ES2177616T3 - Recipiente para microplaquetas semiconductoras. - Google Patents
Recipiente para microplaquetas semiconductoras.Info
- Publication number
- ES2177616T3 ES2177616T3 ES95400683T ES95400683T ES2177616T3 ES 2177616 T3 ES2177616 T3 ES 2177616T3 ES 95400683 T ES95400683 T ES 95400683T ES 95400683 T ES95400683 T ES 95400683T ES 2177616 T3 ES2177616 T3 ES 2177616T3
- Authority
- ES
- Spain
- Prior art keywords
- arms
- oblea
- container
- semi
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Load-Engaging Elements For Cranes (AREA)
- Suspension Of Electric Lines Or Cables (AREA)
Abstract
SE PRESENTA UN CONTENEDOR PARA OBLEAS SEMICONDUCTORAS. EL CONTENEDOR TIENE UNA PARTE DE RECEPTACULO Y UNA TAPA SEPARABLE. LAS PARTES DE AGARRE DE LA OBLEA EN FORMA DE C ESTAN SUJETAS A LA TAPA PARA FIJAR INDIVIDUALMENTE CADA OBLEA. CADA PARTE DE AGARRE COMPRENDE UN PAR DE BRAZOS ARQUEADOS ELASTICOS QUE SE EXTIENDEN DESDE UNA PARTE INTERMEDIA QUE TIENE UNA PARTE RANURADA PARA EL SOPORTE DEL BORDE DE LA OBLEA, UNAS PARTES RANURADAS PARA LA RETENCION DE LA OBLEA SOBRE LOS EXTREMOS DE LOS BRAZOS, Y UNOS MANGOS QUE SOBRESALEN HACIA EL EXTERIOR DE LOS BRAZOS EN SUS EXTREMOS PARA APLICAR PRESION CONTRA LOS BRAZOS PARA FLEXIONAR LOS BRAZOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19950400683 EP0735572B1 (en) | 1995-03-28 | 1995-03-28 | Container for semiconductor wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2177616T3 true ES2177616T3 (es) | 2002-12-16 |
Family
ID=8221473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95400683T Expired - Lifetime ES2177616T3 (es) | 1995-03-28 | 1995-03-28 | Recipiente para microplaquetas semiconductoras. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0735572B1 (es) |
DE (1) | DE69527132T2 (es) |
ES (1) | ES2177616T3 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10021666A1 (de) * | 2000-05-04 | 2001-11-08 | Atmel Germany Gmbh | Träger für zu bearbeitende Halbleiterscheiben |
US7100772B2 (en) | 2003-11-16 | 2006-09-05 | Entegris, Inc. | Wafer container with door actuated wafer restraint |
WO2011132257A1 (ja) * | 2010-04-20 | 2011-10-27 | ミライアル株式会社 | 基板収納容器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3577795D1 (de) * | 1985-12-23 | 1990-06-21 | Asyst Technologies | Durch eine behaeltertuer betaetigter halter. |
JP3250628B2 (ja) * | 1992-12-17 | 2002-01-28 | 東芝セラミックス株式会社 | 縦型半導体熱処理用治具 |
-
1995
- 1995-03-28 EP EP19950400683 patent/EP0735572B1/en not_active Expired - Lifetime
- 1995-03-28 ES ES95400683T patent/ES2177616T3/es not_active Expired - Lifetime
- 1995-03-28 DE DE1995627132 patent/DE69527132T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69527132T2 (de) | 2003-02-06 |
EP0735572A1 (en) | 1996-10-02 |
DE69527132D1 (de) | 2002-07-25 |
EP0735572B1 (en) | 2002-06-19 |
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