ES2682048A2 - PROCEDURE FOR THE IMPLEMENTATION OF WIRELESS CHIP TO AN OBJECT (Machine-translation by Google Translate, not legally binding) - Google Patents
PROCEDURE FOR THE IMPLEMENTATION OF WIRELESS CHIP TO AN OBJECT (Machine-translation by Google Translate, not legally binding) Download PDFInfo
- Publication number
- ES2682048A2 ES2682048A2 ES201730344A ES201730344A ES2682048A2 ES 2682048 A2 ES2682048 A2 ES 2682048A2 ES 201730344 A ES201730344 A ES 201730344A ES 201730344 A ES201730344 A ES 201730344A ES 2682048 A2 ES2682048 A2 ES 2682048A2
- Authority
- ES
- Spain
- Prior art keywords
- chip
- procedure
- wireless
- coating
- translation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Eyeglasses (AREA)
- Transceivers (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
PROCEDIMIENTO DE IMPLEMENTACIÓN DE CHIP INALÁMBRICO A UN OBJETO PROCEDURE FOR IMPLEMENTATION OF WIRELESS CHIP TO AN OBJECT
D E S C R I P C I Ó N D E S C R I P C I Ó N
OBJETO DE LA INVENCIÓN 5 OBJECT OF THE INVENTION 5
La invención, tal como expresa el enunciado de la presente memoria descriptiva, se refiere a procedimiento de implementación de chip inalámbrico a un objeto, aportando ventajas y características, que se describirán en detalle más adelante, que suponen una destacable mejora del estado actual de la técnica. 10 The invention, as expressed in the statement of the present specification, refers to the method of implementing a wireless chip to an object, providing advantages and features, which will be described in detail below, which represent a remarkable improvement of the current state of the technique. 10
Más concretamente, el objeto de la invención se centra en un procedimiento mejorado para incorporar un chip inalámbrico NFC (siglas del Inglés Near Field Communications Comunicaciones de campo cercanas) a un objeto cotidiano cualquiera, que permite facilitar dicha incorporación y, sobre todo asegurar su adhesión hermética para que presente 15 resistencia ante agentes externos de temperatura, humedad u otros factores que pudieran dañarlo. More specifically, the object of the invention is focused on an improved method for incorporating an NFC wireless chip (acronym for Near Field Communications Near Field Communications) into any everyday object, which facilitates such incorporation and, above all, ensures its adhesion hermetic so that it presents resistance to external agents of temperature, humidity or other factors that could damage it.
ANTECEDENTES DE LA INVENCIÓN BACKGROUND OF THE INVENTION
20 twenty
Es conocido, en el estado actual de la técnica, la incorporación de chips inalámbricos del tipo que aquí concierne en algunos objetos para obtener información acerca de los mismos u otros usos. It is known, in the current state of the art, the incorporation of wireless chips of the type here concerned in some objects to obtain information about the same or other uses.
Dicha incorporación, sin embargo, cuando se efectúa tras la fabricación del objeto, de 25 manera que el chip es un elemento añadido posteriormente al mismo, resulta complicada, especialmente si este objeto tiene un uso susceptible de sufrir ataques de agentes externos de temperatura, humedad, polvo, golpes u otros, como efectivamente ocurre con la mayor parte de objetos cotidianos, ya que tales agentes pueden dañar fácilmente la estructura del chip y, consecuentemente, hacer que este deje de funcionar correctamente. 30 Such incorporation, however, when it is made after the object is manufactured, so that the chip is an element subsequently added thereto, is complicated, especially if this object has a use capable of suffering attacks from external agents of temperature, humidity , dust, bumps or others, as is the case with most everyday objects, since such agents can easily damage the chip's structure and, consequently, cause it to stop functioning properly. 30
Además, otro de los problemas a la hora de efectuar dicha incorporación, es que la unión del chip a la superficie del objeto sea suficientemente resistente para evitar que el chip se desprenda, con el inconveniente de que el uso de terminados tipos colas pueden llegar a dañar al propio chip. 35 In addition, another problem when making such incorporation is that the chip's attachment to the surface of the object is strong enough to prevent the chip from detaching, with the disadvantage that the use of finished queue types can reach damage the chip itself. 35
Por otra parte, incluso si el chip se incorpora durante la propia fase de fabricación del producto, su implementación presenta los mismos inconvenientes, por lo que, se suele recurrir a la realización de cajeados de dimensiones acordes al chip para que este quede embebido dentro y, posteriormente, cubrirlo con una tapa embellecedora y protectora del mismo material en que está hecho de propio objeto donde se incorpora, o de otro apropiado, 5 todo lo cual incremente notablemente la complejidad de fabricación del producto y tampoco resuelve satisfactoriamente los inconvenientes antedichos si no se usan materiales apropiados y el trabajo no se efectúa de modo muy preciso para evitar resquicios entre las juntas del cajeado y la tapa por las que pueda penetrar humedad u otros agentes externos. On the other hand, even if the chip is incorporated during the product's own manufacturing phase, its implementation presents the same drawbacks, so, it is usually resorted to the realization of recesses of dimensions according to the chip so that it is embedded inside and Subsequently, cover it with a protective and protective cover of the same material in which it is made of its own object where it is incorporated, or of another appropriate one, 5 all of which significantly increases the manufacturing complexity of the product and also does not satisfactorily solve the aforementioned inconveniences if not Appropriate materials are used and the work is not carried out very precisely to avoid cracks between the joints of the recess and the cover through which moisture or other external agents can penetrate.
10 10
El objetivo de la presente invención es, pues, dotar al mercado de un procedimiento de implementación de este tipo de chips que evite tales inconvenientes y permita implementar un chip en cualquier tipo de objeto de manera práctica y sencilla, sin encarecer su coste de fabricación y de modo que pueda efectuarse incluso en objetos ya fabricados, debiendo señalarse que, al menos por parte del solicitante, se desconoce la existencia de ninguna 15 invención que divulgue un procedimiento con unas características técnicas iguales o semejantes a las que presenta el que aquí se preconiza, según se reivindica. The objective of the present invention is therefore to provide the market with an implementation procedure of this type of chips that avoids such inconveniences and allows to implement a chip in any type of object in a practical and simple way, without increasing its manufacturing cost and so that it can be carried out even on objects already manufactured, it should be noted that, at least on the part of the applicant, the existence of any invention that discloses a procedure with the same or similar technical characteristics to those presented here is recommended , as claimed.
Como referencia al estado actual de la técnica, cabe señalar que, al menos por parte del solicitante se desconoce la existencia de ningún procedimiento de implementación de chip 20 inalámbrico a un objeto que presente unas características técnicas, iguales o semejantes a las que presenta el que aquí se preconiza y según se reivindica. As a reference to the current state of the art, it should be noted that, at least on the part of the applicant, the existence of no wireless chip 20 implementation procedure is unknown to an object that has technical characteristics, the same or similar to those presented by the one here it is recommended and as claimed.
EXPLICACIÓN DE LA INVENCIÓN EXPLANATION OF THE INVENTION
25 25
El procedimiento de implementación de chip inalámbrico a un objeto que la invención propone se configura, pues, como una destacable novedad dentro de su campo de aplicación, ya que con él se alcanzan satisfactoriamente los objetivos anteriormente señalados, estando los detalles caracterizadores que lo hacen posible convenientemente recogidos en las reivindicaciones finales que acompañan a la presente descripción. 30 The procedure of implementing a wireless chip to an object that the invention proposes is thus configured as a remarkable novelty within its field of application, since with it the objectives indicated above are satisfactorily achieved, the characterizing details making it possible conveniently set out in the final claims that accompany the present description. 30
De manera concreta, lo que la invención propone, como se ha apuntado anteriormente, es un procedimiento para incorporar un chip inalámbrico NFC a la superficie de un objeto cotidiano tal como una gafas, encendedor, bolígrafo, lápiz, anillo, pulsera, cinturón, casco, o cualquier otro, que permite facilitar dicha incorporación asegurando su adhesión hermética 35 Specifically, what the invention proposes, as noted above, is a procedure for incorporating an NFC wireless chip to the surface of an everyday object such as a glasses, lighter, pen, pencil, ring, bracelet, belt, helmet , or any other, which facilitates such incorporation ensuring its tight adhesion 35
para que presente resistencia ante agentes externos de temperatura, humedad u otros factores para evitar que puedan dañarlo y para permitir que se pueda utilizar colas adecuadas al tipo de material en que esté fabricado el objeto, sin temor a que los agentes químicos que pueda contener dañen al chip. so that it presents resistance to external agents of temperature, humidity or other factors to prevent them from damaging it and to allow tails suitable for the type of material in which the object is manufactured to be used, without fear that the chemical agents it may contain will damage to the chip
5 5
Para ello, y de manera más específica, el procedimiento de la invención contempla, al menos, las siguientes etapas: For this, and more specifically, the process of the invention contemplates at least the following steps:
- Una etapa previa de aplicación de recubrimiento de polipropileno y/o polietileno a altas temperaturas, las cuales varían en función del tipo de material en que esté fabricado el chip, 10 determinando un capa de protección hermética que lo envuelve y lo hace resistente ante agentes externos de temperatura, humedad u otros factores que puedan dañar el chip. - A previous stage of application of coating of polypropylene and / or polyethylene at high temperatures, which vary depending on the type of material in which the chip is manufactured, 10 determining a hermetic protection layer that wraps it and makes it resistant to agents external temperature, humidity or other factors that could damage the chip.
- Y una etapa posterior en que, una vez incorporada la descrita capa de recubrimiento a modo de protección al chip, se efectúa la adhesión de este chip con su recubrimiento a la 15 superficie del objeto, la cual puede ser de diferentes tipos de materiales, como acetato, madera, cuerno, fibra de carbono, resina epoxi, poliamidas, titanio, nylon, o cualquier otra, para lo cual se utiliza el pegamento químico específico que convenga en cada caso, según el citado material. - And a later stage in which, once the described coating layer is incorporated as a protection to the chip, the adhesion of this chip with its coating is made to the surface of the object, which can be of different types of materials, such as acetate, wood, horn, carbon fiber, epoxy resin, polyamides, titanium, nylon, or any other, for which the specific chemical glue that suits each case is used, according to the aforementioned material.
20 twenty
A través de la realización de este procedimiento se consigue implementar a cualquier objeto un chipo que le otorgará una capacidad remota de procesamiento hacia un dispositivo externo inalámbrico compatible con el mismo protocolo del chip inalámbrico implementado. Through the accomplishment of this procedure it is possible to implement a chipo to any object that will grant a remote processing capacity towards a wireless external device compatible with the same protocol of the implemented wireless chip.
Como se ha señalado, el procedimiento es aplicable para implementar chips en objetos 25 cotidianos como son: gafas, encendedor, bolígrafo, lápiz, anillo, pulsera, bisutería, cinturón, casco, etc. Por ejemplo con la finalidad de explotación para marketing digital y/o para manejo del propio chip con el fin de obtener información, ejecutar una acción o desarrollar una tarea mediante dispositivo externo, ya sea un teléfono móvil smartphone, un ordenador portátil, una tableta electrónica o cualquier otro dispositivo compatible con el sistema NFC. 30 As noted, the procedure is applicable to implement chips in everyday objects such as: glasses, lighter, pen, pencil, ring, bracelet, jewelry, belt, helmet, etc. For example, for the purpose of exploitation for digital marketing and / or for handling the chip itself in order to obtain information, execute an action or develop a task through an external device, be it a mobile smartphone, a laptop, an electronic tablet or any other device compatible with the NFC system. 30
El descrito procedimiento de implementación de chip inalámbrico a un objeto representa, pues, una innovación de características estructurales y constitutivas desconocidas hasta ahora, razones que unidas a su utilidad práctica, la dotan de fundamento suficiente para obtener el privilegio de exclusividad que se solicita. 35 The described procedure of implementing wireless chip to an object thus represents an innovation of structural and constitutive characteristics unknown until now, reasons that, together with its practical utility, provide it with sufficient grounds to obtain the privilege of exclusivity that is requested. 35
DESCRIPCIÓN DE LOS DIBUJOS DESCRIPTION OF THE DRAWINGS
Para complementar la descripción que se está realizando y con objeto de ayudar a una mejor comprensión de las características de la invención, se acompaña a la presente memoria descriptiva, como parte integrante de la misma, de un juego de planos, en los que 5 con carácter ilustrativo y no limitativo se ha representado lo siguiente: To complement the description that is being made and in order to help a better understanding of the characteristics of the invention, this descriptive report is attached, as an integral part thereof, of a set of drawings, in which 5 with Illustrative and non-limiting nature has represented the following:
La figura número 1.- Muestra una vista en perspectiva de unas gafas como ejemplo de objeto al que se ha implementado un chip, según le procedimiento objeto de la invención. Figure number 1.- Shows a perspective view of glasses as an example of an object to which a chip has been implemented, according to the method object of the invention.
10 10
Y la figura número 2.- Muestra una vista esquemática, ampliada y sección, según un corte transversal, de dicho chip y dicho objeto, apreciándose el recubrimiento que incorpora el chip previo a su fijación a la superficie del objeto. And figure number 2.- Shows a schematic, enlarged view and section, according to a cross-section, of said chip and said object, the coating incorporating the chip prior to its fixation to the surface of the object being appreciated.
REALIZACIÓN PREFERENTE DE LA INVENCIÓN 15 PREFERRED EMBODIMENT OF THE INVENTION 15
A la vista de las mencionadas figuras, se puede observar en ellas el chip (1) en cuestión, implementado sobre la superficie de un objeto (2), en este caso unas gafas, observándose en la figura 2 cómo para ello el chip (1) presenta una capa de recubrimiento (3) de polipropileno y/o polietileno que lo envuelve completamente y lo protege de los agentes 20 externos, y una capa de pegamento químico como cola (4) que lo mantiene unido a la superficie del objeto (2) In view of the aforementioned figures, the chip (1) in question can be observed, implemented on the surface of an object (2), in this case a pair of glasses, observing in figure 2 how to do this the chip (1 ) has a coating layer (3) of polypropylene and / or polyethylene that completely wraps it and protects it from external agents, and a layer of chemical glue as a glue (4) that keeps it attached to the surface of the object (2 )
Descrita suficientemente la naturaleza de la presente invención, así como la manera de ponerla en práctica, no se considera necesario hacer más extensa su explicación para que 25 cualquier experto en la materia comprenda su alcance y las ventajas que de ella se derivan, haciéndose constar que, dentro de su esencialidad, podrá ser llevada a la práctica en otras formas de realización que difieran en detalle de la indicada a título de ejemplo, y a las cuales alcanzará igualmente la protección que se recaba siempre que no se altere, cambie o modifique su principio fundamental. 30 Describing sufficiently the nature of the present invention, as well as the way of putting it into practice, it is not considered necessary to extend its explanation so that any expert in the field understands its scope and the advantages that derive from it, stating that , within its essentiality, may be implemented in other embodiments that differ in detail from that indicated by way of example, and to which it will also achieve the protection that is sought provided that it is not altered, changed or modified its principle fundamental. 30
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES201730344A ES2682048B1 (en) | 2017-03-15 | 2017-03-15 | PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES201730344A ES2682048B1 (en) | 2017-03-15 | 2017-03-15 | PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ES2682048A2 true ES2682048A2 (en) | 2018-09-18 |
| ES2682048R1 ES2682048R1 (en) | 2018-09-20 |
| ES2682048B1 ES2682048B1 (en) | 2019-06-26 |
Family
ID=63518665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES201730344A Expired - Fee Related ES2682048B1 (en) | 2017-03-15 | 2017-03-15 | PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT |
Country Status (1)
| Country | Link |
|---|---|
| ES (1) | ES2682048B1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201673631U (en) * | 2009-12-24 | 2010-12-15 | 北京意诚信通智能卡股份有限公司 | Security RFID electronic tag |
| CN203079018U (en) * | 2013-02-05 | 2013-07-24 | 广州众码汇信息科技有限公司 | Cigarette box with near field communication (NFC) verification function |
| CN104680224B (en) * | 2015-03-09 | 2018-05-29 | 中山金利宝胶粘制品有限公司 | A kind of label paster for being implanted with RFID chip and preparation method thereof |
| KR101718855B1 (en) * | 2015-07-15 | 2017-03-22 | (주)인테코 | Method of composite sheet for shielding electromagnetic wave and dissipating heat |
-
2017
- 2017-03-15 ES ES201730344A patent/ES2682048B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ES2682048R1 (en) | 2018-09-20 |
| ES2682048B1 (en) | 2019-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2386879T3 (en) | RFID tag for a high temperature environment | |
| EP3669398A4 (en) | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | |
| TWI800679B (en) | Semiconductor package and antenna module including the same | |
| SG109529A1 (en) | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | |
| JP2010199541A5 (en) | ||
| EP3480010A4 (en) | Protective cover, protective cover package comprising same, and electronic device comprising protective cover | |
| GB2514771B (en) | Methods of securely changing the root key of a chip, and related electronic devices and chips | |
| AU2019202747B2 (en) | Ring type Wearable Terminal and Flexible Substrate | |
| TWI317991B (en) | Semiconductor package with flip chip on leadframe | |
| PT3415577T (en) | Electrically conductive adhesive film, and dicing/die-bonding film using same | |
| TWI365896B (en) | Epoxy resin composition for semiconductor encapsulating use, and semiconductor device | |
| MY185208A (en) | Pouch battery and manufacturing method thereof | |
| EP1865545A4 (en) | Adhesive tape for wafer dicing and chip manufacturing method using same | |
| EP3907814C0 (en) | Battery casing, method for manufacturing the same, and device containing battery casing | |
| EP3780095A4 (en) | Chip encapsulation structure and electronic device | |
| PL3573139T3 (en) | Reuseable pouch type secondary battery, battery module comprising the same and method of reusing battery module | |
| EP2147942A4 (en) | Epoxy resin composition for optical semiconductor device encapsulation, cured body thereof, and optical semiconductor device using the epoxy resin composition | |
| SG10201907327RA (en) | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | |
| ES2682048B1 (en) | PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT | |
| EP3780092A4 (en) | Chip packaging structure and electronic device | |
| HUE063925T2 (en) | Battery protection circuit and battery pack having the same | |
| WO2012116271A3 (en) | High pin count no-lead ic packages with heat-dissipating pad | |
| EP4089917A4 (en) | Chip packaging module and packaging method thereof, and electronic device with chip packaging module | |
| MY179594A (en) | Vehicle rfid tag | |
| SG11202106337WA (en) | Evaluation method for light-curing adhesive, integrated dicing and die-bonding film and manufacturing method for same, and manufacturing method for semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA2A | Patent application published |
Ref document number: 2682048 Country of ref document: ES Kind code of ref document: A2 Effective date: 20180918 |
|
| EC2A | Search report published |
Ref document number: 2682048 Country of ref document: ES Kind code of ref document: R1 Effective date: 20180913 |
|
| FG2A | Definitive protection |
Ref document number: 2682048 Country of ref document: ES Kind code of ref document: B1 Effective date: 20190626 |
|
| FD2A | Announcement of lapse in spain |
Effective date: 20210928 |