ES267972U - Stack module frame assembly - Google Patents

Stack module frame assembly

Info

Publication number
ES267972U
ES267972U ES1981267972U ES267972U ES267972U ES 267972 U ES267972 U ES 267972U ES 1981267972 U ES1981267972 U ES 1981267972U ES 267972 U ES267972 U ES 267972U ES 267972 U ES267972 U ES 267972U
Authority
ES
Spain
Prior art keywords
stack
base plate
engagement
electrical components
tensioners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1981267972U
Other languages
Spanish (es)
Other versions
ES267972Y (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of ES267972U publication Critical patent/ES267972U/en
Application granted granted Critical
Publication of ES267972Y publication Critical patent/ES267972Y/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

A frame for holding together a stack of electrical components along an axis, the assembly comprising: upper and lower ends arranged transverse to the stack, at either end thereof, with the lower end having a central opening centered on the shaft ; a base plate mounted elastically in the central opening and normally in engagement with the lower end of the stack to elastically load the stack of electrical components; screws in engagement with the base plate to apply pressure in the stack, through the base plate and against the upper end; tensioners mounted transversely to the upper and lower ends, for connecting the upper and extreme ends for displacement of the battery under gravity, to and from engagement with the upper end; a plurality of stoppers mounted at different levels, at least one of the tensioners for retaining the electrical components in positions as a function of the distance travel by the base plate under screw operation. (Machine-translation by Google Translate, not legally binding)
ES1981267972U 1980-02-26 1981-02-26 A FRAME TO KEEP A STACK OF ELECTRICAL COMPONENTS TOGETHER ALONG A SHAFT. Expired ES267972Y (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12468980A 1980-02-26 1980-02-26

Publications (2)

Publication Number Publication Date
ES267972U true ES267972U (en) 1983-05-01
ES267972Y ES267972Y (en) 1983-11-16

Family

ID=22416286

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1981267972U Expired ES267972Y (en) 1980-02-26 1981-02-26 A FRAME TO KEEP A STACK OF ELECTRICAL COMPONENTS TOGETHER ALONG A SHAFT.

Country Status (6)

Country Link
JP (1) JPS56133862A (en)
KR (1) KR830005723A (en)
BR (1) BR8101069A (en)
ES (1) ES267972Y (en)
FR (1) FR2485263A1 (en)
IT (1) IT1168486B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2529387B1 (en) * 1982-06-29 1985-09-06 Jeumont Schneider ASSEMBLY OF SEMICONDUCTOR POWER PADS
CN108206152B (en) * 2018-01-04 2021-05-18 许继集团有限公司 IGBT (insulated Gate Bipolar transistor) switching method and IGBT switching device for implementing same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529586B2 (en) * 1974-02-20 1980-08-05

Also Published As

Publication number Publication date
FR2485263A1 (en) 1981-12-24
ES267972Y (en) 1983-11-16
IT1168486B (en) 1987-05-20
BR8101069A (en) 1981-09-01
IT8141537A0 (en) 1981-02-26
JPS56133862A (en) 1981-10-20
IT8141537A1 (en) 1982-08-26
KR830005723A (en) 1983-09-09
JPS5738032B2 (en) 1982-08-13

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