ES2176430T3 - Procedimiento de aplicacion de revestimientos por tension continua de impulsos modulados. - Google Patents
Procedimiento de aplicacion de revestimientos por tension continua de impulsos modulados.Info
- Publication number
- ES2176430T3 ES2176430T3 ES96900953T ES96900953T ES2176430T3 ES 2176430 T3 ES2176430 T3 ES 2176430T3 ES 96900953 T ES96900953 T ES 96900953T ES 96900953 T ES96900953 T ES 96900953T ES 2176430 T3 ES2176430 T3 ES 2176430T3
- Authority
- ES
- Spain
- Prior art keywords
- procedure
- coatings
- application
- continuous voltage
- modulated impulses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/18—Electrophoretic coating characterised by the process using modulated, pulsed, or reversing current
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/08—AC plus DC
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrostatic Spraying Apparatus (AREA)
Abstract
LA PRESENTE INVENCION SE REFIERE A UN NUEVO PROCEDIMIENTO PARA EL RECUBRIMIENTO DE OBJETOS MEDIANTE CORRIENTE CONTINUA, EN EL CUAL UNA TENSION CONTINUA AJUSTABLE SE MODULA POR IMPULSOS CON UNA TENSION ALTERNA AJUSTABLE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19502470A DE19502470A1 (de) | 1995-01-27 | 1995-01-27 | Pulsmoduliertes Gleichspannungsapplikationsverfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2176430T3 true ES2176430T3 (es) | 2002-12-01 |
Family
ID=7752413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96900953T Expired - Lifetime ES2176430T3 (es) | 1995-01-27 | 1996-01-15 | Procedimiento de aplicacion de revestimientos por tension continua de impulsos modulados. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6197179B1 (es) |
EP (1) | EP0809720B1 (es) |
JP (1) | JPH10513503A (es) |
BR (1) | BR9606848A (es) |
DE (2) | DE19502470A1 (es) |
ES (1) | ES2176430T3 (es) |
WO (1) | WO1996023090A1 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6946065B1 (en) * | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
DE19912897A1 (de) * | 1999-03-23 | 2000-09-28 | Daimler Chrysler Ag | Katalysator und Verfahren zur Herstellung eines Katalysators |
WO2002033150A2 (en) * | 2000-10-18 | 2002-04-25 | Tecnu, Inc. | Electrochemical processing power device |
US6620303B2 (en) * | 2001-05-21 | 2003-09-16 | Hong Kong Polytechnic University | Process for making nickel electroforms |
US6746591B2 (en) * | 2001-10-16 | 2004-06-08 | Applied Materials Inc. | ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature |
DE10325656C5 (de) * | 2003-06-06 | 2007-12-27 | Eisenmann Anlagenbau Gmbh & Co. Kg | Elektrophoretische Tauchlackieranlage |
DE102006044050A1 (de) * | 2006-09-20 | 2008-04-03 | Eisenmann Anlagenbau Gmbh & Co. Kg | Verfahren zur elektrophoretischen Beschichtung von Werkstücken und Beschichtungsanlage |
US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
US20220127744A1 (en) * | 2019-02-01 | 2022-04-28 | Lumishield Technologies Incorporated | Methods and Compositions for Improved Adherence of Organic Coatings to Materials |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1534494A (fr) | 1967-08-21 | 1968-07-26 | Peter Stoll Fa | Procédé et dispositif pour le recouvrement par voie électrique d'objets électriquement conducteurs |
DE1796176A1 (de) | 1967-09-14 | 1972-03-23 | Sumitomo Electric Industries | Isolierter Draht und Verfahren zu dessen Herstellung |
US3702813A (en) | 1967-09-14 | 1972-11-14 | Sumitomo Electric Industries | Process of insulating wire by electrophoresis plus non-electrophoresis coating steps |
US3579769A (en) * | 1968-02-19 | 1971-05-25 | Akira Matsushita | Capacitors and production thereof |
US3616434A (en) * | 1968-04-18 | 1971-10-26 | Novachrome Inc | Apparatus with power source for plating |
US3971708A (en) * | 1971-07-08 | 1976-07-27 | Scm Corporation | Electrocoating process |
JPS5852038B2 (ja) * | 1980-03-26 | 1983-11-19 | 株式会社 日本軽金属総合研究所 | 着色アルミニウム材の製造法 |
US4478689A (en) * | 1981-07-31 | 1984-10-23 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
DE69315331T2 (de) * | 1992-04-09 | 1998-06-18 | Raychem Corp | Elektroabscheidungsverfahren zum anbringen von mikroverkapseltem fluessigkristallmaterial auf elektroden |
US5550104A (en) * | 1994-09-09 | 1996-08-27 | Davis, Joseph & Negley | Electrodeposition process for forming superconducting ceramics |
-
1995
- 1995-01-27 DE DE19502470A patent/DE19502470A1/de not_active Ceased
-
1996
- 1996-01-15 EP EP96900953A patent/EP0809720B1/de not_active Expired - Lifetime
- 1996-01-15 DE DE59609188T patent/DE59609188D1/de not_active Expired - Fee Related
- 1996-01-15 WO PCT/EP1996/000138 patent/WO1996023090A1/de active IP Right Grant
- 1996-01-15 ES ES96900953T patent/ES2176430T3/es not_active Expired - Lifetime
- 1996-01-15 JP JP8522583A patent/JPH10513503A/ja active Pending
- 1996-01-15 US US08/894,074 patent/US6197179B1/en not_active Expired - Fee Related
- 1996-01-15 BR BR9606848A patent/BR9606848A/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE19502470A1 (de) | 1996-08-01 |
BR9606848A (pt) | 1997-11-25 |
EP0809720B1 (de) | 2002-05-08 |
EP0809720A1 (de) | 1997-12-03 |
JPH10513503A (ja) | 1998-12-22 |
WO1996023090A1 (de) | 1996-08-01 |
US6197179B1 (en) | 2001-03-06 |
DE59609188D1 (de) | 2002-06-13 |
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