ES2969889T3 - Smart card with docking frame antenna - Google Patents

Abstract

Smart card (SC) having a card body (CB) and a conductive coupling frame antenna (CFA) that extends as a closed loop circuit around a periphery of the card body, and also extends towards inside so that two portions of the coupling frame antenna are closely adjacent. each other, with a space between them. The space may extend from a periphery of the card body to a position corresponding to a module antenna (MA) of a transponder chip module (TCM) disposed in the card body, and may function as a slot (S). in a coupling frame (CF). An antenna portion of the coupling frame may be arranged to surround the ISO position of the transponder chip module in the card body. A coupling frame antenna (CFA) can be incorporated into a module ribbon (MT) for a transponder chip module (TCM). (Automatic translation with Google Translate, without legal value)

Description

DESCRIPTION

Smart card with docking frame antenna

TECHNICAL FIELD

The present description relates to smart cards (or payment cards, secure documents, access control cards, electronic tickets, small form factor tags, data carriers, mobile payment devices and the like), which function, at least , in contactless mode (ISO 14443 and NFC/ISO 15693). The smart card may comprise a card body (CB) made of plastic or metal or a combination thereof, and a transponder chip module (TCM) comprising a radio frequency identification chip (Radio Frequency Identification, RFID) dual interface and a module antenna (Module, Antenna, MA).

BACKGROUND

A dual interface (DI or DIF) smart card (SC) can generally comprise:

an antenna module (AM), or a transponder chip module (TCM) or an RFID module;

a card body (CB) having layers of plastic or metal, or combinations thereof; and an amplification antenna (Booster Antenna, BA).

The "AM" antenna module may generally comprise a "DI" RFID chip (bare, unpackaged silicon die) or a chip module (a die with a lead frame, interposer coil, carrier or the like), either of which may be referred to as "CM" (Module Chip, CM), mounted on an "MT" module tape (Module Tape, MT). The RFID chip (CM) can be mounted on a tape module (MT), which typically has 6 or 8 contact pads (CP) to interface with a contact reader in a contact mode (ISO 7816) .

An "MA" module antenna can be provided on the MT module ribbon to implement a contactless interface, such as that of ISO 14443 and NFC/ISO 15693. Contact pads "CP" can be provided on the MT module tape to implement a contact interface, such as that of ISO 7816. Contact pads (CP) may or may not have perforations. The MT module ribbon may comprise a pattern of interconnections (conductive paths and pads) to which the CM RFID chip and CP contact pads may be connected.

The MA module antenna can be connected indirectly through some of the interconnects to the CM chip, or it can be connected directly to the Bond Pads (BP) on the CM RFID chip. The module antenna (MA) may comprise several turns of wire, such as 112 micron diameter insulated wire. Reference may be made to US 6378774 (2002, Toppan), for example, FIGS. 12A, B thereof. Alternatively, the module antenna (MA) may comprise a planar chemically etched module antenna MA with planar paths surrounding the chip (CM). Reference may be made to US 8100337 (2012, SPS), for example, FIG. 3 of the same.

The "AM" antenna module may comprise a module antenna (MA) which may comprise a planar antenna structure (AS) that is chemically etched (chemical or laser etched, from a sheet on the tape). of MT module) so that it has a number of routes separated by spaces. In general, with laser engraving, the path spacing can be made smaller (for example, 25 gm) than with chemical engraving (for example, 80 or 100 gm).

The module antenna (MA) may comprise multi-layer planar antenna structures, each connected clockwise or counterclockwise, or a combination thereof. The module antenna (MA) can also be connected to a silicon capacitor in series or parallel to regulate the tuning of the resonant circuit.

A module antenna (MA) connected to an RFID chip (CM) can be called a "transponder". In general, such a transponder is a "passive" transponder that does not have its own power source (e.g. battery), but rather collects power from an external reader (interrogator).

The activation distance of an antenna module (AM) that has a chemically etched module antenna (MA), without an amplification antenna (BA) on the board body (CB), can be only a few millimeters. The activation distance of an antenna module (AM) having a laser etched antenna structure (LES), without an amplification antenna (BA) on the board body (CB) can be 15 to 20mm. The activation distance of the antenna module (AM) with an amplification antenna (BA) on the card body (CB) is usually four centimeters to comply with ISO and EMV standards. Adding a silicon capacitor connected in parallel or series can improve performance.

Activation and read/write distances of at least a few centimeters (cm) are desirable. However, conventional antenna modules (AM) may require an amplification antenna (BA) in a card body (CB) to achieve these distances. As described in this invention, antenna modules (AM) incorporating a laser etched antenna structure (LES) can operate without an amplification antenna (BA) in the card body (CB), and can be referred to as transponder chip modules (TCM) The transponder chip module (TCM) can be called the transponder Integrated Circuit (IC) module. The antenna module (AM) or transponder chip module (TCM) may be generally rectangular, have four sides, and measure approximately 8 mm x 11 mm for a 6-pin module and 11 mm x 13 mm for an 8-pin module. Alternatively, the transponder chip module (TCM) may be round, elliptical or have a non-rectangular shape. When operating in a contactless mode, the Transponder Chip Module (TCM) can be powered by Radio Frequency (RF) from an external RFID reader, and can also communicate via RF with the external RFID reader. A "wake-up distance" may refer to a distance at which the TCM transponder chip module can collect enough power from the RFID reader to begin operation. Similarly, a “read/write distance” may refer to a distance at which the TCM transponder chip module can reliably communicate with the external RFID reader.

The CB card body, which may be referred to as a substrate or inlay substrate, may generally comprise one or more layers of material such as polyvinyl chloride (PVC), polycarbonate (PC), polyethylene terephthalate modified with glycol (Polyethylene Terephtalate Glycol-modified, PET-G), copolyester, Teslin™, synthetic paper, paper and the like.

The CB card body may be generally rectangular, measure approximately 54 mm x 86 mm (see ISO/IEC 7810), have a thickness of approximately 300 μm when called an inlay substrate or 760 μm when called a smart card. The CB card body is usually significantly larger (like 30 times) than the AM antenna module.

The amplification antenna BA may generally comprise a relatively large winding which may be referred to as a Card Antenna (CA) component (or portion) having a number of turns and located in a peripheral area of the card body CB. , and a relatively small Coil Coupler (CC) component (or portion) that has a number of turns and is located in a mating area of the CB card body corresponding to the location of the AM antenna module. The AC card antenna and DC coupler coil may comprise a cable mounted on (embedded in) the body of the CB card through the use of an ultrasonic tool comprising a sonotrode and a capillary. See, for example, US 6698089 and US 6233818. The cable may be a non-insulated, insulated or self-adhesive cable, having an exemplary diameter in the range of about 50 to 112 pm.

Some examples of smart cards (SC) with amplification antennas (BA) can be found in the following patents:

US 8474726, granted July 2, 2013;

US 8366009, granted February 5, 2013; and

US 9033250, granted May 15, 2015;

Metallized smart cards can have a metal faceplate or layer that extends over almost the entire area of the card (except for an opening for the antenna module (AM)), and some smart cards can be made largely with metal. The presence of such a metal layer or mass on the smart card may tend to attenuate contactless communication (for example, as in ISO 14443, ISO 15693) between the smart card and an external reader. The touch pads themselves may also tend to dampen non-contact communication. Therefore, metallized smart cards can often operate only in a contact mode (for example, those of the ISO 7816 standard).

In the following documents, there could be a description of aluminum foil composite cards and metal cards:

US 20090169776 (2009-07-02; Herslow); and

US 20110189620 (2011 -08-04; Herslow)

In the following documents, there could be descriptions of shielding layers and the like:

US 8261997 (2012-09-11; Gebhart/NXP);

EP1854222 (NXP); and

EP 02063489 (Tyco)

US Patent 13744686, filed January 18, 2013, (now US 20130126622, May 23, 2013) describes shielding compensation and coupling improvement in metallized smart cards. As described therein (FIG. 4A), a conductive "Compensation Loop" (CL) may be provided behind the amplification antenna BA, which extends around the periphery of the card body CB. The compensation loop CL may be an open loop having two free ends and a gap (the "gap") between them. The compensation loop CL may be made with a copper coating.

Some other patents of interest may include the following:

US 8393547, granted 03-12-2013 (Kiekhaefer et al.; Perfect Plastic); and

US 20140166762 published on 2014-06-19 (Herslow).

Some terms used in this invention may include:

-"skin depth" refers to the "skin effect", which is the tendency of an alternating electric current (AC) to distribute within a conductor such that the current density is greatest near the surface of the conductor. A "film depth" or minimum thickness to conduct current can be defined for a given material at a given frequency. For example, at 13.56 MHz, the skin depth for copper can be approximately 18 gm (17.7047 gm). For smart cards, 13.56 MHz is a frequency of interest. "Transparency" refers to the ability of electromagnetic radiation to pass through a material. A non-transparency threshold (or the ability to interact with RF) may be a fraction of the skin depth for the metal layer in question at a given frequency of interest. For example, the non-transparency threshold for copper at 13.56 MHz may be one-tenth the film depth, or approximately 1.7 gm.

US Patent 20150136858 A1 (Finn et al.), issued as US 9390364, describes various smart cards with docking frames. Among others, a smart card is described in Figs. 6A and 6B having a coupling frame formed by multiple turns of cable embedded in the body of the card. The ends of the cables are connected to each other. The docking frame partially surrounds the opening for the transponder chip module.

US 20040069856 A1 (Held et al.) describes a card with a coupling circuit. The coupling circuit consists of two windings, a primary winding that follows the edge of the card and a secondary winding that surrounds the transponder. The primary winding and secondary winding are connected to each other, forming a closed conductor loop arrangement. The primary winding has one turn, while the secondary winding has three turns.

Other smart cards are known from US 6190942 B1, US 2011/063184 A1, US 2013/075477 A1 or US 2015/097040 A1.

SUMMARY

A general object of the invention is to provide improved techniques for improving the coupling of smart cards with a contactless reader.

Some other objects may include alleviating performance restrictions on the amplification antenna (BA) of the smart card (SC), including the possibility of completely eliminating the amplification antenna (BA).

The invention generally relates to a smart card with a coupling frame antenna as defined in claim 1. Advantageous implementations of the smart card are defined according to the dependent claims.

According to some embodiments (examples) of the invention, generally a Coupling Frame Antenna (CFA), which is a closed loop antenna circuit with a continuous metallic path, having a rectangular geometry with a slit (S) and a module opening (MO), is arranged to surround and overlap with the module antenna (MA) in a transponder chip module (TCM) or antenna module (AM) . A transaction card has a continuous metal path with a slit (S) that extends from the Module Opening (MO) to the periphery of the card body to function as a frame antenna. coupling (CFA). The coupling frame antenna (CFA) may have a path width in the module opening equal in dimension to the width of the paths that form the module antenna in the transponder chip module (TCM) or the antenna module. (A.M). The metallic path or path may be made of chemically etched aluminum, copper, have a metallized surface or similar. At the periphery of the card body, the width of the metallic path is not less than the skin depth of the metal at the frequency of interest. The metal can be replaced with a conductive medium such as silver paste, conductive ink or the like that require a greater path width in order to meet the conditions for adequate current conduction. The coupling frame antenna (CFA) resembles a single-turn antenna as a closed-loop circuit. The coupling frame antenna (CFA) may start at the center of the card body, extending to the right, forming a conductive path along the perimeter of the card body, forming a loop or module that opens into a internal position on the left side of the card body, to surround and overlap a module antenna (MA) of a transponder chip module (TCM) or antenna module (AM), creating a slit by extending the path or path of returning to the periphery of the card body, and completing the docking frame antenna structure by returning to the home position within the center of the card body.

A switch can be provided to disable the antenna circuit by connecting its terminals through the slot (S) of the coupling frame antenna (CFA). A capacitor can be connected across the slit to increase performance. The transponder chip module (TCM) may comprise a laser-etched antenna structure (LES), a chemical-etched antenna structure (CES), and a perforation-free contact pad (CP) arrangement. A coupling frame antenna (CFA) can be incorporated into the ribbon module (MT) for a transponder chip module (TCM).

According to some embodiments (examples) of the invention, generally, a smart card (SC) may comprise an electrically conductive path or path, referred to in this invention as "coupling frame antenna" (CFA) arranged on the card body (CB). ) around at least two sides (or 180°) of a transponder chip module (TCM) to be in close proximity to the module antenna (MA) on the transponder chip module (TCM). The coupling frame antenna (CFA) may at least partially surround the transponder chip module (TCM), such as surrounding two sides (or 180°) or three sides (or 270°) of the transponder chip module (TCM), particularly the antenna structure (AS) of the transponder chip module (TCM). This includes "at least" two sides and "at least" three sides. The coupling frame (CF) may almost completely surround the transponder chip module (TCM), such as all four sides (or 360°) thereof, minus a slit (S). The slit (S) can be very small, for example 50 gm. (Such small (50 gm) slit (S) may correspond to a fraction of a percentage of the perimeter of the transponder chip module (TCM) or the module opening (MO), or less than 1°).

The module antenna (MA) may comprise an antenna structure (AS) etched from a conductive layer or sheet to have a double-ended conductor that is arranged in a spiral pattern having a number (such as 10-14). of laps (which can be called "courses"), separated by spaces. An end portion of an antenna structure (AS) may also comprise a quarter, half or three-quarter turn (fractional turns).

A coupling frame antenna (CFA) surrounding all four sides (almost 360°) of the transponder chip module (TCM) may be provided with a module opening (MO) to accommodate the transponder chip module (TCM), and of a slit (or slot, cut or gap) that extends from the module opening (MO) to the perimeter of the coupling frame antenna (CFA). A switch (SW) can be incorporated into the body of the card for connection through the slot (S) of the coupling frame antenna (CFA) to short circuit the function of concentrating current distribution Surface parasites around the module opening.

Generally, the coupling frame antenna (CFA) may comprise a conductive layer, a metallized layer, a metallic layer or overlapping metallic layers, each layer at least partially surrounding the transponder chip module (TCM) and (together, in the case of two or more conductive layers) covers at least a substantial area of the card body (CB) for coupling with an external contactless reader.

The coupling frame antenna (CFA) may comprise one or more continuous paths or paths of a conductive material in the form of a perforated metal mesh or a cable structure metal mesh, or other continuous surface (including embedded ribbon conductor). to prevent electrostatic discharge (ESD) problems.

A coupling frame antenna (CFA) with a cutout (module aperture MO) to accept the transponder chip module (TCM) may be positioned in or on the body of the card such that it partially surrounds in close proximity a structure of laser etched antenna (LES) or chemically etched antenna structure (CES) of the transponder chip module (TCM).

The coupling frame antennas described in this invention can be formed from paths or trajectories of various metals (such as copper, aluminum (aluminum), brass, titanium, tungsten, stainless steel, silver, graphene, silver nanowires , conductive carbon ink) and may be in the form of a flat cable or the like, which could be hot stamped onto a card path.

The transponder chip module (TCM) may comprise an RFID (radio frequency identification) chip or chip module (either of which may be referred to as "CM") and an etched (typically flat) antenna structure formed as a rectangular spiral. plane having a number (such as 10-14) of conducting paths separated by spaces. With the use of laser engraving, spacing between adjacent runs can be less than 100 pm, less than 75 pm, less than 50 pm, and less than 25 pm. The routes can typically have a width of 100 pm. Laser etching of an antenna structure or structures under and around a chip (CM) mounted on a tape module (MT) can improve the overall electrical parameters of the antenna.

A coupling frame antenna (CFA), which surrounds and at least partially overlaps a transponder chip module (TCM) and which resides substantially in the same plane as the laser etched antenna structure (LES) or the antenna structure. chemically etched antenna (CES) on a body, document or card label, and leaving at least one space or gap such as a cutout, slit or slot in the coupling frame antenna (CFA), can further increase the amplitude of the resonance curve of the transponder chip module (TCM) with a minimum frequency offset when interrogated by a reader. The activation distance of a transponder chip module (TCM) with a coupling frame antenna (CFA) can be substantially increased by at least a factor of 1.5, unlike the performance of a transponder chip module (TCM). without a coupling frame antenna (CFA). Activation distances of at least 2 cm, including up to 3 cm and up to 4 cm, can be achieved using a transponder chip module (TCM) that has a laser-etched antenna structure (LES) or a chemically etched antenna structure (CES) together with a coupling frame antenna (CFA) in (or comprising the majority of) the card body (CB).

A coupling frame antenna (CFA) may be used in conjunction with a holographic metal foil (called a holofoil), if the holofoil is transparent to high-frequency electromagnetic waves and does not affect or influence the performance of a transponder chip module. . The TCM can be implanted on a foil card because the thickness of the metal is significantly less than the skin depth of the metal at a frequency of interest, such as 13.56 MHz, or more generally 10 to 30 MHz.

An LED can be connected through the slit, gap or contour in a docking frame antenna to indicate a financial transaction.

The coupling frame antenna (CFA) may be a single-turn continuous conductor that is a closed-loop circuit (has no beginning or end) with a resonant frequency in the ultra-high frequency range, such as in the bandwidth from 2 to 5 GHz. The coupling frame antenna (CFA) can be broken at some point along its path to facilitate connection of a device such as an LED or capacitor. Alternatively, a device may be connected in parallel across part of the CFA where the windings, or part thereof, run parallel or in sufficient proximity to each other.

The width of the one-turn antenna may be wider around the area where the module antenna overlaps the conducting path of the mating frame antenna. Surface eddy current can flow along the outer perimeter edge of the mating frame antenna, while in the area of the indentation, slot, gap or contour, the current can flow around the inner perimeter where the module antenna is attached. overlaps the antenna docking frame.

The area where the transponder resides on a smart card is that indicated by an ISO standard.

The invention relates generally to RFID transponders that can transmit data and receive data from an external reader. Such transponders can generally be divided into two categories: "active" and "passive." Active transponders may have their own internal power source, for example a battery. Passive transponders are powered by (collect energy from) the external reader. Due to the lack of its own power supply, there are several factors that can influence the successful operation of a passive transponder, some of which are addressed in this invention. For example, the distance at which a passive transponder can be activated (turned on) and reliably communicate (read/write) with the external reader may be very limited. Consequently, smart cards (SC) comprising passive transponders generally require amplification antennas (BA) in the card body (CB). Hereinafter, passive RFID transponders comprising passive transponder chip modules (TCM) are discussed and, unless otherwise specified, all embodiments are directed to passive RFID transponders and transponder chip modules (TCM). Passive RFID transponders and transponder chip modules (TCM) arranged on smart cards (SC) (including metal foil smart cards and metal-plastic hybrid smart cards) and capable of operating in a contactless mode without requiring a Conventional amplification antenna (BA, which is replaced with a coupling frame antenna (CFA)) are described in this invention.

According to the invention, in general, a conductive coupling frame antenna (CFA) has a continuous path, forms a complete loop, can be arranged around and closely adjacent to a transponder chip module (TCM), and can be substantially coplanar and overlap with an antenna structure (AS, LES, CES) on the transponder chip module (TCM). A coupling frame antenna (CFA) can have multiple paths as a continuous path. A coupling frame antenna (CFA) may be formed on one or both sides of an embedding substrate. The coupling frame antenna (CFA) is a closed loop on one side of the embedding substrate, while the antenna on the opposite side of the substrate can be an open loop having a start and end position. The transponder chip module (TCM) may comprise a laser etched antenna structure (LES) or a chemical etched antenna structure (CES) and a perforation-free contact pad (CP) arrangement.

According to the invention, the coupling frame antenna (CFA) may extend over a peripheral area of the smart card. The coupling frame antenna (CFA) can start in the center of the card body, at the so-called center of technology (COT), to function similarly to a conventional boost antenna and meet the test conditions defined by EMV regulations.

According to the invention, generally, a smart card (SC) has a card body (CB) and a conductive coupling frame antenna (CFA) that extends as a closed loop circuit around a periphery of the card body. , and also extends inward, such that two antenna portions of the coupling frame are closely adjacent to each other, with a gap between them. The gap may extend from a periphery of the card body to a position corresponding with a module antenna (MA) of a transponder chip module (TCM) disposed in the card body, and may function as a slit (S ) in a coupling frame (CF). An antenna portion of the coupling frame may be arranged to surround an area that is the ISO position of the transponder chip module in the card body.

A coupling frame antenna (CFA) can be incorporated into a tape module (MT) for a transponder chip module (TCM).

According to the invention, a smart card comprises a card body (CB), where a given area of the card body is designated to receive a transponder chip module (TCM) having a module antenna (MA); and comprises a coupling frame antenna (CFA) comprising a conductive path running a distance around a perimeter of the card body and further into the interior of the card body to the area designated to receive the transponder chip module, which results in two portions of the coupling frame antenna (CFA) being closely adjacent to each other with a gap (S, 203, 303) between them, the space extending from a peripheral edge of the card body to the area of the card body designated to receive the transponder chip module (TCM). A portion of the conductive path may surround the area (ISO) designated to receive the transponder chip module. A portion of the conductive path may form a loop around the area of the card body designated to receive a transponder chip module (TCM). A transponder chip module may be arranged in the loop and overlay a portion of the coupling frame antenna to a portion of the module antenna (MA) on the transponder chip module. The docking frame antenna gap may overlap a portion of the module antenna (MA) on the transponder chip module. The coupling frame antenna (CFA) comprises a single turn closed loop circuit.

The docking frame antenna may start at the center of the card body and extend over the peripheral area of the smart card. The conductive path may have a width greater than its film depth at a frequency of interest. The driving path may comprise multiple paths.

The docking frame antenna may be formed on one side of an embedding substrate. A second docking frame antenna may be formed on another side of the embedding substrate. One of the antennas of the coupling frame is formed as a closed circuit and the other of the antennas of the coupling frame can be formed as an open circuit, which has a starting position and an ending position.

In its various embodiments, the invention(s) described in this invention may relate to commercial and industrial industries, such as RFID applications, smart payment cards, loyalty cards, gift cards, hotel access cards, identity cards. , access control cards, portable devices, etc. Other objects, features and advantages of the invention or inventions described in this invention may be apparent in light of the following illustrations and descriptions thereof.

BACKGROUND OF THE COUPLING FRAMEWORK

Radio Frequency Identification (RFID)-enabled smart cards that communicate in contactless mode with a point-of-sale (POS) reader or terminal have been around for more than 20 years. These passive devices operating at the ISM frequency of 13.56 MHz receive energy from the electromagnetic field propagated by a POS terminal. The same RFID technology is also applied in national identity cards and e-passports. More recently, financial cards (prepaid, debit and credit cards) have both a contact and contactless interface, so-called dual interface chip (DIF) cards, and the contactless interface is used for micropayment transactions.

A DIF smart card has an implanted transponder chip module and an amplification antenna integrated into the body of the card, with no physical electrical contact between the chip module and the antenna. The transponder chip module has an array of 6 or 8 contact pads on its front and a miniature antenna (microcoil) that runs a distance around an RFID chip on the back. The operation between the transponder chip module and its amplification antenna on the card is called "inductive coupling." Based on the teachings of US 9475086[1], entitled "Smartcard with Coupling Frame and Method of Increasing Activation Distance of a Transponder Chip Module" by Finn et al., an academic paper arising from a research program was published in May 2016 in conjunction with the 2016 IEEE International Conference on RFID and titled "Use of slits of defined width in metal layers within ID-1 cards, as reactive couplers for nearfiled passive RFID at 13.56 MHz." metal layers inside ID-1 cards, such as reactive couplers for passive near-field RFID at 13.56 MHz).

The Ackland et al. manuscript[2] clarifies the technique of reactive (i.e. inductive and capacitive) coupling using a slit or slot of defined width and module opening (rectangular cut) in a metal sheet to concentrate the surface eddy current density around a chip module transponder.

When a slit metal sheet coupling frame is exposed to an electromagnetic field generated by a reader antenna, the induced eddy current circulation loops do not work against the field that created them, but rather can enhance the magnetic field around the area. of the slit and, consequently, the surface eddy currents do not react at the source of the changing magnetic field. High-frequency structural simulator (HFSS) models in coupling frames with cutouts/slits and overlaid transponder chip modules provided finite element calculations and measurements. The 2D inductive magnetic field profiles showed that the field concentration extends along the perimeter of the coupling frame in addition to the position of the cutout/slit. The inductance is created due to the flow of surface eddy currents around the cut/slit area, coupling very closely to the overlay antenna structure of the transponder chip module. This system can be compared to an air-coupled transformer, allowing a transformer ratio close to 55:1 to be achieved. The profiles showed that the field evidently improved in magnitude when the transponder chip module was combined with the docking frame. A dominant control parameter of the coupling frame in combination with the transponder chip module was the front capacitance of the module's Complementary Metal Oxide Semiconductor (CMOS) chip. The underlying physical mechanism is reactive coupling between the slit/slit module and the transponder chip. [2]

The technique replaces the complicated on-board amplification antenna for contactless communication with an inexpensive metal sheet that acts as a docking frame. This RFID slit technology could also fundamentally change the design, functionality and operation of wearable devices for payment applications, as described in US 20160110639[3], titled "Passive Smart Cards, Metals Cards, Payment Objects and Smart Jewelry".

It should be noted that the input capacitance of dual-interface semiconductor chips has increased significantly in recent times (from 17 pF to 69 pF, and to over 100 pF), which reduces the need for a complex amplification antenna structure to inductive coupling in a dual interface smart card}.

Some previous techniques

Qing et al. [4] showed that metal plates in close proximity to a reader antenna operating at 13.56 MHz increase the resonant frequency of the antenna and weaken its field strength. They discovered that the frequency shift and reduction in field strength are a consequence of blocking the magnetic flux through the reader loop antenna and inducing eddy currents in the metal plate. Chen et al. [5] reported a novel way to reduce the shielding effects of a metal surface in close proximity to an RFID tag. They propose a metallic RFID tag comprising a slit in a metal plate and a window-shaped slot to accept a small loop antenna. The antenna is designed for a Texas Instrument Ultra High Frequency (UHF) chip, whose input impedance is about (10.7-j62.8) Q at 925 MHz. The small loop antenna couples inductively the energy to the metal with the corresponding slit and opening. The coupling strength is mainly controlled by the distance between the window slot and the loop antenna.

US 8608082[6] (2013-12-17, LeGarrec et al., '082) describes a method for amplifying the gain of an antenna in a transponder SIM device that uses a flat metal layer with a slit surrounding the periphery of the device; the metal layer does not overlap the structure of the transponder antenna, nor does it consider such overlap to be an enhancing factor: "In accordance with one embodiment of the invention, the element extends around the antenna outside a defined area by the projection of the antenna along a direction substantially orthogonal to the antenna surface. Therefore, the antenna and the ring should not extend opposite each other so as not to mask the magnetic field flow through the surface. of the antenna. In other words, the element extends outside the outer perimeter of the antenna in a plane parallel to that containing the antenna or part of the antenna, or possibly in the same plane, however, as the element extends inside. in the same plane as the antenna or part of the antenna, a minimum space is provided between the element and the antenna to ensure electrical isolation."

Mukherjee[7] explains how a metal surface in the vicinity of an air-coupled reader-transponder system significantly degrades performance. The electromagnetic field generated by the reader induces eddy currents in the metal surface, creating a magnetic field in opposition to the original field that reduces the magnetic flux and therefore the inductance. Additionally, reducing the effective magnetic field reduces the power supply to the chip.

The prior art may not consider the importance of overlap of the docking frame or docking frame antenna with the transponder chip module antenna, and more specifically the degree of overlap to achieve a contactless smart card that meets the EMVCo (Europay MasterCard Visa) specification on contactless payments for payment systems It is not just a question of transponder activation distance, but of having optimal read/write performance with respect to responsiveness, synchronization, quality factor, load modulation and data communication at off-resonance sidelobe frequencies under different field strength conditions and without the presence of read holes or data clipping.

Bibliography

[1] Finn, D., Lotya, M. and Molloy, D. (2016). "Smartcard with coupling frame and method of increasing activation distance of a transponder chip module", U.S. Patent 9,475, 086.

[2] Ackland, K., Lotya, M., Finn, D.J. and Stamenov, P. (2016). "Use of slits of defined width in metal layers within ID-1 cards, as reactive couplers for near-field passive RFID at 13.56 MHz", 2016 IEEE International Conference on RFID (RFID), Orlando, FL, pp. 1-4.

[3] Finn, D., Lotya, M. and Molloy, D. (2016). "Passive Smart Cards, Metal Cards, Payment Objects and Smart Jewelry", U.S. Patent Application 2016/0110639.

[4] Qing, X. and Chen, Z.N. (2007). "Proximity Effects of Metallic Environments on High Frequency RFID Reader Antenna: Study and Applications", IEEE Transactions on Antennas and Propagation, Vol. 55 (11): pp. 3105-3111.

[5] Chen, S.L., Kuo, S.K. and Lin C.T. (2009). "A metallic RFID tag design for steel-bar and wire-rod management application in the steel industry", Progress in Electromagnetics Research, PIER Vol. 91: pp. 195-212.

[6] Le Garrec, L., Duval, A. and Launay, F. (2013). "Microcircuit device including means for amplifying the gain of an antenna", U.S. Patent 8,608,082.

[7] Mukherjee, S. (2014). "Mitigation of proximity to metal for magnetically coupled transponders by use of resonant loops", 2014 IEEE International Conference on RFID (IEEE RFID), Orlando, FL, pp. 8-14.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference will be made in detail to embodiments of the description, non-limiting examples of which may be illustrated in the accompanying drawing figures (Figures). In general, figures can be in the form of diagrams. Some elements of the figures may be exaggerated, others may be omitted, for greater illustrative clarity. Some figures may be in the form of diagrams.

Although the invention is generally described in the context of several exemplary embodiments, it should be understood that it is not intended to limit the invention to these particular embodiments, and individual features of various embodiments may be combined with each other. Any text (legends, notes, reference numbers and the like) appearing in the drawings is incorporated into this invention by this reference. Some items may be named by letters ("CM", "CES", "CFA", "MT", "TCM", "LES", "CB", "MO", "S" and similar) instead of or in addition of the numbers.

FIG. 1 is a diagram, in cross section, of a conventional dual interface smart card (SC) and readers.

FIG. 2 is a diagram of an exemplary coupling frame antenna with a path width of 3 mm.

FIG. 3 is a diagram of an exemplary coupling frame antenna with its initial position at the center of the card body.

FIG. 4 is a diagram of an exemplary coupling frame antenna with multiple path sections extending inward toward the center of the card.

DETAILED DESCRIPTION

Various embodiments (or examples) may be described to illustrate the teachings of the invention(s), which should be construed as illustrative and not limiting. It should be understood that it is not intended to limit the invention(s) to these particular embodiments. It should be understood that some individual features of various embodiments may be combined with each other in ways other than those shown. Reference in this invention to "an embodiment", "an embodiment" or similar formulations may mean that a particular function, structure, operation or feature described in connection with the embodiment is included in at least one embodiment of the present invention. Some embodiments may not be explicitly designated as such ("an embodiment").

Embodiments and aspects thereof may be described and illustrated along with systems, devices and procedures that are intended to be exemplary and illustrative, without limiting their scope. Specific configurations and details may be established to provide an understanding of the invention(s). However, it should be apparent to one skilled in the art that the invention(s) can be practiced without some of the specific details in this invention being presented. Furthermore, some well-known steps or components may be described only in general, or even omitted, for the sake of illustrative clarity. Elements referred to in the singular (e.g., "a widget") may be interpreted to include the possibility of plural instances of the element (e.g., "at least one widget"), unless explicitly state otherwise (e.g. "one and only one widget").

In the following descriptions, some specific details may be set forth to provide an understanding of the invention(s) described in this invention. It should be apparent to those skilled in the art that these inventions can be practiced without these specific details. Any dimensions and materials or procedures set forth in this invention should be considered approximate and exemplary, unless otherwise indicated. Headings (typically underlined) may be provided as an aid to the reader, and should not be construed as limiting.

Reference may be made to the descriptions of previous patents, publications and applications. Some text and drawings from those sources may be presented in this invention, but may be modified, edited or commented on to better integrate with the description of the present application.

Hereinafter, RFID cards, electronic tags and secure documents in the form of pure contactless cards, dual interface cards, telephone tags, electronic passports, national identity cards and electronic driving licenses can be discussed as examples of various features and embodiments of the invention(s) described in this invention. As will be evident, many features and embodiments can be applied (and easily incorporated) into other forms of smart cards, such as EMV payment cards, metal composite cards, metal hybrid cards, metal foil cards, control cards. access cards, hotel key cards and secure credential documents. As used in this invention, any of the terms "transponder", "tag", "smart card", "data carrier", "portable device" and the like may be interpreted as referring to any other devices similar to those operating under ISO 14443 or a similar RFID standard. The following standards are incorporated in their entirety by reference in this invention:

-ISO/IEC 14443 (ID cards, contactless integrated circuit cards and proximity cards) is an international standard that defines proximity cards used for identification and the transmission protocols to communicate with them;

-ISO/IEC 15693 is an ISO standard for proximity cards, that is, cards that can be read from a greater distance compared to proximity cards;

-ISO/IEC 7816 is an international standard related to electronic identification cards with contacts, especially smart cards;

-EMV standards define the interaction at the physical, electrical, data and application levels between IC cards and IC card processing devices for financial transactions. There are standards based on ISO/IEC 7816 for contact cards and standards based on ISO/IEC 14443 for contactless cards.

A typical data carrier described in this invention may comprise;

(i) a transponder chip module (TCM) having an RFID chip (CM or chip module) and a laser etched antenna structure (AS, LES);

-- It should be understood that the antenna structure (AS) may be laser or chemical etched, and may be substantially planar with a series of paths separated by spaces;

(ii) a card body (CB) (which may be simply referred to as a "card"); and

(iii) a coupling frame antenna (CFA) arranged in or on the card body (CB) to improve coupling between the transponder chip module (TCM) and the antenna of an external RFID "reader".

In this invention, when reference is made to "chip module", it should be taken to include "chip", and vice versa, unless explicitly stated otherwise.

In this invention, when referring to a "transponder chip module" (TCM), it should be considered to include the "antenna module" (AM), and vice versa, unless explicitly stated otherwise. Transponder chip module (TCM) can also be called "transponder IC module".

The transponder chip module (TCM) may comprise insulated metal features without perforations, such as contact pads on the face-up side of the module ribbon (MT) and one or more laser-etched antenna structures (LES) on the face side. below the module tape (MT). Certain components on either side of the module tape (MT) may be etched with chemicals. An antenna structure built directly into the chip can be inductively coupled with the laser-etched antenna structure.

Throughout the various embodiments described in this invention, unless specifically indicated otherwise (in other words, unless excluded), the element designated "CM" will most suitably be an integrated circuit chip (IC) bare (or an RFID chip), rather than a chip module (a chip with a carrier). In contrast to this, some figures present examples that are specifically "chip modules" that have IC chips (such as a "CM") mounted and connected to substrates. A "chip module" (die and carrier) with and connected to a laser etched antenna structure (LES) can be called a transponder chip module (TCM).

When reference is made to "embedding substrate" in this invention, it should be considered to include the "card body", and vice versa, as well as any other substrate for a secure document, unless explicitly stated otherwise.

Component elements such as a switch, capacitor, inductor, resistor, an LED or an anti-shielding material such as ferrite can be included as an integral part of the transponder chip module or the docking frame antenna.

The following descriptions are primarily in the context of dual interface (DI, DIF) smart cards, and primarily refer to the contactless operation thereof. Many of the teachings set forth in this invention can be applied to pure contactless cards, tags, secure documents (e.g., electronic passports), and the like that have only a contactless mode of operation. In general, any dimensions set forth in this invention are approximate, and the materials set forth in this invention are intended to be exemplary. Conventional abbreviations such as "cm" for centimeter, "mm" for millimeter, "gm" for micron, and "nm" for nanometer may be used.

FIG. 1illustrates an SC 100 smart card in cross section, along with a contact reader and a contactless reader. An antenna module (AM or TCM transponder chip module) 110 may comprise a module strip (MT) 112, an RFID chip (CM) 114 disposed on one side (face down) of the module strip MT together with a module antenna (MA) 116 and contact pads (CP) 118 arranged on the other side (face up) of the module tape MT to interact with the reader without external contact. The card body (CB) 120 comprises a substrate that may have a recess (R) 122 extending on one side thereof to receive the AM antenna module. (The recess R may be stepped, such as wider on the surface of the CB card body, to accommodate the profile of the AM antenna module.) The BA amplification antenna 130 may comprise turns (or traces) of cable (or other conductor) embedded in (or disposed in) the body of the CB card, and may comprise a number of components such as (i) an antenna component of card (CA) 132 and (ii) a coupling coil component (CC) 134. It should be noted that, as a result of the recess R being stepped, a portion of the card body (CB) may extend below a portion of the AM module antenna, more particularly below the module antenna (MA).

Holographic metal sheets can be glued or laminated to both sides of the BA amplification antenna inlay (CB card body). Holographic metal foils may not significantly attenuate the electromagnetic field, in other words, holographic metal foils may be largely transparent to the RF field. Holographic metal sheets can be used to mask (visually hide) the presence of the BA amplification antenna. Additionally, the holographic metal sheets when placed on each side (top, bottom) of the amplification antenna BA can generate capacitance that can help improve the communication performance of the smart card with the reader (FIG. 1).

FIG. 2 is a diagram of an example coupling frame antenna (CFA) with a path width of approximately 3 mm. The design shown illustrates a continuous closed loop single track coupling frame antenna (CFA) 202 positioned within the perimeter defined by the card body (CB) 201. It should be noted that the figure is illustrative of the shape and the general shape of the coupling frame antenna (CFA) 202 and that the antenna may reside on or between any of the layers that may constitute a typical smart card. The outer edges of the docking frame antenna (CFA) 402 may extend to the periphery of the card body (CB) 201 or be offset from the edge of the smart card by some distance to assist lamination or other assembly of the additional layers of the smart card. The path defined by the coupling frame antenna (CFA) 201 extends inward towards and around the module opening (MO) 204. The length, width and thickness of the path of the coupling frame antenna (CFA ) 202 in the vicinity of the module opening (MO) 204 can be established to provide optimal overlap with the module antenna (MA) of the transponder chip module (TCM).

The shape of the docking frame antenna, as it extends inward from the left side (as seen) of the card body to the module opening area, results in two portions side by side of the other coupling frame antenna (CFA) are closely adjacent to each other, with a gap between them. This gap can be comparable to the slot (S) in a conventional coupling frame (CF).

In general, a "coupling frame" (CF) may comprise a metal layer, a metal frame, a metal plate or any electrically conductive medium or surface with an electrical discontinuity such as in the form of a slit ( S) or a non-conductive band extending from an outer edge of the layer to an inner position thereof, the coupling frame (CF) may be oriented so that the slit (S) overlaps (crosses) the antenna of the module (MA) of the transponder chip module (TCM), such as on at least one side thereof. The slit (S) may be straight and may have a width and a length. In some embodiments, the slot (S) may extend to an opening (MO) to accept the transponder chip module. In other embodiments, there may only be a slit and no opening for the transponder chip module (TCM). Docking frames of this type, typically a metal layer with an opening for receiving a transponder chip module, and a slit extending from a periphery of the layer to the opening, where the slit overlaps at least a portion of the module antenna, can be found in documents US 9812782, US 9390364, US 9634391, US 9798968 and US 9475086.

In contrast to this, the coupling frame antenna (CFA) of the present invention may comprise a continuous conductive path or a cable or sheet run formed around the transponder chip module (TCM), for example, by embedding cable or by recording a conductive path or path in the form of a single-turn (or single-loop) antenna. The coupling frame may be flat or three-dimensional (such as a curved surface). The coupling frame for inductive coupling with a reader can be coupled with a passive or active transponder chip module.

The path (or path) of the single loop coupling frame (CFA) antenna can generally be around the periphery of the card body, but can extend to a position internal to the card body and fold back on itself in selected areas of the card body, leaving a gap or void between adjacent portions of the path. The space (void, gap) between closely adjacent portions of the single loop coupling frame may perform the function of a slit (S) in a conventional coupling frame, that is, overlaying a portion of a module antenna on the module of transponder chip, but is clearly different in construction. The docking frame antenna (CFA) can be wrapped around the position (or opening of the MO module) for the transponder chip module (TCM).

Generally, the term "slit" will apply to coupling frames (CF), and the term "gap" will apply to the corresponding characteristic of coupling frame antennas (CFA). However, in some cases, the term "slit" may be used to describe the space (void, gap) between closely adjacent portions of the single loop coupling frame (CFA) antenna.

The slit (or gap) overlap of a coupling frame (CF) or coupling frame antenna (CFA) with the module antenna (MA) may be less than 100%. Additionally, the width and length of the slit (or gap) can significantly affect the resonant frequency of the system and can be used as a tuning mechanism. As the width of the slit (or gap) changes, there is a resulting change in the overlap of the slit with the antenna.

Another distinction is important. When a conventional general coupling frame (CF) is referred to as "continuous", the indentation (S) should be understood to represent a mechanical and electrical discontinuity in a structure that is otherwise continuous (electrically and mechanically). . The indentation is a feature that extends from an edge of the docking frame (CF) to an interior position thereof (typically, the module opening for the transponder chip module).

Most of the coupling frames described above (such as in US 9812782, US 9390364, US 9634391, US 9798968 and US 9475086) may have a "continuous" surface, and may comprise a sheet, sheet or layer of metal that It has a slit (an electrical discontinuity) to overlay an antenna module and, in some cases, it has a suitable opening (MO) to accommodate the mounting of the transponder chip module. Docking frames can be printed and can be composed of a grid or array of wires (such as an inlay wire (copper or silver) and make a physical connection via overlapping wires to create a docking frame. The docking frame It could also be a metal mesh. A "discontinuous" coupling frame could be made of a layer of solid metal, or of embedding wire in a suitable pattern in a substrate, both of which would be arranged so as to exhibit a slit/slit. discontinuity.

The coupling frame antenna (CFA) described in this invention is easily distinguished from previous coupling frames (CF) in that it does not have a slit extending from an outer edge thereof to an internal position thereof, and It is generally a continuous structure.

When considering the coupling frame antenna (CFA), in this way, a closed-loop single-turn continuous run antenna with a folded/contour shape that results in narrow gaps between closely adjacent portions of the run can function as a coupling frame, the space in the contoured antenna serves the purpose of the slot in a coupling frame, both the slot and the space preferably overlap at least a portion of the module antenna in the transponder chip module. One benefit of the contoured antenna having a gap, rather than a mating frame having a slit, is that the slit in the mating frame is a mechanical discontinuity that may slightly compromise the mechanical integrity of the card. The contoured antenna does not suffer from this disadvantage, because there is no mechanical discontinuity in its single loop structure.

When the coupling frame antenna (CFA) 202 is folded back on itself, there is a space (gap, void) 203 between two closely adjacent portions of the CFA. (This space may sometimes be called a "slit", as it performs a similar function to the slit of a CF, and may be labeled "S"). The gap (S) 203, as shown, extends from the outer perimeter of the coupling frame antenna (CFA) 202 and intersects the module opening (MO) 204. A device, for example, an LED or a capacitor , may be connected through gap (S) 203 or any other part of the coupling frame antenna (CFA) 202 in order to provide additional function to the CFA 202 or to affect the resonant frequency of the device. Alternatively, the coupling frame antenna (CFA) 202 may be broken at some point in order to allow connection of a device which in turn completes the coupling frame antenna circuit and provides an effectively continuous path.

In particular, the coupling frame antenna (CFA) is a continuous path without beginning or end, in short, a closed loop circuit having a contour or shape that envelops or surrounds the position for placement of a transponder chip module. , which has a module antenna that overlaps the docking frame antenna on one side, two sides, three sides or on all four sides. The gap, slot, cut, slit or opening does not cause any electrical discontinuity in the coupling frame antenna. The transponder chip module is inductively coupled with the coupling frame antenna through its module antenna which picks up the surface current distribution.

FIG. 3 is a diagram of an exemplary coupling frame antenna (CFA) with its initial position in the center of the card body. Since the coupling frame antenna (CFA) 302 is a continuous loop and therefore does not have a well-defined start or end point, it can be stated that the coupling frame antenna (CFA) 302 describes a path that is extends inward toward the center of the card body (CB) 301 from the right edge of the card body (CB) 301 as illustrated. A gap 303 (compare 203) is formed from two closely adjacent portions of the CFA in the left portion (as seen) of the card body (CB) and this gap 303 can function as a slit in a card frame. coupling (CF). Another gap(s) (S) 309 may be formed with two closely adjacent portions of the CFA on the right portion (as seen) of the card body (CB).

In one aspect of this invention, the coupling frame antenna (CFA) 302 shown extends around or near the geometric center of the card plane, which coincides with the axis defined by EMV standards as the technology center ( COT) 305. The purpose of the Coupling Frame Antenna (CFA) extension into or around the Center of Technology (COT) 305 is to provide spatially uniform signal reception and communication with a reader antenna beyond the area defined by Card Body (CB) 301 in order to comply with required ISO and EMV smart card standards. The distance (D) 307 may be any value that allows optimal pickup of the radio frequency signal by the coupling frame antenna (CFA) 302 in all regions of the card body (CB) 301. The bending point of The antenna (AB) 306 may also have a variable shape or be omitted in the case where the paths extending inward from the coupling frame antenna (CFA) 302 run parallel to each other; in this case, the distances (D) 307 and (E) 308 may be the same or similar. The distance (E) 308 can also be controlled in order to optimize the spatial radio frequency signal collection characteristics of the coupling frame antenna (CFA) 302.

With respect to the gaps 203, 303, 309, as mentioned above, these characteristics are clearly different from the slots (S) previously described, for example, in US 9798968, US 9475086, US 9812782 and US 9390364, since They are formed with the contour (pattern) of the coupling frame antenna (CFA), rather than extending into the body of a coupling frame (CF) from an external (or internal) edge thereof.

FIG. 4 is a diagram of an exemplary coupling frame antenna (CFA) 401 having multiple paths extending inward, as a variation of the design shown previously in FIG. 3. In this case, the path defined by the coupling frame antenna (CFA) 401 extends inward from the right edge of the card body (CB) 401, as shown, to form a close loop around the module opening (MO) 404 before extending outward, towards the right edge of the card body (CB) 401. The path then extends inward to closely surround the module opening (MO) 404 again before spreading outwards once more. Operation of additional sections of the coupling frame antenna (CFA) 402 around the module opening (MO) 404 in this manner can be used to increase electromagnetic coupling to the module antenna (MA) of the transponder chip module. (TCM). In this way, the coupling frame antenna (CFA) 402 forms a series of S-curves or "reverse" loops that allow a significant length of the coupling frame antenna (CFA) to pass through or around the center of technology (COT) 405. By using this design, the communication performance of the coupling frame antenna (CFA) 402 together with the transponder chip module (TCM) can be improved. It is noted that the number, pitch and density of the "backtrack" loops used are not restricted.

Coupling Frames (CF) in General

A metallic surface or conductive surface, of suitable thickness and dimension, acting as a coupling frame (CF) can replace (or obviate the need for) an amplification antenna (BA) in an interface smart card (SC). double. The coupling frame on a card body (CB), tag, document or the like may operate on the principle of capacitive inductive coupling, concentrating surface eddy currents around the module antenna of a transponder chip module (TCM). which may have a laser etched (LES) antenna structure. See US patent 9475086.

It should be understood that the concepts associated with the coupling frame (and the slotted metal layer in a card body), described in US 9475086 may provide performance benefits with other laser etched (LES) antenna structures.

The performance of a laser etched antenna structure (LES) on a transponder chip module (TCM) can be improved by surrounding the antenna structure (AS) with a metal frame (MF), or coupling frame (CF), in the card body (CB) of the smart card (SC).

According to some embodiments of the invention described in US 9475086, in general, a dual interface smart card may comprise:

a transponder chip module (TCM) having an antenna structure (AS);

a card body (CB) comprising multiple layers; and at least one metal layer (ML) or metallized layer (metalized) that forms an open loop coupling frame (CF) that at least partially surrounds the transponder chip module (TCM).

The "open loop" in the metal layer can refer to the opening (MO) in the metal layer to accept the transponder chip module. The metal layer itself is a closed circuit (closed loop) with surface eddy currents running on its outer perimeter edges and then concentrating their distribution on the inner edges of the aperture and the aperture surrounding the module antenna. of the transponder chip module. Although the invention, or inventions, have been described with respect to a limited number of embodiments, they should not be construed as limitations on the scope of the invention(s), but rather as examples of some of the realizations. Those skilled in the art may envision other possible variations, modifications and implementations that are also within the scope of the invention which is defined solely by the appended claims.

Claims (12)

1. A smart card (SC, 100) comprising: a card body (CB, 201,301,401), where a given area of the card body is designated to receive a transponder chip module (110) having a module antenna (MA); and a coupling frame antenna (CFA, 202, 302, 402) comprising a conductive path that runs a distance around a perimeter of the card body, and another distance further towards an interior of the card body to the area of the card body designated to receive the transponder chip module, resulting in two portions of the antenna of the coupling frame being closely adjacent to each other with a gap (S, 203, 303, 403) between them, said gap extending from a peripheral edge of the card body to the area of the card body designated to receive the transponder chip module; wherein the coupling frame antenna comprises a single turn closed loop circuit; characterized because The smart card comprises a capacitor that affects a resonant frequency of the antenna of the coupling frame and that is connected through the gap or at some point along a path of the coupling frame antenna, where the coupling frame antenna breaks down in such a way that the capacitor completes the single-turn closed loop circuit of the coupling frame antenna . 2. The smart card according to claim 1, where: A portion of the conductive path surrounds the area of the card body designated to receive the transponder chip module. 3. The smart card according to claim 1, where: The docking frame antenna forms a loop around the area of the card body designated to receive the transponder chip module. 4. The smart card according to claim 3, where: The smart card comprises the transponder chip module disposed in the loop, with an antenna portion of the docking frame superimposed on an antenna portion of the module on the transponder chip module. 5. The smart card according to claim 1, where: the conductive path of the antenna of the coupling frame extends inwardly towards a center of technology (COT, 305, 405) of the smart card, so it extends around or near the technology center , from a right edge of the card body, and so the gap is formed in a left portion of the card body. 6. The smart card of claim 5, wherein a second gap (S, 309) is formed in a right portion of the card body with two closely adjacent portions of the docking frame antenna. 7. The smart card according to claim 1, where: The conducting path has a width greater than the film depth at a frequency of interest. 8. The smart card according to claim 7, where: The travel width of the conductor path is approximately 3 mm. 9. The smart card according to claim 1, where: The docking frame antenna is formed on one side of an embedding substrate. 10. The smart card according to claim 9, where: A second docking frame antenna is formed on another side of the embedding substrate. 11. The smart card according to claim 10, where: The second antenna of the coupling frame is formed as an open circuit, which has a starting position and an ending position. 12. The smart card according to claim 1, where: The smart card comprises the transponder chip module and where a path width is wider around an area where the antenna of the module overlaps the conductive path of the antenna of the coupling frame.