ES2682048R1 - PROCEDURE FOR IMPLEMENTATION OF WIRELESS CHIP TO AN OBJECT - Google Patents

PROCEDURE FOR IMPLEMENTATION OF WIRELESS CHIP TO AN OBJECT Download PDF

Info

Publication number
ES2682048R1
ES2682048R1 ES201730344A ES201730344A ES2682048R1 ES 2682048 R1 ES2682048 R1 ES 2682048R1 ES 201730344 A ES201730344 A ES 201730344A ES 201730344 A ES201730344 A ES 201730344A ES 2682048 R1 ES2682048 R1 ES 2682048R1
Authority
ES
Spain
Prior art keywords
chip
wireless chip
implementation
procedure
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES201730344A
Other languages
Spanish (es)
Other versions
ES2682048A2 (en
ES2682048B1 (en
Inventor
Jose Antonio SÁNCHEZ BAÑOS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Desarrollos Agricolas Febesa S L
Desarrollos Agricolas Febesa Sl
Original Assignee
Desarrollos Agricolas Febesa S L
Desarrollos Agricolas Febesa Sl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Desarrollos Agricolas Febesa S L, Desarrollos Agricolas Febesa Sl filed Critical Desarrollos Agricolas Febesa S L
Priority to ES201730344A priority Critical patent/ES2682048B1/en
Publication of ES2682048A2 publication Critical patent/ES2682048A2/en
Publication of ES2682048R1 publication Critical patent/ES2682048R1/en
Application granted granted Critical
Publication of ES2682048B1 publication Critical patent/ES2682048B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Eyeglasses (AREA)
  • Transceivers (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Telephone Set Structure (AREA)

Abstract

Procedimiento de implementación de chip inalámbrico a un objeto, que comprende, al menos:#- Una etapa previa de aplicación de un recubrimiento de polipropileno y/o polietileno mediante calor, determinando un capa de protección hermética que lo hace resistente ante agentes externos de temperatura, humedad u otros factores que puedan dañar el chip,#- Y, una vez incorporada la descrita capa de recubrimiento a modo de protección, una etapa posterior de adhesión del chip a la superficie del objeto en que se quiere implementar, utilizando pegamento químico.Method of implementing a wireless chip to an object, comprising at least: # - A previous stage of applying a polypropylene and / or polyethylene coating by heat, determining a hermetic protection layer that makes it resistant to external temperature agents , humidity or other factors that could damage the chip, # - And, once the described coating layer has been incorporated as a protection, a later stage of adhesion of the chip to the surface of the object in which it is to be implemented, using chemical glue.

ES201730344A 2017-03-15 2017-03-15 PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT Expired - Fee Related ES2682048B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES201730344A ES2682048B1 (en) 2017-03-15 2017-03-15 PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201730344A ES2682048B1 (en) 2017-03-15 2017-03-15 PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT

Publications (3)

Publication Number Publication Date
ES2682048A2 ES2682048A2 (en) 2018-09-18
ES2682048R1 true ES2682048R1 (en) 2018-09-20
ES2682048B1 ES2682048B1 (en) 2019-06-26

Family

ID=63518665

Family Applications (1)

Application Number Title Priority Date Filing Date
ES201730344A Expired - Fee Related ES2682048B1 (en) 2017-03-15 2017-03-15 PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT

Country Status (1)

Country Link
ES (1) ES2682048B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201673631U (en) * 2009-12-24 2010-12-15 北京意诚信通智能卡股份有限公司 Security RFID electronic tag
CN203079018U (en) * 2013-02-05 2013-07-24 广州众码汇信息科技有限公司 Cigarette box with near field communication (NFC) verification function
CN104680224A (en) * 2015-03-09 2015-06-03 中山金利宝胶粘制品有限公司 RFID chip-implanted label sticker and preparation method thereof
KR20170008981A (en) * 2015-07-15 2017-01-25 (주)인테코 Composite sheet for shielding electromagnetic wave and dissipating heat, and method for fabricating the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201673631U (en) * 2009-12-24 2010-12-15 北京意诚信通智能卡股份有限公司 Security RFID electronic tag
CN203079018U (en) * 2013-02-05 2013-07-24 广州众码汇信息科技有限公司 Cigarette box with near field communication (NFC) verification function
CN104680224A (en) * 2015-03-09 2015-06-03 中山金利宝胶粘制品有限公司 RFID chip-implanted label sticker and preparation method thereof
KR20170008981A (en) * 2015-07-15 2017-01-25 (주)인테코 Composite sheet for shielding electromagnetic wave and dissipating heat, and method for fabricating the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ETIQUETAS NFC POLIPROPILENO. Internet, 12/01/2017, [en línea][recuperado el 31/08/2018]. Recuperado de Internet (URL:http://www.etiquetas-nfc.es/ntag-213-etiqueta-nfc), *

Also Published As

Publication number Publication date
ES2682048A2 (en) 2018-09-18
ES2682048B1 (en) 2019-06-26

Similar Documents

Publication Publication Date Title
UY36135A (en) ? A METHOD FOR THE MANUFACTURE OF A MODIFIED SURFACE MATERIAL, A MODIFIED SURFACE MATERIAL AND ITS USE?
CL2016002692A1 (en) Plating element comprising a substrate, a sublayer disposed in the substrate, a sheet layer disposed in the sublayer and a protective layer comprising a thermoplastic material disposed in the sheet layer; method.
AR082818A1 (en) PROCESS TO ACCELERATE THE ACTIVATION OF THERMOEXPANDABLE ADHESIVES / COATINGS USED IN THE PERFORMANCE OF PACKING SUBSTRATES
GB201907575D0 (en) Thermal management phase-change composition, methods of manufacture thereof, and articles containg the composition
WO2017077315A3 (en) Bone implant
AR100394A1 (en) PHOSPHATE ADHESION PROMOTERS
MX2018014214A (en) Two-part cyanoacrylate curable adhesive system.
BR112017027420A2 (en) abrasive article and forming method
MX2016005669A (en) Alginate coating for sett treatment.
MX2016004442A (en) Cyanoacrylate composition.
EP3315573A4 (en) Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
IN2014CH02223A (en)
WO2015047888A3 (en) Heat detachable adhesive constructions, articles made therefrom and method of use thereof
FI20160270A (en) A method of storing snow
BR112017011433A2 (en) nonwoven abrasive wheel with a moisture barrier layer
CO2018000599A2 (en) Contaminant capture coating that includes a cured product of a composition that includes an epoxy resin component that includes at least one alkanolamine modified epoxy resin and at least one hardener
PL3315527T3 (en) Moisture curing hot-melt adhesive with low content of diisocyanate monomers, reduced rest tackiness and high thermal stability
AR102408A1 (en) CERAMIC SUBSTRATE LAMINATES
ES2682048R1 (en) PROCEDURE FOR IMPLEMENTATION OF WIRELESS CHIP TO AN OBJECT
EP3545783C0 (en) Article of footwear, and method for manufacturing such an article
EP3236350A4 (en) Tigersharc series dsp start-up management chip and method
HUE053640T2 (en) Vascular patch using silk matrix and method of manufacturing the same
MX2020004616A (en) Polyolefin based films with matte surface and improved sealing performance.
SG11202002552PA (en) Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device
EA201692077A1 (en) EPOXY COMPOSITIONS ON WATER BASIS FOR APPLIED REFRACTORY MATERIAL

Legal Events

Date Code Title Description
BA2A Patent application published

Ref document number: 2682048

Country of ref document: ES

Kind code of ref document: A2

Effective date: 20180918

EC2A Search report published

Ref document number: 2682048

Country of ref document: ES

Kind code of ref document: R1

Effective date: 20180913

FG2A Definitive protection

Ref document number: 2682048

Country of ref document: ES

Kind code of ref document: B1

Effective date: 20190626

FD2A Announcement of lapse in spain

Effective date: 20210928