ES2154831T3 - Soporte para datos que incorpora circuitos integrados. - Google Patents
Soporte para datos que incorpora circuitos integrados.Info
- Publication number
- ES2154831T3 ES2154831T3 ES96927555T ES96927555T ES2154831T3 ES 2154831 T3 ES2154831 T3 ES 2154831T3 ES 96927555 T ES96927555 T ES 96927555T ES 96927555 T ES96927555 T ES 96927555T ES 2154831 T3 ES2154831 T3 ES 2154831T3
- Authority
- ES
- Spain
- Prior art keywords
- integrated circuits
- data
- support
- includes integrated
- communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
- Semiconductor Integrated Circuits (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
SE PRESENTA UN SOPORTE DE DATOS CON AL MENOS DOS CIRCUITOS INTEGRADOS INCORPORADOS, DISPUESTOS UNO SOBRE OTROS EN UN AREA PARCIAL DEL SOPORTE, EN QUE AL MENOS UNO DE LOS CIRCUITOS INTEGRADOS PUEDE COMUNICARSE CON APARATOS EXTERNOS MEDIANTE ELEMENTOS DE ACOPLAMIENTO. PARA ORGANIZAR CON LA MAXIMA SENCILLEZ POSIBLE LA COMUNICACION ENTRE LOS CIRCUITOS INTEGRADOS INCORPORADOS, ESTOS CUENTAN CON MEDIOS QUE PERMITEN UNA COMUNICACION ENTRE LOS CIRCUITOS INTEGRADOS MEDIANTE UN ACOPLAMIENTO NO GALVANICO, SIN CONTACTOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19526672A DE19526672A1 (de) | 1995-07-21 | 1995-07-21 | Datenträger mit integriertem Schaltkreis |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2154831T3 true ES2154831T3 (es) | 2001-04-16 |
Family
ID=7767434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96927555T Expired - Lifetime ES2154831T3 (es) | 1995-07-21 | 1996-07-19 | Soporte para datos que incorpora circuitos integrados. |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0842494B1 (es) |
AT (1) | ATE199601T1 (es) |
AU (1) | AU6734996A (es) |
DE (2) | DE19526672A1 (es) |
ES (1) | ES2154831T3 (es) |
RU (1) | RU2160468C2 (es) |
WO (1) | WO1997004416A1 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19922473A1 (de) * | 1999-05-19 | 2000-11-30 | Giesecke & Devrient Gmbh | Chipträgermodul |
FR2797075B1 (fr) * | 1999-07-26 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard |
EP1136941A1 (de) * | 2000-03-24 | 2001-09-26 | Infineon Technologies AG | Tragbare Datenträgeranordnung |
ATE474285T1 (de) | 2000-05-05 | 2010-07-15 | Infineon Technologies Ag | Chipkarte |
FR2831991B1 (fr) * | 2001-11-07 | 2005-02-18 | Gemplus Card Int | Encapsulation localisee d'une connexion pour objet portable intelligent souple |
DE102007017133A1 (de) * | 2007-04-11 | 2008-10-16 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen eines kartenförmigen Datenträgers und kartenförmiger Datenträger |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2511544A1 (fr) * | 1981-08-14 | 1983-02-18 | Dassault Electronique | Module electronique pour carte de transactions automatiques et carte equipee d'un tel module |
US4766516A (en) * | 1987-09-24 | 1988-08-23 | Hughes Aircraft Company | Method and apparatus for securing integrated circuits from unauthorized copying and use |
DE69020077T2 (de) * | 1989-09-09 | 1995-11-09 | Mitsubishi Electric Corp | Integrierte Schaltungskarte. |
JPH06122297A (ja) * | 1992-08-31 | 1994-05-06 | Sony Chem Corp | Icカード及びその製造方法 |
DE4241482A1 (de) * | 1992-12-09 | 1994-06-16 | Siemens Ag | Verfahren und Einrichtung zur Herstellung von IC-Karten |
FR2706701B1 (fr) * | 1993-06-14 | 1997-03-21 | Apple Computer | Dispositif d'isolation galvanique à optocoupleur, et modem l'incorporant. |
FR2727227B1 (fr) * | 1994-11-17 | 1996-12-20 | Schlumberger Ind Sa | Dispositif de securite actif a memoire electronique |
-
1995
- 1995-07-21 DE DE19526672A patent/DE19526672A1/de not_active Withdrawn
-
1996
- 1996-07-19 AT AT96927555T patent/ATE199601T1/de not_active IP Right Cessation
- 1996-07-19 RU RU98103334/09A patent/RU2160468C2/ru not_active IP Right Cessation
- 1996-07-19 AU AU67349/96A patent/AU6734996A/en not_active Abandoned
- 1996-07-19 EP EP96927555A patent/EP0842494B1/de not_active Expired - Lifetime
- 1996-07-19 WO PCT/EP1996/003195 patent/WO1997004416A1/de active IP Right Grant
- 1996-07-19 DE DE59606555T patent/DE59606555D1/de not_active Expired - Lifetime
- 1996-07-19 ES ES96927555T patent/ES2154831T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
RU2160468C2 (ru) | 2000-12-10 |
DE19526672A1 (de) | 1997-01-23 |
EP0842494B1 (de) | 2001-03-07 |
AU6734996A (en) | 1997-02-18 |
EP0842494A1 (de) | 1998-05-20 |
WO1997004416A1 (de) | 1997-02-06 |
ATE199601T1 (de) | 2001-03-15 |
DE59606555D1 (de) | 2001-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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