ES2621520T3 - Methods and apparatus for applying adhesives with designs to an advancing substrate - Google Patents

Abstract

A method for applying a fluid (130) discharged from a flat nozzle applicator (102) to a substrate (106) in a design, including the flat nozzle applicator (102) a slot opening (114), a first lip ( 116), and a second lip (118), located the slot opening (114) between the first lip (116) and the second lip (118); and the substrate (106) having a first surface (108) arranged opposite to a second surface (110) and a non-limited thickness, Hs, the method comprising the steps of: continuously advancing the substrate (106) in a direction of machine; fitting the substrate (106) with a carrier (104) of the substrate, the substrate carrier (104) comprising: a non-movable support surface (162) and a design element (122), including the design element (122) a design surface (126), wherein the design element (122) extends away from the non-movable support surface (162) to define a first minimum distance, R1, between the design surface (126) and the surface (162) non-adaptable support; placing the carrier (104) of the substrate adjacent to the flat nozzle applicator (102) to define a minimum distance, Hg, between the design surface (126) of the design element (122) and the first lip (116) and the second lip (118) which is less than the non-limited thickness, Hs, of the substrate (106); by advancing the second surface (110) of the substrate (106) beyond the flat nozzle applicator (102) while the first surface (108) of the substrate (106) is disposed on the carrier (104) of the substrate; characterized in that the design surface (126) deviates intermittently towards the non-movable support surface (162) such that a second minimum distance, R2, is defined between the design surface (126) and the surface (126). 162) non-adaptable, where R2 is less than R1, advancing the substrate (104) and the design element (122) beyond the first lip (116), the slot opening (114), and the second lip ( 118) of the flat nozzle applicator (102) while the first surface (108) of the substrate (106) is disposed on the carrier (104) of the substrate; and discharging fluid (130) from the slot opening (114) of the flat nozzle applicator (102) onto the second surface (110) of the substrate (106).

Description

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DESCRIPTION

Methods and apparatus for applying adhesives with designs to an advancing substrate Field of the invention

The present description refers to methods and apparatus that use continuous substrates to manufacture articles, and more specifically, to methods and apparatus for applying viscous fluids, such as adhesives, to an advancing substrate.

Background of the invention

Along an assembly line, various types of articles can be mounted, such as honeycombs and other absorbent articles, adding components to a continuous band of material, and modifying it in another way, during its advance. For example, in some processes, the bands of material that are advancing are combined with other bands of material that are also advancing. In other examples, individual components created from advancing bands of material are combined with advancing bands of material which, in turn, are combined with other bands of advancing material. The material bands and component parts used to make the honeycombs may include: backing sheets, top sheets, absorbent cores, front and / or rear lugs, fastening components and various types of elastic bands and components, such as elastics for the legs, elastic for barrier folds for the legs and elastic for the waist. Once the desired component parts are assembled, the band (s) and the advancing component parts are subjected to a final cut with a blade to separate the band (s) into honeycombs or other individual absorbent articles . Individual honeycombs or absorbent articles can then be folded and packaged.

Various methods and apparatus can be used to join different components to the advancing band and / or otherwise modify the advancing band. For example, some production operations are configured to apply fluids with a relatively high viscosity, such as hot melt adhesives to an advancing web. In some cases, production operations are configured to apply hot melt adhesives in predetermined designs to an advancing band. These operations may include the use of systems and methods such as flat nozzle coating, direct engraving roller coating processes, offset engraving and reverse engraving that are extensively described in the art. However, current systems and methods for applying adhesives with a design to an advancing substrate may have certain limitations.

For example, in the manufacture of absorbent articles such as feminine sanitary napkins, baby nappies, and adult incontinence pads, the use of etching coating processes may be masked by contamination of printing cylinders derived from separate fibers of the substrates to be coated. Some problems associated with etching cavities and incomplete fluid transfer are described, for example, in US-7,611,582 B2 and US-6,003,513. Us-2011/0274834 A1 describes methods and apparatus that provide the application of viscous fluids, such as adhesives, in predetermined designs to an advancing substrate. The fluid application apparatus includes a flat nozzle applicator and a substrate carrier. No. 4,943,541 A describes a process and a device for impregnation and / or application by coating of optionally liquid foamed substances, through a nozzle. The parts of the device carrying out the application are arranged to form an almost flat surface parallel to the surface of the sheet material to be subjected to the application so that the drag end of the application device rests on the sheet material. In some cases, the flat nozzle coating can be used to coat the bands with a design during the manufacture of absorbent products. The use of combs with combs in the transfer processes with flat nozzle can provide a fine resolution and a precise transfer of fluid to the receiving substrate in the transverse axis to the direction of movement of the web. Such nozzle transfer processes can also be configured with electropneumatic switching valves to intermittently transfer adhesive to an advancing substrate. However, the quality and precision of the intermittent fluid transfer to an advancing substrate may be limited by the speed of cycle activation / deactivation of the switching valves used to interrupt the flow of fluid to the flat nozzle of the fluid applicator. . In this way, as the processing speed of the web increases, the ability of the current flat nozzle coating methods to achieve a fine resolution in coating designs by activation / deactivation in the direction of web travel decreases. Therefore, it would be beneficial to provide apparatus and methods that apply adhesives and other fluids to a substrate in designs with relatively high resolutions and high speeds without being limited by the speed of activation / deactivation of the switching valves used to interrupt the flow of fluid to the flat nozzle of the fluid applicator.

Summary of the invention

Aspects of the methods and apparatus of the present specification involve applying fluids on an advancing substrate. The apparatus and methods herein can provide the application of viscous fluids, such as adhesives, in predetermined designs to an advancing substrate. The fluid application apparatus may include a flat nozzle applicator and a substrate carrier. The flat nozzle applicator may include a slot opening, a first lip, and a second lip, the slot opening being located between the first

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lip and the second lip. And the substrate carrier can be adapted to advance the substrate beyond the flat nozzle applicator as the flat nozzle applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, it advances a second surface of the substrate beyond the opening of the slot of the flat nozzle applicator.

In one form, an apparatus applies a fluid in a design to an advancing substrate that has a non-limited thickness, Hs, and having a first surface disposed opposite to a second surface. The apparatus includes a flat nozzle applicator that includes a slot opening, a first lip, and a second lip, the slot opening being located between the first lip and the second lip; a substrate carrier adapted to advance the substrate beyond the flat nozzle applicator, where when the first surface of the substrate is disposed on the substrate carrier, the substrate carrier is adapted to advance the second surface of the substrate beyond of the opening of the groove of the flat nozzle applicator, the substrate carrier comprising a non-movable support surface; and a moldable design element, wherein the moldable design element includes a design surface, and where the moldable design element protrudes outward with respect to the non-movable support surface to define a first minimum distance, R1, between the design surface and the non-adaptable support surface; wherein the substrate carrier is placed adjacent to the flat nozzle applicator to define a minimum distance, Hg, between the design surface of the design element and the first lip and the second lip that is less than the non-limited thickness, Hs, of the substratum; wherein the substrate carrier advances the second surface of the substrate beyond the opening of the groove, the moldable design element is advanced such that the surface of the design advances repeatedly beyond the first lip, the opening of the groove, and the second lip of the flat nozzle applicator; and wherein the design surface deviates from the flat nozzle applicator and the design surface advances along the first lip, the opening of the groove, and the second lip of the flat nozzle applicator to define a second minimum distance, R2 , between the design surface and the non-moldable support surface, such that R2 is less than R1.

In another form, a method can be used to apply a fluid discharged from a flat nozzle applicator to a substrate in a design, the flat nozzle applicator including a slot opening, a first lip, and a second lip, the location being located. slot opening between the first lip and the second lip; and the substrate having a first surface disposed opposite to a second surface and a non-limited thickness, Hs. The method includes the steps of: continuously advancing the substrate in the direction of the machine; the substrate fitting with a substrate carrier, the substrate carrier comprising a non-movable support surface and a design element, the design element including a design surface, wherein the design element extends away from the support surface not adaptable to define a first minimum distance, R1, between the design surface and the non-adaptable support surface; the substrate carrier adjacent to the flat nozzle applicator being positioned to define a minimum distance, Hg, between the design surface of the design element and the first lip and the second lip which is less than the non-limited thickness, Hs, of the substrate; advancing the second surface of the substrate beyond the flat nozzle applicator while the first surface of the substrate is disposed on the substrate carrier; intermittently deflect the design surface towards the non-moldable support surface so that a second minimum distance, R2, between the design surface and the non-mountable surface, where r2 is less than R1, is defined by advancing the substrate and the design element beyond the first lip, the opening of the groove, and the second lip of the flat nozzle applicator while the first surface of the substrate is disposed on the substrate carrier; and discharge the fluid from the opening of the slot of the flat nozzle applicator on the second surface of the substrate.

In yet another form, an absorbent article includes: a top sheet; a backsheet attached to a top sheet, the backing sheet comprising a film; an absorbent core placed between the topsheet and the backsheet; and an adhesive coated by a groove placed on the film, where the adhesive is arranged in individual design areas that have shapes that correspond to design surface shapes on a substrate carrier, the design areas separated by distances, dp, along the direction of the MD machine that corresponds to distances between adjacent design surfaces on a substrate carrier, and where each design area has a variable thickness that defines a cross-sectional profile along the direction of the MD machine, whereby each design area includes a main end portion and a drag end portion separated by a central portion, the drag end portion defining a first thickness, t1, the central portion defining a second thickness, t2, and defining the portion of the drag end a third thickness, t3, and where t1 is greater than t2 and t3, and t2 is practically equal to t3.

Brief description of the drawings

Figure 1 is a perspective view of a fluid application apparatus positioned adjacent to an advancing substrate.

Figure 1A is a side view of a fluid application apparatus that deposits fluid on a substrate that advances in a first illustrative design.

Figure 1B is a side view of a fluid application apparatus that deposits fluid on a substrate that advances in a second illustrative example.

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Figure 1C is a side view of a fluid application apparatus that deposits fluid on a substrate that advances in a third illustrative design.

Figure 1D is a side view of a fluid application apparatus that deposits fluid on a substrate that advances in a fourth illustrative example.

Figure 2A is a perspective view of an embodiment of a substrate carrier that includes a design roller having a continuous base surface and a plurality of design surfaces.

Figure 2B is a detailed view of the cross section of the substrate carrier shown in Figure 2A taken along line 2B-2B.

Figure 2C is a top side view of a substrate showing a first adhesive design illustrative of the previous one.

Figure 3A is a perspective view of an embodiment of a substrate carrier that includes a design roller having a continuous design surface and a plurality of base surfaces.

Figure 3B is a detailed view of the cross section of the substrate carrier shown in Figure 3A taken along line 3B-3B.

Figure 3C is a top side view of a substrate showing a second adhesive design illustrative of the previous one.

Figure 4 is a schematic side cross-sectional view of a carrier of the illustrative substrate.

Figure 4A1 is a detailed view of the carrier of the substrate of Figure 4 that includes a design element that can be molded and a base layer that can be joined together with a base roller.

Figure 4A2 is a detailed view of the design surface of the design element of Figure 4A1 deflected by a force or forces applied (s) to the design surface.

Figure 4B1 is a detailed view of the substrate carrier of Figure 4 which includes a non-moldable design element and a moldable base layer joined with a base roller.

Figure 4B2 is a detailed view of the design surface of the design element of Figure 4B1 deflected by a force or forces applied (s) to the design surface.

Figure 4C1 is a detailed view of the substrate carrier of Figure 4 which includes a moldable design element joined with a base roller.

Figure 4C2 is a detailed view of the design surface of the design element of Figure 4C1 deflected by a force or forces applied (s) to the design surface.

Figure 5 is a schematic side cross-sectional view of a fluid application apparatus.

Figure 6A is a detailed view of the cross section of the substrate carrier of Figure 5 without the substrate wherein the design surface of a design element is adjacent to a first lip, a second lip, and a groove opening of the flat nozzle applicator.

Figure 6B is a detailed view of the cross section of a substrate carrier and a substrate that advances beyond a flat nozzle applicator and showing the substrate between an opening of the flat nozzle applicator slot and a surface of the advancing base.

Figure 6C is a detailed view of the cross-section of the substrate carrier and the substrate of Figure 6B where the surface of the base is advancing beyond the opening of the slot of the flat nozzle applicator such that the substrate it is between the opening of the slot of the flat nozzle applicator and the leading edge of an advancing design surface.

Figure 6D is a detailed view of the cross section of the substrate carrier and the substrate of Figure 6C where the surface of the base has advanced beyond the opening of the slot of the flat nozzle applicator such that the substrate it is between the opening of the groove of the flat nozzle applicator and an advancing design surface.

Figure 6E is a detailed view of the cross section of the substrate carrier and the substrate of Figure 6D where the design surface has advanced beyond the opening of the slot of the flat nozzle applicator.

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Figure 7 is a schematic side cross-sectional view of an embodiment of a fluid application apparatus with a substrate carrier that includes a design tape.

Figure 8 is a schematic side cross-sectional view of another embodiment of a fluid application apparatus with a substrate carrier that includes a design tape.

Figure 9 is a schematic side view of another embodiment of a fluid application apparatus with a substrate carrier that includes a design tape and a backing plate

Figure 10A is a top plan view of a fluid applied in a design to a substrate.

Figure 10B is a cross-sectional view of the substrate and the fluid shown in Figure 10A taken along line 10B-10B.

Figure 11 is a top plan view of a disposable absorbent article.

Detailed description of the invention

The following explanations of some terms may be useful for understanding this description:

Here, "absorbent article" is used to refer to consumer products whose main function is to absorb and retain dirt and debris. Non-limiting examples of absorbent articles include honeycombs, honeycomb panties, adjustable panties, reusable honeycombs, or panties, honeycombs for incontinent adults, and undergarments, honeycombs and liners, feminine hygiene garments such as salvaslip , absorbent insert pieces, and the like.

Here, "honeycomb" is used to refer to an absorbent article generally used by babies and people suffering from incontinence around the lower torso.

Here, the term "disposable" is used to describe absorbent articles that, in general, are not intended to be washed or restored or otherwise reused as absorbent articles (eg, their disposal is expected after a single use and can also be configured to be recycled, composted or disposed of differently and compatible with the environment).

The term "disposed" is used herein to indicate that one or more elements are formed (joined and placed) in a particular place or position as a macro-unit structure with other elements or as a separate element attached to another element.

Here, the expression "joined" encompasses configurations where an element is directly attached to another element by fixing the element directly to the other element, and configurations where an element is indirectly attached to another element by fixing the element to one or more intermediate elements that , in turn, are fixed to the other element.

Here, the term "substrate" is used to describe a material that is primarily two-dimensional (ie, in an XY plane) and whose thickness (in a Z-direction) is relatively small (ie 1/10 or less) compared to its length (in an X direction) and width (in a Y direction). Non-limiting examples of substrates include a layer or layers or fibrous materials, films and sheets such as plastic films or metal sheets that can be used alone or laminated in one or more bands, layers, films and / or sheets. As such, a band is a substrate.

Here, the term "nonwoven" refers to a material made of (long) continuous filaments (fibers) and / or discontinuous (short) filaments (fibers) by processes such as spunbond, meltblown, and the like. . Nonwoven materials do not have a pattern of woven or interwoven filaments.

Here, the term "machine address" (DM) is used to refer to the direction in which the material flows in a process. In addition, the relative placement and movement of the material can be described as flowing in the direction of the machine in a process from upstream to downstream in the process.

Here, the term "transverse direction" (DTM) is used to refer to an address that is generally perpendicular to the machine direction.

The terms "elastic" and "elastomeric" as used herein refer to any material that upon application of a deflection force, can be stretched to an elongated length of at least about 110% of its original relaxed length (it is that is, it can stretch up to 10% more than its original length), without rupture or breakage, and after the release of the applied force, it recovers at least approximately 40% of its elongation. For example, a material having an initial length of 100 mm can extend at least up to 110 mm and, after withdrawal of the force, could retract to a length of at least 106 mm (40% recovery). The term "inelastic" refers herein to any material that is not included in the definition of "elastic" above.

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The term "extensible" as used herein, refers to any material that, after application of a deflection force, can be stretched to an elongated length of at least approximately 110% of its original relaxed length (ie, it can stretch up to 10%), without rupture or breakage, and after the release of the applied force, it shows a small recovery, less than approximately 40% of its elongation.

The terms "activate", "activation" or mechanical activation refer to the process of preparing a substrate, or an elastomeric laminate more extensible than it was before the process.

"Stretching live" includes elastic stretching and bonding of the stretched elastic to a substrate. After joining, the stretched elastic is released causing it to contract, resulting in a "corrugated" substrate. The corrugated substrate can be stretched as the corrugated portion is pushed to approximately the point where the substrate reaches at least one original flat dimension. However, if the substrate is also elastic, then the substrate can be stretched beyond the relaxed length of the substrate before joining with the elastic. The elastic stretches at least 25% of its relaxed length when attached to the substrate.

Here, the term "non-limited thickness" refers to the thickness of the substrate measured according to Edana WSP 120.1 (05), with a circular presser foot having a diameter of 25.40 ± 0.02 mm and an applied force of 2 , 1 N (ie, a pressure of 4.14 ± 0.21 kPa is applied).

Here, the term "moldable" refers to any material with a hardness measured with a hardness meter of 90 or less according to the ASTM International Designation: D2240-05 (Re-approved in 2010) for Type M hardness testers.

Here, the term "non-adaptable" refers to any material with a hardness value greater than 100 HRBW, as defined in the Rockwell B Scale in the American National Standard Designation.

Aspects of the present description involve methods and apparatus that use continuous substrates to manufacture articles, and more specifically, methods and apparatus for applying viscous fluids, on an advancing substrate. The specific embodiments of the apparatus and methods described herein provide the application of viscous fluids, such as adhesives, and in some embodiments, the application of adhesives in predetermined designs to an advancing substrate. The embodiments of a fluid application apparatus are described in more detail below in the context of applying adhesives to an advancing substrate that has a non-limited thickness, Hs, and that has a first surface disposed opposite to a second surface. . The fluid application apparatus may include a flat nozzle applicator and a substrate carrier. The flat nozzle applicator may include a slot opening, a first lip, and a second lip, the slot opening being located between the first lip and the second lip. And the substrate carrier can be adapted to advance the substrate beyond the flat nozzle applicator as the flat nozzle applicator discharges adhesive onto the substrate. In operation, when the first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances the second surface of the substrate beyond the opening of the slot of the flat nozzle applicator. It should be appreciated that the apparatus and processes described herein can be used to apply various types of fluids and adhesives in several different designs to a substrate that advances differently than described and represented herein.

As described in more detail below, the substrate carrier may include a base surface and a design element. The design element includes a design surface and protrudes outward from the base surface. As such, in the substrate carriers configured with a base surface, the design surface and the base surface are separated by a distance, Hp. In addition, the substrate carrier is placed adjacent to the flat nozzle applicator to define a minimum distance, Hg, between the design surface of the design element and the first lip and the second lip that is less than the non-limited thickness, Hs, of the substrate, where the sum of the distance, Hp, and the distance, Hg, is greater than that of the non-limited thickness, Hs, of the substrate. In this way, the substrate carrier advances the second surface of the substrate beyond the opening of the groove, the design element is advanced such that the surface of the design advances repeatedly beyond the first lip, the opening of the groove, and the second lip of the flat nozzle applicator. As described below, the design element and / or the base surface of the substrate carrier can be moldable or compressible. And as such, the design element and / or the base surface of the substrate carrier is compressed intermittently as the substrate advances between the flat nozzle applicator and the design surface. As such, the design surface of the design element deviates away from the flat nozzle applicator as the substrate and the design element move beyond the first lip, the opening of the groove, and the second lip of the nozzle applicator. flat. As the design surface deviates intermittently away from the flat nozzle applicator, the adhesive discharged from the flat nozzle applicator is applied over the second surface of the advancing substrate. More specifically, the adhesive is applied to the substrate in an area that has a shape that is substantially the same as the shape defined by the design surface.

The apparatus and methods described herein may include substrate carriers that have various configurations. For example, in some embodiments, the substrate carrier can be configured as a roller. In

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Other embodiments, the substrate carrier may include an endless belt. The substrate carriers can also use various arrangements on exterior surfaces. For example, the base surface can be configured as a continuous surface and the substrate carrier can include a plurality of design elements separated from one another by the continuous surface. In said configuration, each design element may include a design surface and each design element may protrude outward from the continuous surface such that each design surface is separated from the continuous surface by distance, Hp. In another example, the design surface can be configured as a continuous surface and the base surface can include a plurality of individual base surfaces separated from one another by the design element. In such a configuration, the design element can protrude outward from each of the base surfaces such that each base surface is separated from the continuous surface by distance, Hp. It should be appreciated that the design surface of the design element can be configured in several different shapes and sizes and can be configured to define several different designs. As such, the adhesive can be transferred from the flat nozzle applicator to define various designs on a substrate.

As mentioned above, the apparatus and methods of the present description can be used to apply adhesives to continuous substrates used in the manufacture of absorbent articles. Such substrates can be used in absorbent article components such as, for example: backing sheets, top sheets, absorbent cores, front and / or rear lugs, fixing components and various types of elastic bands and components, such as leg elastics , elastic for leg barrier folds, and elastic for the waist. Illustrative descriptions of components and substrates of absorbent articles are given below with reference to Figure 11. In addition, the substrates may include continuous bands of material and parts of components mounted on carrier substrates or may be in the form of a continuous substrate.

Although much of the present description is provided in the context of manufacturing absorbent articles, it should be appreciated that the apparatus and methods described herein can be applied to the manufacture of other types of articles and products manufactured from continuous substrates. Examples of other products include absorbent articles for inanimate surfaces such as consumer products whose primary function is to absorb and retain dirt and debris that may be solid or liquid and that soils, objects, furniture and the like are removed from inanimate surfaces. Non-limiting examples of absorbent articles for inanimate surfaces include such as dusts, pre-moistened wipes or pads, pre-moistened clothing, paper wipes, dryers and dry cleaning buns. Additional product examples include absorbent articles for animated surfaces whose primary function it is to absorb and contain body exudations and, more specifically, devices that are placed against or in the vicinity of the user's body to absorb and contain various exudations evacuated by the body. Non-limiting examples of incontinent absorbent articles include honeycombs, adjustable pant-type honeycombs, adult incontinent honeycombs and undergarments, feminine hygiene garments such as salvaslip, absorbent insert pieces, and the like, tissue paper, facial wipes or loaves, and training bragapanales. Further examples of products may include components and packaging substrates and / or containers for laundry and coffee washing detergent, which can be produced in granules or sachets and can be manufactured in a conversion or belt process or even individual products produced at high speed such as high speed bottling lines, cosmetics, disposable razors from cartridges, and disposable batteries.

Figure 1 shows a perspective view of an embodiment of an apparatus 100 for applying adhesives to a substrate. The apparatus 100 includes a flat nozzle applicator 102 and a substrate carrier 104. As shown in Figure 1, a substrate 106 is advanced in the machine direction and partially wrapped around the substrate carrier 104. More specifically, the substrate 106 includes a first surface 108 disposed opposite to a second surface 110. And the first surface 108 of the substrate 106 is disposed on an external surface 112 of the carrier 104 of the substrate while the second surface 110 of the substrate 106 move beyond the flat nozzle applicator 102. As described in more detail below, the second surface 110 of the substrate 106 advances beyond the flat nozzle applicator 102 and an adhesive is transferred from the flat nozzle applicator 102 to the second surface of the substrate in a design that is substantially the same as a model defined on the outer surface 112 of the substrate carrier 104. As described in more detail below, the substrate carrier 104 can be configured in various ways to deposit the fluid 130 discharged from a flat nozzle applicator 102 onto a substrate 106 in several different designs, as shown, for example, in Figures 1A to 1D.

It should be appreciated that the flat nozzle applicator 102 shown in Figure 1 is a generic representation of a device that is used to apply adhesive to the substrate 106. The flat nozzle applicator may include a slot opening 114, a first lip 116 and a second lip 118. The first lip 116 may be referred to in the first anterior nozzle lip memory and the second lip 118 may also be referred to herein as the posterior nozzle lip. The slot opening 114 is located between the first lip 116 and the second lip 118. Adhesive or other fluid can be discharged from the slot opening 114 to the second surface 110 of the substrate 106 as the carrier 104 of the substrate advances the substrate beyond the first lip 116, the slot opening 114, and the second lip 118 of the flat nozzle applicator 102. As described in more detail below, the substrate 106 is also intermittently compressed between the flat nozzle applicator 102 and the substrate holder 104 as the substrate 106 moves beyond the flat nozzle applicator 102. It should be appreciated that various forms of flat nozzle applicators can be used herein to apply adhesive or other fluids to a substrate that advances according to the methods and apparatus. For example, US Patent 7,056,386 provides a

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description of the flat nozzle applicators that can be used. Other examples of commercial flat nozzle applicators include the EP11 Series of flat nozzle applicators from Nordson Corporation and the APEX Series of self-adhesive flat nozzle applicators from ITW Dynatec Gmbh.

Various types of substrate carriers 104 may be used according to the apparatus and methods herein. For example, Figures 2A and 2B show an embodiment of a carrier 104 of the substrate configured as a roller 120 adapted to advance a substrate 106 beyond the flat nozzle applicator 102. The outer surface 112 of the substrate carrier 104 shown in Figures 2A and 2B includes a plurality of design elements 122 projecting radially outwardly from a base surface 124. Each design element 122 includes a design surface 126 and the radial projection of the design elements 122 of the base surface 124 defines a distance, Hp, between the design surface 126 and the base surface 124. As shown in Figure 2A and 2B, the base surface 124 is configured as a surface Continuous 128 and the plurality of individual design elements 122 are separated from each other by the continuous surface 128. The design surfaces 126 in Figures 2A and 2B define a rhombus shape. In some embodiments, the shape and size of the design surface 126 of each design element 122 may be identically or substantially identical to each other. It should be appreciated that the number, size and shape of some or all of the design surfaces and / or other design elements may be different. In addition, the distance, Hp, between the base surface 124 and the design surface 126 of the design element 122 may be the same or different from some or all of the design elements.

As described in more detail below, as the substrate carrier 104 advances the substrate 106 beyond the flat nozzle applicator 102, the fluid discharged from the flat nozzle applicator is deposited on the substrate in a corresponding design. substantially to the shapes of the design surfaces of the substrate carrier. For example, Figure 2C shows an illustrative design of the fluid 130 deposited on a second surface 110 of a substrate 106 after advancing beyond a flat nozzle applicator disposed at the same time on a substrate carrier having design elements 122 and Design surfaces 126 similar to those shown in Figures 2A and 2B. As shown in Figure 2C, the fluid 130 is deposited on the substrate 106 in individual design areas 132 that have corresponding rhombus shapes and can reflect the shapes of the design surfaces 126 on the carrier 104 of the substrate shown in Figure 2A.

Figures 3A and 3B show another embodiment of a carrier 104 of the substrate configured as a roller 120 adapted to advance a substrate 106 beyond the flat nozzle applicator 102. The carrier 104 of the substrate shown in Figures 3A and 3B includes a single design element 122 that includes a design surface 126. And the design element 122 protrudes radially outward from a plurality of base surfaces 124. More specifically, the design surface 126 is configured as a continuous surface 134 and the plurality of base surfaces are separated from one another by the design element 122. The radial projection of the design element 122 from the base surfaces 124 defines a distance, Hp, between the design surface 126 and the base surfaces 124. The design surface 126 in Figures 3A and 3B defines a continuous crosslinked design wherein the shape and size of each base surface 124 are identical or substantially identical to each other. It should be appreciated that the number, size, and shape of all base surfaces may be different. In addition, the distance, Hp, between the base surfaces 124 and the design surface 126 of the design element 122 may be the same or different from some or all of the base surfaces. It should also be appreciated that the substrate carrier can be configured without base surfaces. For example, the substrate carrier may include a plurality of perforations and the design surface may be configured as a continuous surface where the plurality of perforations are separated from one another by the design element.

As mentioned above, as the carrier 104 of the substrate advances the substrate 106 beyond the flat nozzle applicator 102, the fluid 130 discharged from the flat nozzle applicator 102 is deposited on the substrate 106 in a corresponding design substantially in the form of the design surface 126 on the substrate carrier 104. For example, Figure 3C shows an illustrative design of the fluid 130 deposited on a second surface 110 of a substrate 106 after being advanced beyond the flat nozzle applicator 102 disposed simultaneously on a carrier 104 of the substrate having an element 122 of design and a design surface 126 similar to that shown in Figures 3A and 3B. As shown in Figure 3C, the fluid 130 is deposited on the substrate 106 in a cross-linked design that defines rhombus-like shapes therebetween and may reflect the shapes of the base surfaces 124 on the carrier 104 of the substrate that is shown in Figures 3A and 3B.

As mentioned above, the substrate carrier can be constructed in various ways such that the base surface and / or the design elements can include moldable materials. In some configurations, the moldable material (s) may be compressible to allow a design surface of a design element to deviate away from the flat nozzle applicator. In this way, the substrate carrier can be configured in such a way that deflection of the design surface away from the flat nozzle applicator compresses the design element and / or the base surface as the substrate and the design element advance further beyond the first lip, the opening of the groove, and the second lip of the flat nozzle applicator.

Figure 4 shows a schematic side cross-sectional view of a carrier 104 of the illustrative substrate that can be configured with moldable materials and components that can be compressed and allow the design surface 126 to deflect in response to a force or forces, F, exerted on the design surface 126. The carrier 104

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of the substrate in Figure 4 is in the form of a roller 120 adapted to rotate about a rotation axis 105. In operation, a force or forces, F, can be exerted on the design surface 126, as the substrate 106 and the design element 122 advances beyond the first lip 116, the slot opening 114 and the second lip 118 of the flat nozzle applicator 102. It should be appreciated that the substrate carrier 104 can be configured in various ways with various different components of moldable materials that allow design surface 126 to deviate.

For example, Figures 4A1 and 4A2 show a detailed view of the carrier 104 of the substrate in the form of a roller 120 such as that of Figure 4, which includes a design element 122 and a base surface 124 bondable to a roller base 160 having a non-movable support surface 162. More specifically, the roller 120 in Figures 4A1 and 4A2 may include a base layer 164 of a moldable material that extends radially outward from the non-moldable support surface 162 to define the surface 124 of the moldable base. In some arrangements, the base layer 164 of moldable material may be formed by a cylindrically shaped sleeve or tube 166 having an inner radial surface 168 and an outer radial surface 170. The inner radial surface 168 may surround all or a portion of the non-movable support surface 162 of the base roller 160 and the outer radial surface 170 may define all or a portion of the base surface 124. In turn, the design element 122 it can include a proximal end portion 172 and a distal end portion 174 that includes the design surface 126, wherein the portion 172 of the proximal end is attached to the outer radial surface 170 of the base layer 164. As such, the element 122 of design may extend radially outwardly from the base layer 164 of moldable material to the distal end portion 174. It should be appreciated that the design element 122 can be joined separately or formed integrally by the base layer 164 moldable. Figure 4A1 shows the design element 122 and the base layer 164 of moldable material in an uncompressed state, where the minimum distance between the design surface 126 and the non-moldable support surface 162 is defined by the distance, R1. Figure 4A2 shows the design element 122 moldable and the base layer 164 of Figure 4A1 in a compressed state where a force or forces, F, are applied to the design surface 126. Since the design element 122 and the base layer 164 are moldable, the force or forces, F, applied (s) to the design surface 126, results in the design element 122 and the base layer 164 being compressed against the non-removable surface 162 of the base roller 160. The compression of the design element 122 and the base layer 164 allows the design surface 126 to deflect in response to the forces, F. As such, the minimum distance between the design surface 126 and the non-adaptable surface 162 is defined as the distance, R2, where R2 is less than R1.

In another example, Figures 4B1 and 4B2 show a detailed view of the carrier 104 of the substrate in the form of a roller 120 such as that of Figure 4, which includes a non-moldable design element 122 and a base surface 124 bonded to a base roller 160 having a non-movable support surface 162. More specifically, the roller 120 in Figures 4B1 and 4B2 may include a base layer 164 of a moldable material that extends radially outward from the non-moldable support surface 162 to define the surface 124 of the moldable base. In some arrangements, the base layer 164 of moldable material may be formed by a cylindrically shaped sleeve or tube 166 having an inner radial surface 168 and an outer radial surface 170. The inner radial surface 168 may surround all or a portion of the non-movable support surface 162 of the base roller 160 and the outer radial surface 170 may define all or a portion of the base surface 124. In turn, the design element 122 it can include a proximal end portion 172 and a distal end portion 174 that includes the design surface 126, wherein the portion 172 of the proximal end is attached to the outer radial surface 170 of the base layer 164. As such, the element 122 of design may extend radially outwardly from the base layer 164 of moldable material to the distal end portion 174. It should be appreciated that the design element 122 can be joined separately or formed integrally by the base layer 164 moldable. Figure 4B1 shows the base layer 164 of moldable material in an uncompressed state, where the minimum distance between the design surface 126 and the non-movable support surface 162 is defined by the distance, R1. Figure 4B2 shows the base layer 164 of Figure 4B1 in a compressed state where a force or forces, F, are applied to the design surface 126. Since the design element 122 is non-moldable and the base layer 164 is moldable, the force or forces, F, applied (s) to the design surface 126, results in the design element 122 pushing against the base layer 164 such that the base layer 164 is compressed between the design element 122 and the non-removable surface 162 of the base roller 160. The compression of the base layer 164 allows the design surface 126 to deflect in response to the forces or forces, F. As such, the minimum distance between the design surface 126 and the non-movable surface 162 is defined as the distance, R2, where R2 is less than R1.

In yet another example, Figures 4C1 and 4C2 show a detailed view of the carrier 104 of the substrate in the form of a roller 120 such as that of Figure 4, which includes a moldable design element 122 attached to a base roller 160. Base roller 160 includes a non-movable outer circumferential bearing surface 162 which also defines the base surface 124. In turn, the design element 122 may include a proximal end portion 172 and a distal end portion 174 that includes surface 126 of design, where the portion 172 of the proximal end is attached to the non-movable support surface 162. Figure 4C1 shows the design element 122 in an uncompressed state, where the minimum distance between the design surface 126 and the non-movable support surface 162 is defined by the distance, R1. Figure 4C2 shows the moldable design element 122 of Figure 4C1 in a compressed state where a force or forces, F, are applied to the design surface 126. Since the design element 122 is moldable, the force or forces, F, applied (s) to the design surface 126, results in the design element 122 being compressed against the non-movable support surface 162 of the base roller 160 The compression of the design element 122 allows the design surface 126 to deviate in response to the forces or forces, F. As such, the minimum distance between the design surface 126 and the non-moldable surface 162 is defined as the distance, R2, where R2 is less than R1. In some cases, the force or forces, F, can be exerted in a radial direction towards the axis of rotation 105.

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As mentioned above, the methods and apparatus herein include a substrate carrier adapted to advance the substrate beyond the flat nozzle applicator. Figure 5 shows a schematic side cross-sectional view of an embodiment of a fluid application apparatus 100 including a substrate carrier 104 and a flat nozzle applicator 102. The substrate 106 includes a first surface 108 and a second surface 110 disposed opposite to the first surface 108. A portion of the first surface 108 of the substrate 106 is disposed on the carrier 104 of the substrate, which can be configured as a roller 120 which it has a plurality of design elements 122 protruding from a plurality of base surfaces 124. It should be appreciated that the substrate carrier 104 shown in Figure 5 can be configured with various features and aspects of any substrate carriers described herein. , including those described above with reference to Figures 1 to 4C2. The roller 120 rotates to advance the second surface 110 of the substrate 106 beyond a flat nozzle applicator 102. A fluid supply system 138 can be used to deliver fluid 130, such as an adhesive, to the flat nozzle applicator 102. It should be appreciated that the fluid supply system can be configured in different ways. For example, as shown in Figure 5, the fluid supply system 138 may include a pump 140 for moving fluid from a tank 142 to the flat nozzle applicator 102. The fluid supply system 138 can also be configured with a pressure relief valve 144 configured to help control the pressure of the fluid 130 fed from the pump 140. The fluid 130 from the fluid supply system 138 passes through the applicator 102 of flat nozzle and slot opening 114 and is transferred to the second surface 110 of the advancing substrate 106.

With continuous references to Figure 5, the fluid 130 passing from the flat nozzle applicator 102 is transferred to the second surface 110 of the substrate 106 in a design or shape that is substantially the same as the design surfaces 126 on the carrier 104 of the substratum. As described in more detail below, the substrate carrier 104 is positioned adjacent to the flat nozzle applicator 102 to define a minimum distance between the design surface 126 and the flat nozzle applicator 102 that is less than the non-limited thickness of the substrate 106. Thus, the design element and / or the base surface may be compressed to allow the design surface 126 of the design element to deviate from the flat nozzle applicator 102 as the substrate 106 and the design surface 126 of the Design element 122 advances beyond the first lip 116, the slot opening 114, and the second lip 118 of the flat nozzle applicator 102. However, the minimum distance between the base surface 124 of the substrate carrier 104 and the flat nozzle applicator 102 is greater than the unrestricted thickness of the substrate 106. Thus, the base surface 124 does not compress as the substrate progresses further of the first lip 116, of the slot opening 114 and the second lip 118 of the flat nozzle applicator 102. Thus, in operation, although the fluid 130 is continuously discharged from the flat nozzle applicator 102, the fluid 130 is transferred to the substrate 106 which advances when the design element 122 and / or the base surface 124 is compressed as the design surfaces 126 on the carrier 102 of the substrate advances beyond the opening 114 of the flat nozzle and deviates from the design surface 126. And the fluid 130 is not transferred to the substrate 106 which advances when the design element 122 and / or the base surface 124 are uncompressed while the base surfaces 124 on the substrate carrier 104 advance beyond the opening 114 of the nozzle flat. The following provides a more detailed description of fluid transfer from the flat nozzle applicator to the substrate with reference to Figures 6A through 6E.

Figure 6A is a detailed view of the cross section of the substrate carrier of Figure 5 shown without the substrate, wherein the design surface 126 of a design element 122 is adjacent to a first lip 116, a second lip 118, and a slot opening 114 of the flat nozzle applicator 102. As shown in Figure 6A, the carrier 104 of the substrate includes a non-movable support surface 162, a base surface 124 and a design element 122 protruding from the base surface 124. In an uncompressed state, the element 122 of design protrudes outward from the base surface 124 to define a distance, Hp, between the design surface 126 and the base surface 124 and to define a minimum distance, R1, between the design surface 126 and the non-movable support surface 162 . The carrier 104 of the substrate is also placed adjacent to the flat nozzle applicator 102 to define a minimum distance, Hg, between the design surface 126 of the uncompressed design element 122 and the first lip 116 and the second lip 118. As described then, the minimum distance, Hg, is less than that of the non-limited thickness, Hs, of the substrate 106 which has advanced through the carrier 104 of the substrate. In addition, the carrier 104 of the substrate is positioned adjacent to the flat nozzle applicator 102 to define a minimum distance, Hb, between the base surface 124 and the first lip 116 and the second lip 118. As described below, the minimum distance, Hb, may be greater than the non-limited thickness, Hs, of the substrate that has advanced through the carrier 104 of the substrate.

Figure 6B is a detailed view of the cross section of a carrier 104 of the substrate of Figure 6A and a substrate 106 that advances beyond the flat nozzle applicator 102. The substrate 106 has a non-limited thickness, Hs, and has a first surface 108 disposed opposite to a second surface 110. The first surface 108 of the substrate 106 is disposed on the carrier 104 of the substrate. And the substrate 106 and the carrier 104 of the substrate are shown advancing together in the direction of the MD machine, beyond the flat nozzle applicator 102. More specifically, the second surface 110 of the substrate 106 advances beyond the slot opening 114 located between a front lip 116 and a rear lip 118 of the flat nozzle applicator 102. As mentioned above, the carrier 104 of the substrate is placed adjacent to the flat nozzle applicator 102 to define a minimum distance, Hg, between the uncompressed design surface 126 of the design element 122 and the first lip 116 and the second lip 118 which is less than

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non-limited thickness, Hs, of the substrate 106. In addition, the carrier 104 of the substrate is positioned adjacent to the flat nozzle applicator 102 to define a minimum distance, Hb, between the base surface 124 and the first lip 116 and the second lip 118 which is greater than the non-limited thickness, Hs, of the substrate. The apparatus 100 can also be configured such that the sum of the distance, Hp, and the distance, Hg, is greater than the unrestricted thickness, Hs, of the substrate 106. Thus, a portion 106a of the substrate 106 that is located between the slot opening 114 of the flat nozzle applicator 102 and the advancing base surface 124 is not pressed against the base surface 124. Thus, although the fluid 130 is continuously discharged from the slot opening 114, the fluid 130 is not transferred to the second surface 110 of the substrate 106.

Figure 6C is a detailed view of the cross section of the carrier 104 of the substrate and of the substrate 106 of Figure 6B where the base surface 124 is advancing beyond the slot opening 114 of the flat nozzle applicator 102 such that a portion 106b of the substrate 106 is between the first lip 116 of the flat nozzle applicator 102 and the leading edge 146 of an advancing design surface 126. As described above, the minimum distance, Hg, between the design surface 126 of the uncompressed design element 122 and the first lip 116 and the second lip 118 is less than the non-limited thickness, Hs, of the substrate 106. Asf, a portion 106b of the substrate 106 between the design surface 126 and the first lip 116 is pressed against and exerts forces on the design surface 126. In this way, the design element 122 and / or the base surface 124 are compressed, allowing the design surface 126 to deflect from the first lip 116 to define a minimum distance, R2, between the design surface 126 and the surface 162 of support not adaptable. The fluid 130 that is discharged from the slot opening 114 shown in Figure 6C begins to transfer to the second surface 110 of the substrate as the leading edge 146 of the design surface 126 and the adjacent portion of the substrate 106 begins to move beyond opening 114 in the form of a groove.

With continued references to Fig. 6C, the compression of the design element 122 and / or the base surface 124 allows the design surface 126 to deflect from the first lip 116 to define a compressed distance, Hc, between the design surface 126 and the first lip 116. When the substrate 106 is prepared from a material, such as a film, the substrate 106 can maintain a thickness that is substantially equal to the non-limited thickness, Hs, advancing at the same time between the design surface 126 and the first lip 116. In this way, the design surface 126 can deviate by a distance represented by the difference of Hg and Hs, and in some cases, the distance R2 can be calculated as:

R2 = R1 + Hg-Hs

In said scenario, the compressed distance, Hc, can also be equal to or substantially equal to the non-limited thickness, Hs.

Referring to Figure 6C, when the substrate 106 is prepared from a material, such as a non-woven material or a laminate that includes a nonwoven layer, the substrate 106 may be compressed to a thickness that is less than the non-limited thickness, Hs, advancing at the same time between the design surface 126 and the first lip 116. In said scenario, the compressed distance, Hc, may be less than that of the non-limited thickness, Hs. In other words, the substrate 106 can be compressed up to a thickness equal to or substantially equal to the compressed distance, Hc. In this way, the design surface 126 can deviate by a distance represented by the difference of Hg and Hc, and in some cases, the distance R2 can be calculated as:

R2 = R1 + Hg-Hc

Figure 6D is a detailed view of the cross section of the carrier 104 of the substrate and of the substrate of Figure 6C wherein the base surface 124 and the leading edge 146 of the design surface 126 has advanced beyond the slot opening 114 of the flat nozzle applicator 102 such that the portion 106b of the advancing substrate 106 is between the slot opening 114 of the flat nozzle applicator 102 and an advancing design surface 126. Because the minimum distance, Hg, between the design surface 126 of the uncompressed design element 122 and the first lip 116 and the second lip 118 is less than that of the non-limited thickness, Hs, of the substrate 106, the portion 106b of the substrate 106 between the design surface 126 and the first lip 116 and the second lip 118 of the flat nozzle applicator 102 press and exert forces on the design surface 126. Thus, the moldable design element 122 and / or the base surface 124 are compressed, allowing the design surface 126 to deviate away from the first lip 116 and the second lip 118. As mentioned above, when the substrate 106 is prepared from a material, such as a film, the substrate 106 may maintain a thickness that is substantially equal to that of the non-limited thickness, Hs, advancing at the same time between the design surface 126 and the first lip 116 and the second lip 118. Of this Thus, the design surface 126 may deviate by a distance represented by the difference of Hg and Hs, and in some cases, the distance R2 can be calculated as: R2 = R1 + Hg-Hs. Also, as mentioned above, when the substrate 106 is prepared from a material, such as a non-woven material or a laminate that includes a nonwoven layer, the substrate 106 can be compressed to a thickness that is less than the non-limited thickness, Hs, advancing at the same time between the design surface 126 and the first lip 116 and the second lip 118. In this way, the design surface 126 can deviate by a distance represented by the difference of Hg and Hc, and in some cases , the distance R2 can be calculated as: R2 = R1 + Hg-Hc. The fluid 130 that is discharged from the slot opening 114 shown in Figure 6D begins to transfer to the second surface 110 of the substrate as the design surface 126 and the adjacent portion 106b of the substrate 106 proceeds beyond the opening 114 slot.

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Figure 6E is a detailed view of the cross section of the carrier 104 of the substrate and the substrate 106 of Figure 6D wherein the portion 106b of the substrate and the design surface 126 have advanced beyond the slot opening 114 of the applicator 102 flat nozzle As shown in Figure 6E, the anterior portion 126a of the design surface 126 is adjacent to the second lip 118 and the posterior portion 126b of the design surface 126 has advanced beyond the second lip 118. As such, the portion 106b of the substrate 106 that advances between the second lip 118 of the flat nozzle applicator 102 and the rear portion 126a of the advancing design surface 126 press and exert forces on the design surface 126. As such, the moldable design element 122 and / or the base surface 124 are compressed, allowing the anterior portion 126a of the design surface 126 to deviate away from the first lip 116 and the second lip 118 to define a minimum distance, R2 , between the previous portion 126a of the design surface 126 and the non-movable support surface 162.

With continued references to Figure 6E, the rear portion 126b of the design surface 126 has advanced beyond the second lip 118 of the flat nozzle applicator 102, and as such, the portion 106b of the substrate 106 has ceased to press the portion rear 126b of the design surface 126 allowing the moldable design element 122 and / or the base surface 124 to return to an uncompressed state where the rear portion 126b of the design surface 126 deviates backward from the surface 162 not moldable in such a way that the minimum distance between the non-movable surface 162 and the rear portion 126b of the design surface 126 is the distance, R1. Once the previous portion 126a of the design surface 126 has also advanced beyond the second lip 118 the remainder of the design element 122 and / or the base surface 124 can return to an uncompressed state where the previous portion 126a and the rear portion 126b of the design surface 126 has deviated away from the non-movable surface 162 such that the minimum distance between the non-movable surface 162 and the design surface 126 is the distance, R1.

Referring to Figure 6E, an uncompressed portion 106c of the advancing substrate 106 is between the slot opening 114 of the flat nozzle applicator 102 and an advancing base surface 124. Because the minimum distance, Hb, between the base surface 124, and the first lip 116 and the second lip 118 that is greater than the non-limited thickness, Hs, of the substrate, a portion 106c of the substrate 106 that advances between the base surface 124, the slot opening 114, and the first lip 116 of the flat nozzle applicator 102 is not compressed. Thus, the fluid 130 that is discharged from the slot opening 114 shown in Figure 6E ceases to transfer to the second surface 110 of the substrate 106 as the base surface 124 and the adjacent uncompressed portion 106c of the substrate advance beyond slot opening 114.

As mentioned above, various shapes and configurations of substrate carriers can be used with the methods and apparatus currently described. For example, Figure 7 shows a schematic side cross-sectional view of an embodiment of a fluid application apparatus 100 with a carrier 104 of the substrate including an endless design belt 148. The design tape 148 is wrapped around two rollers 150 adapted to advance the design tape 148 and the substrate beyond the flat nozzle applicator 102. Design tape 148 may include various combinations, shapes, and different types of design elements 122 and base surfaces 124 and / or perforations 136 as described above. As shown in Figure 7, the flat nozzle applicator 102 is adjacent to the design tape 148 at a location where the design tape 148 is partially wrapped around one of the rollers 150. It should be appreciated that the nozzle applicator 102 flat can be located adjacent to other locations of the design tape 148. For example, Figure 8 shows a schematic side cross-sectional view of an embodiment of a fluid application apparatus 100 where the flat nozzle applicator 102 is adjacent to the design tape 148 at a location between the rollers 150. And Figure 9 shows a schematic side cross-sectional view of the embodiment of Figure 8 with a backing plate 152 located above the design tape 148 where the backing plate 148 provides support to the design tape 148 to help to prevent the design tape from deflecting away from the flat nozzle applicator 102.

With reference to the above description and the associated figures, it should be appreciated that the apparatuses 100 herein can be used to apply the adhesive 130 discharged from a flat nozzle applicator 102 to a substrate 106 in a design by continuously advancing the substrate in the direction of the machine beyond a first lip 116, a second lip 118, and the slot opening 114 in the flat nozzle applicator 102. The substrate 106 may be fitted with a carrier 104 of the substrate that may include a base surface 124 and a design element 122 wherein the design element includes a design surface 126. The design element 122 protrudes from the base surface 124 to define a distance, Hp, between the design surface 126 and the base surface 124. As mentioned above, in some embodiments, the substrate carrier may include perforations 136 instead of or in combination with base surfaces 126 adjacent to design element 122. The carrier 104 of the substrate is placed adjacent to the flat nozzle applicator 102 to define a minimum distance, Hg, between the design surface 126 of the uncompressed design element 122 and the first lip 116 and the second lip 118 which is less than the thickness not limited, Hs, of the substrate 106. The second surface 110 of the substrate 106 may advance beyond the flat nozzle applicator 102 while the first surface 108 of the substrate 106 is disposed on the carrier 104 of the substrate. And the substrate 106 is intermittently compressed between the flat nozzle applicator 102 and the design surface 126 of the design element 122 by advancing the design element as the design surface of the design element advances beyond the first lip 116 , the slot opening 114, and the second lip 118 of the flat nozzle applicator 102 while the first surface 108 of the substrate 106 is disposed on the carrier 104 of the substrate.

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It should be appreciated that the methods and apparatus herein may deposit fluids, such as adhesives, advancing on a substrate that advances in the direction of the MD machine in various styles or designs. For example, Figure 10A shows the fluid 130 deposited on the second surface 110 of a substrate 106 in an illustrative design defined by individual design areas 132 having varying widths in the transverse direction CD and / or locations in the transverse direction CD. Also, because the fluid 130 is deposited on the substrate 106 in the design areas 132 that have corresponding shapes and may reflect the shapes of the design surfaces 126 of the design elements 122 as described above, the fluid 130 may be intermittently deposited to define distances, dp, between design areas 132 along the direction of the machine MD that correspond to the distances between adjacent design surfaces 126 on the substrate carrier 104. In some configurations, fluid 130 may be deposited on the substrate intermittently to define distances between design areas 132 of 30 mm or less along the direction of the substrate machine 106. In addition, fluid 130 may be deposited on the substrate 106 in order to create a variable thickness that defines a cross-sectional profile along the direction of the MD machine. For example, Figure 10B shows a cross-sectional view of the design areas 132 on the substrate 106 of Figure 10A. As shown in Figure 10B along the direction of the MD machine, each design area 132 includes a portion 400 of the drag end and a portion 402 of the drag end separated by a central portion 404. The portion 400 of the drag end defines a first thickness, t1, the central portion defines 404, a second thickness, t2, and the portion 402 of the drag end defines a third thickness, t3. In some configurations, the first thickness, t1, is greater than the second thickness t2 and the third thickness, t3, and the second thickness, t2, may be substantially equal to the third thickness, t3.

As mentioned above, the apparatuses 100 and the methods herein can be used to provide the application of adhesives in designs to substrates and components during the manufacture of various different products. For a specific illustration, Figure 11 shows an example of a disposable absorbent article 250, as described in US-2008/0132865 A1, in the form of a honeycomb 252, which can be developed from said substrates and manipulated components during manufacturing according to the apparatus and methods described herein. In particular, Figure 11 is a plan view of an embodiment of a honeycomb 252 that includes a chassis 254 shown in a flat, unfolded condition, with the portion of honeycomb 252 facing a bearer oriented toward the observer A portion of the chassis structure is removed in Figure 11 to show more clearly the construction and various features that can be included in the honeycomb embodiments.

As shown in Figure 11, honeycomb 252 includes a chassis 254 having a first ear 256, a second ear 258, a third ear 260, and a fourth ear 262. To provide a frame of reference for the present description, the chassis is shown with a longitudinal axis 264 and a lateral axis 266. Chassis 254 is shown having a first waist region 268, a second waist region 270 and a crotch region 272 disposed between the first and second waist regions. The periphery of the honeycomb is defined by a pair of lateral edges 274, 276 extending longitudinally; a first outer edge 278 extending laterally adjacent to the first waist region 268; and a second outer edge 280 extending laterally adjacent to the second waist region 270. As shown in Figure 11, the chassis 254 includes an inner surface 282 oriented towards the body and an outer surface 284 oriented towards the garment. A portion of the chassis structure is removed in Figure 11 to show more clearly the construction of and various features that can be included in the honeycomb. As shown in Figure 11, the chassis 254 of the honeycomb 252 may include an outer cover layer 286 that includes a top sheet 288 and a backsheet 290. An absorbent core 292 may be disposed between a portion of the topsheet 288 and the backsheet 290. As described in more detail below, any one or more of the regions may be stretchable and may include an elastomeric or stratified material as described herein. As such, honeycomb 252 may be configured to accommodate the specific anatomy of the wearer. after application and to maintain coordination with the anatomy of the wearer during use.

The absorbent article may also include a characteristic elastic waist element 202 shown in Figure 11 in the form of a waist band 294 and can provide an improved fit and confinement of the waste. The characteristic elastic waist element 202 can be configured to expand and contract elastically to dynamically fit the wearer's waist. The characteristic elastic waist element 202 may be incorporated into the honeycomb according to the methods described herein and may extend at least longitudinally outwardly from the absorbent core 292 longitudinally outwardly and generally form at least a portion of the first and / or second edges 278, 280 outside of honeycomb 252. In addition, the characteristic elastic waist element can extend laterally to include the ears. Although the characteristic elastic waist element 202 or any of its constituent elements may comprise one or more separate elements predetermined to the honeycomb, the characteristic elastic waist element can be constructed as an extension of other honeycomb elements, such as the backing sheet 290 or top sheet 288, or backing sheet and top sheet. Furthermore, the characteristic elastic waist element 202 can be arranged on the outer surface 284 oriented towards the garment of the chassis 240; the inner surface 282 oriented towards the body; or between interior and exterior oriented surfaces. The characteristic elastic waist element 202 can be constructed with numerous different configurations including those described in US-7,432,413; and US-2007/0142798; and in US-2007/0287983.

As shown in Figure 11, honeycomb 252 may include leg bends 296 that provide better fluid content and other body exudates. In particular, the joint effect folds can provide a sealing effect around the wearer's thighs to avoid leaks. It should be noted that when the honeycomb is

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worn, turned leg folds can be placed in contact with the wearer's thighs, and the extent of the contact and the contact pressure can be determined in part by the orientation of the honeycomb on the wearer's body. The leg folds 296 can be arranged in various ways on the honeycomb 202.

The honeycomb 252 may be provided in the form of a pantyhose-like honeycomb or alternatively a restraint clamping system may be provided that may include fasteners in various locations to help secure the honeycomb in position on the wearer. For example, the fasteners can be located on the first and second ears and can be adapted to precisely attach one or more corresponding fasteners located in the second region of the waist. It should be appreciated that various types of fasteners can be used with the honeycomb.

The components of the disposable absorbent article (i.e., disposable pant, incontinent adult article, sanitary napkin, salvaslip, etc.) described in this specification may at least be comprised of a biofuent content, as described in US-2007 / 0219521A1 Hird et al published on September 20, 2007, US-201 1 / 0139658A1 Hird et al published on June 16, 2011, US-2011 / 0139657A1 Hird et al published on June 16, 2011, US-2011 / 0152812A1 Hird et al published June 23, 2011, US-2011 / 0139662A1 Hird et al published June 16, 2011, and US-2011 / 0139659A1 Hird et al published June 16, 2011. These components include, but are not limited form, upper nonwoven sheets, backsheet films, nonwoven side panels, barrier folds for nonwoven legs, superabsorbent items, nonwoven acquisition layers, nonwoven wrapped cores, adhesives, fastener hooks, support areas or for non-woven fasteners and film bases

In at least one illustrative configuration, a disposable absorbent article component comprises a value of the biological base content of about 10% to about 100% using ASTM D6866-10, method B, in another embodiment, from about 25% to about 75 % and in yet another embodiment, from about 50% to about 60% using ASTM D6866-10, method B.

To apply the methodology of ASTM D6866-10 to determine the biological base content of any disposable absorbent article component, a representative sample of the disposable absorbent article component must be obtained for testing. In at least one embodiment, the disposable absorbent article component can be ground into approximately 20 mesh lower particles using known milling methods (eg, Wiley® mill), and a representative sample of suitable mass taken from the randomly mixed particles.

In the context of the above description, the apparatuses 100 and the methods herein can be used to provide the application of adhesives in designs to substrates and components during the manufacture of an absorbent article. For example, adhesives can be applied to various designs of portions of any upper sheet, films for backing sheets, nonwoven backing sheets, absorbent core, core encapsulating bands, acquisition layers, discharge receiving layer, top sheet layer secondary, folds turned for the legs, characteristic waist elements, ears, and fasteners during the manufacture of an absorbent article. In some cases, the adhesive may be a different color than the substrate. In some applications, the apparatus and methods herein may be adapted to apply adhesives in absorbent core assembly processes, as described, for example, in US-2006 / 0021695A1; US-2006 / 0048880A1; US-2008 / 0215166A1; and US-2010 / 0051166A1. In some cases, the apparatus and methods herein can be configured to apply fluid formulations in the form of moisture indicators, such as those described, for example, in US-2011 / 0137274A1. In other cases, the apparatus and methods herein can be configured to apply fastening adhesives for feminine care items, sanitary napkins, salvaslip pads, adult incontinence pads, and the like, such as those described for example in EP- 0745368A1.

The dimensions and values described herein should not be construed as strictly limited to the exact numerical values indicated, but, unless otherwise indicated, each dimension must be considered to mean both the indicated value and a functionally equivalent range around that value For example, a dimension described as "40 mm" means "approximately 40 mm".

The mention of any document is not an admission that it is prior art with respect to any invention disclosed or claimed herein or that alone, or in any combination with any other reference or references, teaches, suggests, describes any such invention. In addition, if any meaning or definition of a term in this document conflicts with any meaning or definition of the same term in a cited document, the meaning or definition assigned to the term in this document will prevail.

Although certain embodiments of the present invention have been illustrated and described, it is obvious to the person skilled in the art that it is possible to make different changes and modifications without thereby abandoning the scope of the invention. Accordingly, the following claims are intended to cover all such changes and modifications contemplated within the scope of this invention.

Claims (9)

10 fifteen twenty 25 2. 30 3. Four. 35 5. 6. 40 Four. Five 7. 50 8. 55 9. 60 10. A method for applying a fluid (130) discharged from a flat nozzle applicator (102) to a substrate (106) in a design, including the flat nozzle applicator (102) a slot opening (114), a first lip ( 116), and a second lip (118), located the slot opening (114) between the first lip (116) and the second lip (118); and the substrate (106) having a first surface (108) arranged opposite to a second surface (110) and a non-limited thickness, Hs, the method comprising the steps of: continuously advancing the substrate (106) in a direction of machine; fitting the substrate (106) with a carrier (104) of the substrate, the substrate carrier (104) comprising: a non-movable support surface (162) and a design element (122), including the design element (122) a design surface (126), wherein the design element (122) extends away from the non-movable support surface (162) to define a first minimum distance, R1, between the design surface (126) and the surface (162) non-adaptable support; placing the carrier (104) of the substrate adjacent to the flat nozzle applicator (102) to define a minimum distance, Hg, between the design surface (126) of the design element (122) and the first lip (116) and the second lip (118) which is less than the non-limited thickness, Hs, of the substrate (106); advancing the second surface (110) of the substrate (106) beyond the flat nozzle applicator (102) while the first surface (108) of the substrate (106) is disposed on the carrier (104) of the substrate; characterized in that the design surface (126) deviates intermittently towards the non-moldable support surface (162) such that a second minimum distance, R2, is defined between the design surface (126) and the surface (126). 162) non-adaptable, where R2 is less than R1, advancing the substrate (104) and the design element (122) beyond the first lip (116), the slot opening (114), and the second lip ( 118) of the flat nozzle applicator (102) while the first surface (108) of the substrate (106) is disposed on the carrier (104) of the substrate; and discharging fluid (130) from the slot opening (114) of the flat nozzle applicator (102) onto the second surface (110) of the substrate (106). The method of claim 1, wherein the substrate carrier (104) comprises a roller (120). The method of claim 2, the roller (120) comprises a base roller (160) having an outer circumferential surface defining the non-movable support surface (162), and wherein the base roller is adapted to rotate around a axis of rotation (105). The method of claim 3, wherein the design element protrudes radially outward from the axis of rotation (105). The method of claim 1, wherein the substrate carrier (104) comprises an endless belt (148). The method according to any one of the preceding claims, which further comprises a base layer (164) of moldable material that extends radially outwardly from the non-movable support surface (162) to define a base surface, (124) and wherein the Movable design element (122) includes a portion (172) of the proximal end and a portion (174) of the distal end, wherein the portion (172) of the proximal end joins the base surface, (124) the element (122) ) of design extending radially outward from the base surface (126) to the distal end portion (124) The method of claim 1, wherein the carrier (104) of the substrate further comprises a moldable base surface (124), wherein the design element (122) protrudes from the surface (124) moldable base to define a distance, Hp , between the design surface (126) and the moldable base surface (124). The method of claim 7, wherein the substrate carrier (104) is positioned adjacent to the flat nozzle applicator (102) to define a minimum distance, Hg, between the design surface (126) of the design element (122) and the first lip (116) and the second lip (118) which is less than the non-limited thickness, Hs, of the substrate; (106) and wherein the sum of the distance, Hp, and the distance, Hg, is greater than the non-limited thickness, Hs, of the substrate (106). The method of claim 7, wherein the carrier (104) of the substrate further comprises a moldable layer of material (164) between the design element (122) and the non-moldable support surface, (162) and wherein the layer moldable material (164) defines the base surface (124). The method of claim 7, wherein the base surface (124) comprises a continuous surface (128) and wherein the carrier (104) of the substrate further comprises a plurality of individual design elements (122) separated from one another by the surface continuous (128). The method of claim 7, wherein the design surface (126) comprises a continuous surface (128) and the base surface comprises a plurality of individual base surfaces separated from one another by the design element (122). 12. The method according to any of the preceding claims, wherein the fluid (130) comprises an adhesive. 13. The method according to any of the preceding claims, wherein the fluid (130) has a color 5 different from the substrate.