ES296295U - Una disposicion para la refrigeracion de placas de circuitos impresos - Google Patents

Una disposicion para la refrigeracion de placas de circuitos impresos

Info

Publication number
ES296295U
ES296295U ES1985296295U ES296295U ES296295U ES 296295 U ES296295 U ES 296295U ES 1985296295 U ES1985296295 U ES 1985296295U ES 296295 U ES296295 U ES 296295U ES 296295 U ES296295 U ES 296295U
Authority
ES
Spain
Prior art keywords
arrangement
circuit boards
holes
air
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1985296295U
Other languages
English (en)
Other versions
ES296295Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of ES296295U publication Critical patent/ES296295U/es
Application granted granted Critical
Publication of ES296295Y publication Critical patent/ES296295Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Packages (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Amplifiers (AREA)
  • Surgical Instruments (AREA)

Abstract

UNA DISPOSICION PARA LA REFRIGERACION DE PLACAS DE CIRCUITOS IMPRESOS AGRUPADAS EN CHASIS EN UN MUEBLE DE APARATO, EN EL CUAL FLUYE AIRE ENTRE LAS PLACAS, QUE INCLUYE UNA PLACA REGULADORA ASOCIADA CON SU RESPECTIVO CHASIS, ADAPTADA TRANSVERSALMENTE AL FLUJO DE AIRE Y PROVISTA DE UNA PLURALIDAD DE ORIFICIOS DE PASO DE AIRE, CARACTERIZADA PORQUE LOS ORIFICIOS DE PASO DE AIRE CONSTITUYEN UNA PLURALIDAD DE HILERAS DE PERFORACIONES Y/O RANURAS PARALELAS A LAS PLACAS, ESTANDO LA SEPARACION MUTUA DE DICHOS ORIFICIOS DE ACUERDO CON DICHOS ORIFICIOS DE TAL MODO QUE EL FLUJO DE AIRE ADYACENTE A CADA PLACA DE CIRCUITO IMPRESO SE AJUSTA A LA GENERACION DE CALOR DE LA PLACA.
ES1985296295U 1984-12-07 1985-12-06 Una disposicion para la refrigeracion de placas de circuitos impresos Expired ES296295Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8406220A SE456547B (sv) 1984-12-07 1984-12-07 Anordning vid kylning av kretskort

Publications (2)

Publication Number Publication Date
ES296295U true ES296295U (es) 1987-08-01
ES296295Y ES296295Y (es) 1988-02-16

Family

ID=20358081

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1985296295U Expired ES296295Y (es) 1984-12-07 1985-12-06 Una disposicion para la refrigeracion de placas de circuitos impresos

Country Status (19)

Country Link
US (1) US4730233A (es)
EP (1) EP0207094A1 (es)
JP (1) JPS62500971A (es)
KR (1) KR910007476B1 (es)
AU (1) AU587215B2 (es)
BR (1) BR8507085A (es)
CA (1) CA1263467A (es)
DK (1) DK158187C (es)
ES (1) ES296295Y (es)
FI (1) FI862859L (es)
GR (1) GR852846B (es)
IT (1) IT1186410B (es)
MX (1) MX158561A (es)
NO (1) NO863013D0 (es)
NZ (1) NZ214200A (es)
PT (1) PT81580B (es)
SE (1) SE456547B (es)
WO (1) WO1986003648A1 (es)
YU (1) YU46162B (es)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935845A (en) * 1988-07-11 1990-06-19 General Electric Company Electronic circuit module with improved cooling
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
US5136464A (en) * 1990-04-20 1992-08-04 Kabushiki Kaisha Toshiba Housing structure for housing a plurality of electric components
US5103374A (en) * 1990-05-23 1992-04-07 At&T Bell Laboratories Circuit pack cooling using turbulators
FR2668875B1 (fr) * 1990-11-07 1993-02-05 Matra Communication Dispositif de ventilation pour une armoire electronique.
US5121291A (en) * 1991-02-13 1992-06-09 Mentor Systems, Inc. Ventilation system in a portable computer
US6452797B1 (en) * 1997-11-12 2002-09-17 Intel Corporation Fan-cooled card
US6018458A (en) * 1998-04-21 2000-01-25 International Business Machines Corporation Constant impedance air baffle for cooling of electronic card assemblies
US6127663A (en) * 1998-10-09 2000-10-03 Ericsson Inc. Electronics cabinet cooling system
US7069975B1 (en) * 1999-09-16 2006-07-04 Raytheon Company Method and apparatus for cooling with a phase change material and heat pipes
US6668915B1 (en) * 1999-09-28 2003-12-30 Peter Albert Materna Optimized fins for convective heat transfer
US7367385B1 (en) * 1999-09-28 2008-05-06 Materna Peter A Optimized fins for convective heat transfer
US6272012B1 (en) * 2000-02-03 2001-08-07 Crystal Group Inc. System and method for cooling compact PCI circuit cards in a computer
US6280319B1 (en) 2000-05-24 2001-08-28 Motorola, Inc. High availability airflow management system for use in electronic equipment
KR20030048241A (ko) * 2001-12-11 2003-06-19 (주)에드모텍 냉각용 디스펜서를 갖춘 하우징
US7233493B2 (en) * 2004-08-10 2007-06-19 E. I. Du Pont De Nemours And Company Electronic device having a temperature control system including a ductwork assembly
US20070152643A1 (en) * 2005-12-30 2007-07-05 Craft Thomas F Jr Apparatus and method for resistively controlling airflow to circuit packs
EP1871155A1 (en) * 2006-06-21 2007-12-26 Alcatel Lucent Cooled shelf for printed circuit boards
US20080041562A1 (en) * 2006-08-18 2008-02-21 Sun Microsystems, Inc. Airflow bypass and cooling of processors in series
FR2905556B1 (fr) * 2006-08-30 2009-06-26 Thales Sa Baie electronique associant convection naturelle et circulation d'air force pour son refroidissement
JP2008166375A (ja) * 2006-12-27 2008-07-17 Nec Corp プラグインユニット及び電子機器
US7808792B2 (en) * 2007-12-18 2010-10-05 Juniper Networks, Inc. Single fan tray in a midplane architecture
US20100217909A1 (en) * 2009-02-24 2010-08-26 Sun Microsystems, Inc. Field replaceable unit for solid state drive system
US20110111838A1 (en) * 2009-11-12 2011-05-12 Wms Gaming Inc. Thermal Management Systems For Wagering Game Terminals
JP2012004361A (ja) * 2010-06-17 2012-01-05 Hitachi Kokusai Electric Inc サブラックの放熱構造
US8589608B2 (en) 2011-02-26 2013-11-19 International Business Machines Corporation Logic node connection system
US8597032B2 (en) 2011-02-26 2013-12-03 International Business Machines Corporation Electronic assemblies mating system
US8713228B2 (en) 2011-02-26 2014-04-29 International Business Machines Corporation Shared system to operationally connect logic nodes
US8738828B2 (en) 2011-02-26 2014-05-27 International Business Machines Corporation System to operationally connect logic nodes
JP2013030027A (ja) * 2011-07-28 2013-02-07 Toshiba Corp モジュールおよびモジュール型データセンタ
US20130100610A1 (en) * 2011-10-19 2013-04-25 Danfoss A/S Air duct arrangement for cooling a group of at least two heat producing modules
TW201325413A (zh) * 2011-12-07 2013-06-16 Hon Hai Prec Ind Co Ltd 電子裝置及其導風罩
US20140036442A1 (en) * 2012-07-31 2014-02-06 Alcatel-Lucent Deutschland Ag Outdoor stackable telecommunications equipment cabinet family with flexible thermal and interface management and method of deploying the same
CN103677179A (zh) * 2012-09-21 2014-03-26 英业达科技有限公司 服务器
US8743540B1 (en) * 2013-01-29 2014-06-03 Mitsubishi Electric Corporation Electronic apparatus
EP3152544B1 (en) * 2014-06-06 2022-08-03 MTS Systems Corporation Airflow diverter for reduced specimen temperature gradient
JP6285299B2 (ja) * 2014-07-07 2018-02-28 東芝三菱電機産業システム株式会社 半導体装置
CN108733175B (zh) * 2017-04-17 2021-05-07 伊姆西Ip控股有限责任公司 机架以及用于机架的散热装置
FR3085100B1 (fr) * 2018-08-17 2021-06-04 Latelec Baie avionique a cloison de separation souple

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA795886A (en) * 1962-02-16 1968-10-01 The General Electric Company Limited. London Electronic assemblies
US3387648A (en) * 1967-02-23 1968-06-11 Navy Usa Cabinet enclosed recirculation cooling system carried on extensible chassis mountingelectronic modules
BE754822A (fr) * 1969-08-13 1971-02-15 Siemens Ag Agencement de bati pour appareils electroniques
US3626251A (en) * 1970-01-19 1971-12-07 Bendix Corp Air cooling system for cabinet mounted equipment
DE2026777B2 (de) * 1970-06-01 1974-02-07 Standard Elektrik Lorenz Ag, 7000 Stuttgart Umhüllte Spannungsvervielfacheranordnung
IT1032528B (it) * 1974-08-29 1979-06-20 Cselt Centro Studi Lab Telecom Sistema termico per armadi contenenti circuiti elettrici
US4093021A (en) * 1975-12-29 1978-06-06 The Boeing Company Instrument and panel cooling apparatus
DE2613366A1 (de) * 1976-03-29 1977-10-13 Siemens Ag Lueftungsanordnung fuer in gestellen angeordnete, waermeerzeugende baugruppen
SU721935A1 (ru) * 1976-07-07 1980-03-15 Предприятие П/Я В-2203 Шкаф дл охлаждени радиоэлектронной аппаратуры
US4277815A (en) * 1979-06-15 1981-07-07 Westinghouse Electric Corp. Replaceable air seal for force cooled removable electronic units
US4388671A (en) * 1981-06-29 1983-06-14 Honeywell Information Systems Inc. Cathode ray tube display terminal having an enclosure for protection of a logic board

Also Published As

Publication number Publication date
KR910007476B1 (ko) 1991-09-26
IT8523125A0 (it) 1985-12-06
MX158561A (es) 1989-02-15
US4730233A (en) 1988-03-08
DK350486D0 (da) 1986-07-23
PT81580B (pt) 1987-09-30
WO1986003648A1 (en) 1986-06-19
FI862859A7 (fi) 1986-07-04
ES296295Y (es) 1988-02-16
FI862859A0 (fi) 1986-07-04
GR852846B (es) 1985-12-02
AU5200986A (en) 1986-07-01
PT81580A (en) 1985-12-01
DK158187B (da) 1990-04-02
FI862859L (fi) 1986-07-04
DK158187C (da) 1990-09-03
BR8507085A (pt) 1987-03-31
NO863013L (no) 1986-07-25
JPS62500971A (ja) 1987-04-16
AU587215B2 (en) 1989-08-10
YU188885A (en) 1989-08-31
DK350486A (da) 1986-07-23
SE8406220D0 (sv) 1984-12-07
CA1263467A (en) 1989-11-28
SE8406220L (sv) 1986-06-08
NZ214200A (en) 1989-01-06
NO863013D0 (no) 1986-07-25
IT1186410B (it) 1987-11-26
EP0207094A1 (en) 1987-01-07
KR870700204A (ko) 1987-03-14
YU46162B (sh) 1993-05-28
SE456547B (sv) 1988-10-10

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