ES246559A1 - UN MÉTODO DE FABRICACION DE UN SISTEMA ELECTRoNICO SEMICONDUCTOR - Google Patents

UN MÉTODO DE FABRICACION DE UN SISTEMA ELECTRoNICO SEMICONDUCTOR

Info

Publication number
ES246559A1
ES246559A1 ES0246559A ES246559A ES246559A1 ES 246559 A1 ES246559 A1 ES 246559A1 ES 0246559 A ES0246559 A ES 0246559A ES 246559 A ES246559 A ES 246559A ES 246559 A1 ES246559 A1 ES 246559A1
Authority
ES
Spain
Prior art keywords
electrode
parts
medium
electrode systems
conductor electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0246559A
Other languages
English (en)
Inventor
Pieter J W Jochems
Johannes J A P Van Amstel
Herre Rinia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES246559A1 publication Critical patent/ES246559A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/944—Shadow

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)

Abstract

Método de fabricación de un sistema electródico semiconductorpor ejemplo un transistor o un diodo de cristal según el cual son eliminadas partes del sistema por la acción de un medio que se proyecta sobre dichas partesestando otras partes protegidas contra la acción de este mediocaracterizándose dicho método por el hecho de que el sistema comprende un cuerpo semiconductor dotado de al menos un electrodo que sobresale de la superficie del cuerposiendo el medio proyectado sobre este electrodo y el área que lo circunda según un ángulocon respecto a la normal a la superficie del cuerpo lindante con el electrodotal que algunas partes del sistema lindantes con el electrodo son eliminadasquedando intactas otras partes.
ES0246559A 1958-01-17 1959-01-14 UN MÉTODO DE FABRICACION DE UN SISTEMA ELECTRoNICO SEMICONDUCTOR Expired ES246559A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL224159A NL110575C (es) 1958-01-17 1958-01-17

Publications (1)

Publication Number Publication Date
ES246559A1 true ES246559A1 (es) 1959-05-01

Family

ID=19751098

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0246559A Expired ES246559A1 (es) 1958-01-17 1959-01-14 UN MÉTODO DE FABRICACION DE UN SISTEMA ELECTRoNICO SEMICONDUCTOR

Country Status (7)

Country Link
US (1) US3072514A (es)
CH (1) CH372384A (es)
DE (1) DE1146203B (es)
ES (1) ES246559A1 (es)
FR (1) FR1213335A (es)
GB (1) GB906941A (es)
NL (1) NL110575C (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1206090B (de) * 1962-04-16 1965-12-02 Telefunken Patent Verfahren zum AEtzen eines Mesatransistors
US3275539A (en) * 1962-11-09 1966-09-27 North American Phillips Compan Method of manufacturing semiconductor devices
NL297451A (es) * 1963-09-03 1965-11-10

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2261988A (en) * 1937-04-08 1941-11-11 Arthur H Gaebel Etching apparatus
CA509126A (en) * 1949-05-28 1955-01-11 Western Electric Company, Incorporated Semiconductor translating devices
US2705765A (en) * 1950-04-03 1955-04-05 Geer Charles Willard Single gun color television receiving tube and screen structure
DE896827C (de) * 1951-09-08 1953-11-16 Licentia Gmbh Verfahren zur formgebenden Bearbeitung von kristallenen Halbleiterkoerpern
US2748325A (en) * 1953-04-16 1956-05-29 Rca Corp Semi-conductor devices and methods for treating same
BE533946A (es) * 1953-12-09
US2829992A (en) * 1954-02-02 1958-04-08 Hughes Aircraft Co Fused junction semiconductor devices and method of making same
BE542056A (es) * 1954-10-15
US2799637A (en) * 1954-12-22 1957-07-16 Philco Corp Method for electrolytic etching
US2813782A (en) * 1956-02-07 1957-11-19 Spanos John Method of masking during semiconductor etching
DE1044982B (de) * 1956-11-02 1958-11-27 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung mit mehreren UEbergaengen zwischen Zonen unterschiedlichen Leitungstyps
US2926076A (en) * 1957-05-14 1960-02-23 Master Etching Machine Company Etching
US2910634A (en) * 1957-05-31 1959-10-27 Ibm Semiconductor device
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units

Also Published As

Publication number Publication date
GB906941A (en) 1962-09-26
US3072514A (en) 1963-01-08
FR1213335A (fr) 1960-03-31
CH372384A (de) 1963-10-15
DE1146203B (de) 1963-03-28
NL110575C (es) 1965-02-15

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