KR101712996B1 - Multi card having a shield cover - Google Patents

Multi card having a shield cover Download PDF

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Publication number
KR101712996B1
KR101712996B1 KR1020150153883A KR20150153883A KR101712996B1 KR 101712996 B1 KR101712996 B1 KR 101712996B1 KR 1020150153883 A KR1020150153883 A KR 1020150153883A KR 20150153883 A KR20150153883 A KR 20150153883A KR 101712996 B1 KR101712996 B1 KR 101712996B1
Authority
KR
South Korea
Prior art keywords
transparent layer
layer
card
cobs
antenna
Prior art date
Application number
KR1020150153883A
Other languages
Korean (ko)
Inventor
정태환
Original Assignee
코나아이 (주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코나아이 (주) filed Critical 코나아이 (주)
Priority to KR1020150153883A priority Critical patent/KR101712996B1/en
Application granted granted Critical
Publication of KR101712996B1 publication Critical patent/KR101712996B1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07796—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements on the record carrier to allow stacking of a plurality of similar record carriers, e.g. to avoid interference between the non-contact communication of the plurality of record carriers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0725—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit for emulating a plurality of record carriers, e.g. a single RFID tag capable of representing itself to a reader as a cloud of RFID tags
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Abstract

The present invention relates to a multi-card having a plurality of IC chips mounted thereon and capable of being slidably used so as to be usable. The multi-card includes an upper transparent layer electrically connected to a COB (Chip On Board) A first antenna buried layer in which an antenna for stacking and communicating with the COB and for supplying power is embedded; a lower transparent layer electrically connected to the COB on the lower surface; and a communication between the lower transparent layer and the COB located on the lower transparent layer A second antenna buried layer in which an antenna for supplying power is buried; and an RF blocking layer stacked between the first antenna buried layer and the second antenna buried layer for blocking radio waves transmitted from the back surface, do.

Description

MULTI CARD HAVING A SHIELD COVER WITH A RADIO PROTECTION COVER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more particularly to a multi-card having a radio wave shielding cover which can be slidably mounted with a plurality of IC chips mounted thereon.

IC cards, which are called smart cards, are divided into various types according to their structure, such as contact cards, contactless cards, combination cards, and hybrid cards.

If the non-contact type IC card is swept within the recognition range of the reader, the reader processes at a speed of about 0.1 second or less, so the user does not have to wait for the IC card processing to wait. Because of this convenience, non-contact smart cards are widely used.

The IC card consists of an IC chip that can store information and a loop antenna that communicates with the reader. In order to meet various benefits and consumption patterns, ordinary consumers usually carry several IC cards. If several cards are put into a wallet and contactlessly used, the reader may not be able to read the card information normally. To prevent this, the card user must take the inconvenience of taking out the card to use.

In addition, even if the card is issued by the same card issuer, the benefits given to the consumer are different depending on the place where the card is used. Therefore, in order to enjoy a variety of benefits, consumers are required to issue several cards of different types. There is a lot of work to carry and manage.

Korean Patent Publication No. 10-2004-0075626

An object of the present invention is to provide a multi-card in which a plurality of IC chips are physically mounted on a single card so as to be usable as a multi-card, and a radio wave blocking cover is provided so as to prevent signal interference from a plurality of IC chips.

It is still another object of the present invention to provide a method for mounting a plurality of IC chips on a single card so that the IC chip can be used as a multi-card. By changing the position of the radio wave blocking cover for blocking radio waves, And to provide a multi-card capable of operating.

According to an aspect of the present invention, there is provided a multi-

An upper transparent layer electrically connected to a chip on board (COB) on the upper surface,

A first antenna buried layer laminated on the lower transparent layer and embedded with an antenna for communicating with the COB and supplying power;

A lower transparent layer electrically connected to the lower surface of the COB,

A second antenna buried layer formed on the lower transparent layer and embedded with an antenna for communication with the COB located in the lower transparent layer and for supplying power;

And an RF blocking layer stacked between the first antenna buried layer and the second antenna buried layer and blocking radio waves transmitted from the back surface.

In the multi-card having the above-described structure, each of the COBs located in the upper and lower transparent layers is inserted and fixed at a position having a maximum separation distance on the card.

According to yet another embodiment of the present invention,

An upper transparent layer electrically connected to a plurality of COBs (Chip On Board) on the upper surface;

A first antenna buried layer stacked below the upper transparent layer, the first antenna buried layer having a plurality of antennas for communication and power supply with respective COBs located in the upper transparent layer;

A lower transparent layer to which a plurality of COBs are electrically connected to the lower surface;

A second antenna buried layer stacked on the lower transparent layer, wherein a plurality of antennas for communicating and supplying power to the respective COBs located in the lower transparent layer are embedded;

An RF blocking layer disposed between the first antenna buried layer and the second antenna buried layer and blocking radio waves transmitted from the back surface;

And a radio wave blocking cover which surrounds the laminated upper and lower transparent layers and slides in a longitudinal direction of the card to shield a radio wave propagating area of some of the antennas,

Wherein the upper or lower transparent layer is provided with a protrusion at a position for limiting a sliding movement distance of the radio wave blocking cover and a fixing groove is formed in the inner surface of the radio wave blocking cover to insert and fix the protrusion,

According to another aspect of the present invention, there is further provided a side coupling cap coupled to longitudinal side surfaces of the laminated upper and lower transparent layers to limit a sliding distance of the electromagnetic wave shielding cover.

According to the above-mentioned problem solving means, even if a plurality of IC chips are mounted on one physical card, since only one IC chip selected by the user is activated and operated, the card user unnecessarily removes the card from the wallet There is an advantage that the same effect as that of using a plurality of cards with one card is obtained.

Furthermore, since a plurality of IC chips are mounted on one card and used, it is easier to manage the card than to use a plurality of physical cards,

Since a plurality of IC chips having different benefits can be issued and used on a single card, it is possible to obtain the same effect as issuing and using a plurality of cards, and it is possible to reduce the cost of card issuance, There is an advantage that contamination or loss can be minimized.

1 is a cross-sectional exemplary view of a multi-card according to an embodiment of the present invention;
Fig. 2 is an exploded perspective view of the multi-card shown in Fig. 1; Fig.
3 is a plan view of a multi-card according to another embodiment of the present invention;
4 is a cross-sectional exemplary view of the multi-card shown in Fig. 3;
Fig. 5 is an exploded perspective view of the multi-card shown in Fig. 3; Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 1 illustrates a cross-sectional view of a multi-card according to an embodiment of the present invention, and FIG. 2 illustrates an exploded perspective view of the multi-card shown in FIG.

As shown in FIG. 1, an upper transparent layer 100, on which at least one chip on board (COB) is electrically connected, is disposed on an upper surface of a multi-card according to an embodiment of the present invention. The upper transparent layer 100 is formed on one side of the upper transparent layer 100 to protect the upper surface of the antenna terminal 200 buried in the first antenna buried layer 200, The COB is inserted and fixed in the concave groove 112 by forming the concave groove 112 for electrically connecting to the COB and inserting and fixing the COB in the vertical line position. The upper and lower printed layers may be interposed between the upper transparent layer 100 and the first antenna buried layer 200 and the lower transparent layer 500 and the second antenna buried layer 400, respectively.

A first antenna buried layer 200 in which an antenna 210 for communicating with the COB and supplying power is buried is stacked on the lower portion of the upper transparent layer 100. The manner in which the power is supplied through the antenna 210 and the operating power is supplied to the COB is a well-known technology, and thus a detailed description thereof will be omitted.

On the other hand, one or more COBs are electrically connected to the lower transparent layer 500 constituting the lower part of the multi-card in the same manner as the upper transparent layer 100. A second antenna buried layer 400, in which an antenna 410 for communicating with the COB located in the lower transparent layer 500 and for supplying power is buried, is stacked on the lower transparent layer 500, and the first antenna buried layer 200 and the second antenna buried layer 400 are stacked with an RF blocking layer 300 for blocking radio waves transmitted from the backside.

As the material of the RF blocking layer 300, aluminum, copper, glass fiber, nickel, silver, or the like can be used, and the thickness can be 0.015 to 0.02 mm.

Each of the COBs located in the upper and lower transparent layers 100 and 500 is positioned at a position having a maximum separation distance on the card, that is, at both ends in the card longitudinal direction, one of which is inserted into the upper surface and one of which is inserted and fixed. This is to minimize the effect of card interference, texture at the time of use, and signal interference due to electromagnetic waves.

When the upper transparent layer 100, the first antenna buried layer 200, the RF blocking layer 300, the second antenna buried layer 400 and the lower transparent layer 500 are sequentially stacked and then integrated by heating and pressing, One multi-card is created.

In this multi-card, an antenna buried layer (200, 400) for communication and power supply with one COB is disposed on each of both sides of one card, and an RF shield layer (200, 400) for shielding radio waves transmitted from the back surface between the antenna buried layers The card reader can transmit and receive data with one activated COB present on the facing card surface.

Therefore, even if a plurality of IC chips are mounted on the card, only one IC chip is activated and operated. Therefore, the card user does not need to take out the card unnecessarily from the wallet, and the same effect There is an advantage that it can obtain. Furthermore, since a plurality of IC chips are mounted on one card and used, it is easier to manage the card than to use a plurality of physical cards.

In the above embodiment, a multi-card in which only one COB is mounted on the upper transparent layer 100 and the lower transparent layer 500 is illustrated. However, the COB may be mounted on both ends of the upper transparent layer 100 and the lower transparent layer 500, A multi-card in which a total of four IC chips are mounted can be manufactured.

FIG. 3 is a plan view of a multi-card according to another embodiment of the present invention, FIG. 4 is a cross-sectional view of the multi-card shown in FIG. 3, and FIG. 5 is an exploded perspective view of the multi- .

As shown in FIG. 3, the multi-card according to another embodiment of the present invention includes COB1 and COB2 mounted on the left and right sides of the upper surface of the card. COB3 and COB4 are mounted on the left and right sides of the card, respectively. However, in order to activate only one COB mounted on the left and right sides, a radio wave blocking cover 600 for shielding one radio wave region is provided. The electromagnetic wave shielding cover 600 surrounds the laminated upper and lower transparent layers 100 and 500 and slides in the longitudinal direction of the card. The electromagnetic wave shielding cover 600 (or 600) is provided on the upper or lower surface of the card, A plurality of protrusions 150 for limiting a sliding movement distance of the protrusion 150 are formed.

The detailed configuration of such a multi-card will be described in more detail with reference to FIGS. 4 and 5,

4 and 5, the upper transparent layer 100, on which COB (Chip On Board) is electrically connected, is located on the left and right sides of the upper surface. COBs are inserted and fixed in the recessed grooves 112 and 114 by forming recessed grooves 112 and 114 for inserting and fixing the respective COBs on the left and right sides of the upper transparent layer 100, respectively.

A first antenna buried layer 200 is stacked under the upper transparent layer 100. The first antenna buried layer 200 includes a plurality of antennas 210 for supplying communication and power to each COB mounted on the upper transparent layer 100 , 220 are embedded. Each of the antennas 210 and 220 is buried vertically below each of the mating COBs.

On the other hand, COBs are electrically connected to the lower transparent layer 500 constituting the lower part of the multi-card, respectively, to the left and right sides as the upper transparent layer 100. A second antenna buried layer 400 in which a plurality of antennas 410 and 420 for communicating and supplying power to each COB located in the lower transparent layer 500 is buried is stacked on the lower transparent layer 500, An RF blocking layer 300 for blocking radio waves transmitted from the back surface is stacked between the first and second antenna buried layers 200 and 400.

When the upper transparent layer 100, the first antenna buried layer 200, the RF blocking layer 300, the second antenna buried layer 400 and the lower transparent layer 500 are sequentially stacked and then integrated by heating and pressing, One multi-card is created.

When the packaged multi-card is manufactured, a radio wave blocking cover 600 that surrounds the upper and lower transparent layers 100 and 500 stacked in a later process and slides in the longitudinal direction of the card to shield the radio wave region of some of the antennas do.

That is, the multi-card packaged into the slot formed in the radio wave blocking cover 600 is inserted. In this case, a fixing groove 160 is formed on the inner surface of the radio wave blocking cover 600 as shown in FIG. 3 in order to prevent the radio wave blocking cover 600 sliding in the card longitudinal direction from being separated. The fixing groove 160 is combined with the protrusion 150 formed at a position for limiting the sliding movement distance of the radio wave blocking cover 600 to the upper or lower transparent layer 100 or 500 to restrict the sliding movement distance, Thereby preventing the cover 600 from coming off.

It is also possible to utilize a side coupling cap coupled to the longitudinal side of the packaged card instead of the above-described protrusion 150 and the fixing groove 160 as means for preventing the release of the radio wave blocking cover 600. [ If the height of the side coupling cap is larger than the thickness of the card, the detachment of the radio wave blocking cover 600 may be prevented.

In the multi-card having the above-described structure, the RF blocking layer 300 is present between the antenna buried layers 200 and 400, so that the radio wave reaches the antenna buried layer located under the card face facing the card reader, The radio wave is shielded from the antenna buried layer so that only the COBs located on the card face facing the card reader can be activated. In this case, one of the two COBs located on the card face opposite to the card reader is again covered by the radio wave blocking cover 600, so that radio waves are not transmitted to the COB hidden and the antenna positioned vertically below the COB As a result, only exposed COBs in the COB located on the card face facing the card reader and only the antennas positioned vertically below the COB are energized and activated by radio waves.

Therefore, even if a plurality of IC chips are mounted on the card, only one IC chip is activated and operated. Therefore, the card user does not need to take out the card unnecessarily from the wallet, and the same effect There is an advantage that it can obtain. Furthermore, since four IC chips are mounted on one card and used, it is easier to manage the card than to use a plurality of physical cards.

While the invention has been shown and described with reference to certain embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Although the non-contact type COB is mounted in the embodiment of the present invention, it is also possible to use a non-contact type COB and a multi-card in which the contact type COB is mounted (for example, The present invention can be applied to the case where two of them are mounted). Accordingly, the true scope of the present invention should be determined only by the appended claims.

100: upper transparent layer 150:
160: fixing groove 200: first antenna buried layer
210: first antenna 220: second antenna
300: RF blocking layer 400: second antenna buried layer
500: lower transparent layer 600: radio wave shielding cover

Claims (5)

delete delete An upper transparent layer electrically connected to a plurality of COBs (Chip On Board) on the upper surface;
A first antenna buried layer stacked below the upper transparent layer, the first antenna buried layer having a plurality of antennas for communication and power supply with respective COBs located in the upper transparent layer;
A lower transparent layer to which a plurality of COBs are electrically connected to the lower surface;
A second antenna buried layer stacked on the lower transparent layer, wherein a plurality of antennas for communicating and supplying power to the respective COBs located in the lower transparent layer are embedded;
An RF blocking layer disposed between the first antenna buried layer and the second antenna buried layer and blocking radio waves transmitted from the back surface;
A first antenna buried layer, an RF blocking layer, a second antenna buried layer, and a lower transparent layer, sequentially stacking the upper transparent layer and the first antenna buried layer, the second antenna buried layer and the lower transparent layer, Shielding cover which shields the radio wave propagating region of the antenna located on one side of the longitudinal direction of the card and exposes at least one of the COBs located on the other side of the card; And
Wherein the plurality of COBs are formed on the upper transparent layer or the lower transparent layer, and at least one of the COBs located on the other side of the COB is exposed while the other is shielded by the radio wave blocking cover, And a protrusion formed at a position to restrict the opening /
Wherein the radio wave blocking cover has a fixing groove which is inserted and fixed to the protrusion so that at least one COB among the plurality of COBs is exposed, the fixing groove being inserted and fixed with the protrusion.
The method of claim 3, wherein the two COBs spaced apart in the longitudinal direction are each electrically connected to the upper transparent layer, and another two COBs formed at positions corresponding to the two COBs formed in the upper transparent layer are respectively connected to the lower transparent layer Electrically connected,
Wherein the wave blocking cover is fixed through the protrusion and the fixing groove to selectively expose one of two COBs formed in the upper transparent layer and the lower transparent layer, respectively.
The multi-card according to claim 3, further comprising: a side coupling cap coupled to a longitudinal side of the packaged multi-card to limit a sliding movement distance of the wave blocking cover.
KR1020150153883A 2015-11-03 2015-11-03 Multi card having a shield cover KR101712996B1 (en)

Priority Applications (1)

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KR1020150153883A KR101712996B1 (en) 2015-11-03 2015-11-03 Multi card having a shield cover

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Application Number Priority Date Filing Date Title
KR1020150153883A KR101712996B1 (en) 2015-11-03 2015-11-03 Multi card having a shield cover

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KR101712996B1 true KR101712996B1 (en) 2017-03-07

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002032731A (en) * 2000-07-14 2002-01-31 Sony Corp Non-contact information exchange card
KR20040075626A (en) 2003-02-22 2004-08-30 주식회사 비즈모델라인 Method for Vesting the Priority a Card and Such Card
KR200414677Y1 (en) * 2005-12-30 2006-04-21 고려대학교 산학협력단 Rfid card shield cover
KR20070025872A (en) * 2005-09-05 2007-03-08 신한카드 주식회사 Ic card and method for manufacturing ic card

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002032731A (en) * 2000-07-14 2002-01-31 Sony Corp Non-contact information exchange card
KR20040075626A (en) 2003-02-22 2004-08-30 주식회사 비즈모델라인 Method for Vesting the Priority a Card and Such Card
KR20070025872A (en) * 2005-09-05 2007-03-08 신한카드 주식회사 Ic card and method for manufacturing ic card
KR200414677Y1 (en) * 2005-12-30 2006-04-21 고려대학교 산학협력단 Rfid card shield cover

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