ES267972U - Stack module frame assembly - Google Patents
Stack module frame assemblyInfo
- Publication number
- ES267972U ES267972U ES1981267972U ES267972U ES267972U ES 267972 U ES267972 U ES 267972U ES 1981267972 U ES1981267972 U ES 1981267972U ES 267972 U ES267972 U ES 267972U ES 267972 U ES267972 U ES 267972U
- Authority
- ES
- Spain
- Prior art keywords
- stack
- base plate
- engagement
- electrical components
- tensioners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Die Bonding (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
A frame for holding together a stack of electrical components along an axis, the assembly comprising: upper and lower ends arranged transverse to the stack, at either end thereof, with the lower end having a central opening centered on the shaft ; a base plate mounted elastically in the central opening and normally in engagement with the lower end of the stack to elastically load the stack of electrical components; screws in engagement with the base plate to apply pressure in the stack, through the base plate and against the upper end; tensioners mounted transversely to the upper and lower ends, for connecting the upper and extreme ends for displacement of the battery under gravity, to and from engagement with the upper end; a plurality of stoppers mounted at different levels, at least one of the tensioners for retaining the electrical components in positions as a function of the distance travel by the base plate under screw operation. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12468980A | 1980-02-26 | 1980-02-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
ES267972U true ES267972U (en) | 1983-05-01 |
ES267972Y ES267972Y (en) | 1983-11-16 |
Family
ID=22416286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1981267972U Expired ES267972Y (en) | 1980-02-26 | 1981-02-26 | A FRAME TO KEEP A STACK OF ELECTRICAL COMPONENTS TOGETHER ALONG A SHAFT. |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS56133862A (en) |
KR (1) | KR830005723A (en) |
BR (1) | BR8101069A (en) |
ES (1) | ES267972Y (en) |
FR (1) | FR2485263A1 (en) |
IT (1) | IT1168486B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2529387B1 (en) * | 1982-06-29 | 1985-09-06 | Jeumont Schneider | ASSEMBLY OF SEMICONDUCTOR POWER PADS |
CN108206152B (en) * | 2018-01-04 | 2021-05-18 | 许继集团有限公司 | IGBT (insulated Gate Bipolar transistor) switching method and IGBT switching device for implementing same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5529586B2 (en) * | 1974-02-20 | 1980-08-05 |
-
1981
- 1981-02-23 BR BR8101069A patent/BR8101069A/en unknown
- 1981-02-26 IT IT41537/81A patent/IT1168486B/en active
- 1981-02-26 JP JP2622581A patent/JPS56133862A/en active Granted
- 1981-02-26 FR FR8103882A patent/FR2485263A1/en not_active Withdrawn
- 1981-02-26 ES ES1981267972U patent/ES267972Y/en not_active Expired
- 1981-02-26 KR KR1019810000640A patent/KR830005723A/en unknown
Also Published As
Publication number | Publication date |
---|---|
FR2485263A1 (en) | 1981-12-24 |
ES267972Y (en) | 1983-11-16 |
IT1168486B (en) | 1987-05-20 |
BR8101069A (en) | 1981-09-01 |
IT8141537A0 (en) | 1981-02-26 |
JPS56133862A (en) | 1981-10-20 |
IT8141537A1 (en) | 1982-08-26 |
KR830005723A (en) | 1983-09-09 |
JPS5738032B2 (en) | 1982-08-13 |
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