ES2177616T3 - Recipiente para microplaquetas semiconductoras. - Google Patents

Recipiente para microplaquetas semiconductoras.

Info

Publication number
ES2177616T3
ES2177616T3 ES95400683T ES95400683T ES2177616T3 ES 2177616 T3 ES2177616 T3 ES 2177616T3 ES 95400683 T ES95400683 T ES 95400683T ES 95400683 T ES95400683 T ES 95400683T ES 2177616 T3 ES2177616 T3 ES 2177616T3
Authority
ES
Spain
Prior art keywords
arms
oblea
container
semi
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95400683T
Other languages
English (en)
Inventor
David J Ring
Randall S Williams
Richard P Shindley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluoroware Inc
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Application granted granted Critical
Publication of ES2177616T3 publication Critical patent/ES2177616T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Load-Engaging Elements For Cranes (AREA)
  • Suspension Of Electric Lines Or Cables (AREA)

Abstract

SE PRESENTA UN CONTENEDOR PARA OBLEAS SEMICONDUCTORAS. EL CONTENEDOR TIENE UNA PARTE DE RECEPTACULO Y UNA TAPA SEPARABLE. LAS PARTES DE AGARRE DE LA OBLEA EN FORMA DE C ESTAN SUJETAS A LA TAPA PARA FIJAR INDIVIDUALMENTE CADA OBLEA. CADA PARTE DE AGARRE COMPRENDE UN PAR DE BRAZOS ARQUEADOS ELASTICOS QUE SE EXTIENDEN DESDE UNA PARTE INTERMEDIA QUE TIENE UNA PARTE RANURADA PARA EL SOPORTE DEL BORDE DE LA OBLEA, UNAS PARTES RANURADAS PARA LA RETENCION DE LA OBLEA SOBRE LOS EXTREMOS DE LOS BRAZOS, Y UNOS MANGOS QUE SOBRESALEN HACIA EL EXTERIOR DE LOS BRAZOS EN SUS EXTREMOS PARA APLICAR PRESION CONTRA LOS BRAZOS PARA FLEXIONAR LOS BRAZOS.
ES95400683T 1995-03-28 1995-03-28 Recipiente para microplaquetas semiconductoras. Expired - Lifetime ES2177616T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19950400683 EP0735572B1 (en) 1995-03-28 1995-03-28 Container for semiconductor wafers

Publications (1)

Publication Number Publication Date
ES2177616T3 true ES2177616T3 (es) 2002-12-16

Family

ID=8221473

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95400683T Expired - Lifetime ES2177616T3 (es) 1995-03-28 1995-03-28 Recipiente para microplaquetas semiconductoras.

Country Status (3)

Country Link
EP (1) EP0735572B1 (es)
DE (1) DE69527132T2 (es)
ES (1) ES2177616T3 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10021666A1 (de) * 2000-05-04 2001-11-08 Atmel Germany Gmbh Träger für zu bearbeitende Halbleiterscheiben
US7100772B2 (en) 2003-11-16 2006-09-05 Entegris, Inc. Wafer container with door actuated wafer restraint
WO2011132257A1 (ja) * 2010-04-20 2011-10-27 ミライアル株式会社 基板収納容器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3577795D1 (de) * 1985-12-23 1990-06-21 Asyst Technologies Durch eine behaeltertuer betaetigter halter.
JP3250628B2 (ja) * 1992-12-17 2002-01-28 東芝セラミックス株式会社 縦型半導体熱処理用治具

Also Published As

Publication number Publication date
DE69527132T2 (de) 2003-02-06
EP0735572A1 (en) 1996-10-02
DE69527132D1 (de) 2002-07-25
EP0735572B1 (en) 2002-06-19

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