allow those skilled in the art to understand or implement them. Various modifications to these solutions will be readily obvious to those skilled in the art, and the general principles defined in this article can be carried out in other solutions without departing from the spirit or scope of the present claims. Therefore, the present claims should not be limited to the solutions shown in this article, but should be given the broadest scope consistent with the principles and novel features disclosed in this article.

Claims (8)

1. A chip bonding equipment, used to install chips on a target motherboard, the chip bonding equipment includes carrier platform, wafer disks and swing arms; The aforementioned carrier platform is configured to load the target motherboard, and is equipped with the first driving mechanism, which is used to drive the movement of the target motherboard placed on the carrier platform, making each chip arrangement included in the chip positions drive on target motherboard move to chip bonding station; The number of wafer disks are multiple and each one is used to place wafers and there must be at least one wafer disk in which different wafers are placed from other wafer disks; The number of swing arms are multiple, and each corresponds to a wafer disk, and multiple swing arms respectively correspond to several chip positions in the chip position unit on the target motherboard; Each swing arm has a second drive mechanism, and each is configured to drive the corresponding swing arm to move in sequence from the wafer disk corresponding to the swing arm to the chip bonding station, and from the chip bonding station. chips to the wafer disk corresponding to the swing arm; and Multiple swing arms are configured to respectively pick up chips on the corresponding wafer disks and to transfer into the chip bonding station in sequence the corresponding chips in the chip position unit located on the chip bonding station of the target motherboard. . 2. As the chip bonding equipment described in claim 1, the number of wafer disks is three, and which are respectively configured to place wafers with red LED chips, wafers with green LED chips and wafers with green LED chips. Blue LEDs. 3. As the chip bonding equipment described in claim 1 or 2, an image collection device is provided in the chip bonding station, which is configured to collect an image of the target motherboard. 4. As the chip joining equipment described in any of claims 1-3, further including a control mechanism configured to control multiple second drive mechanisms, which control each swing arm to reach the corresponding chip positions in units of chip positions located on the chip bonding station of the target motherboard. 5. A chip bonding method, including: Obtain the information of the type of chips that should be placed in various chip positions in the chip positions unit on the target motherboard; Select the wafer disk on which the corresponding chip of multiple wafer disks and swing arms is placed, and the swing arm corresponding to the wafer disk; Control the selected swing arm to pick up the chips from the corresponding wafer disk and move in sequence to the chip bonding station, at the same time, transfer and install the picked chips in order to the corresponding chip position on the chip position unit. chip on target motherboard at chip bonding station; and Move the target motherboard, so that each chip position included in the next unit of chip positions on the target motherboard reaches the chip bonding station, and repeat the above step until all chip positions on the preset unit on the target motherboard are transferred and installed with chips. 6. As the chip joining method in claim 5, each chip position unit includes three chip positions; Red LED chips, green LED chips and blue LED chips should be transferred and installed at these positions, respectively. 7. As the chip bonding method in claim 5 or 6 also includes: After moving the target motherboard, detect whether each chip position in the unit of chip positions on the target motherboard reaches the bonding station chip. 8. As any of the chip bonding methods described in claims 5-7, based on the images of the target motherboard collected by the image collection device arranged on the chip bonding station, it can be determined whether Each chip position in the detection target motherboard chip positions unit arrives at the chip bonding station.