AU6734996A - Data medium incorporating integrated circuits - Google Patents
Data medium incorporating integrated circuitsInfo
- Publication number
- AU6734996A AU6734996A AU67349/96A AU6734996A AU6734996A AU 6734996 A AU6734996 A AU 6734996A AU 67349/96 A AU67349/96 A AU 67349/96A AU 6734996 A AU6734996 A AU 6734996A AU 6734996 A AU6734996 A AU 6734996A
- Authority
- AU
- Australia
- Prior art keywords
- integrated circuits
- data medium
- medium incorporating
- incorporating integrated
- communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
Described is a data medium with at least two integrated circuits located in a zone one above the other, whereby at least one of the integrated circuits can communicate with external equipment via coupling elements. In order to ensure that communication between the integrated circuits is as simple as possible, the circuits are fitted with means which permit communication between them by non-conductive coupling involving no physical contact.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19526672A DE19526672A1 (en) | 1995-07-21 | 1995-07-21 | Data carrier with integrated circuit |
DE19526672 | 1995-07-21 | ||
PCT/EP1996/003195 WO1997004416A1 (en) | 1995-07-21 | 1996-07-19 | Data medium incorporating integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6734996A true AU6734996A (en) | 1997-02-18 |
Family
ID=7767434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU67349/96A Abandoned AU6734996A (en) | 1995-07-21 | 1996-07-19 | Data medium incorporating integrated circuits |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0842494B1 (en) |
AT (1) | ATE199601T1 (en) |
AU (1) | AU6734996A (en) |
DE (2) | DE19526672A1 (en) |
ES (1) | ES2154831T3 (en) |
RU (1) | RU2160468C2 (en) |
WO (1) | WO1997004416A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19922473A1 (en) * | 1999-05-19 | 2000-11-30 | Giesecke & Devrient Gmbh | Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas |
FR2797075B1 (en) * | 1999-07-26 | 2001-10-12 | Gemplus Card Int | METHOD FOR MANUFACTURING A PORTABLE DEVICE WITH INTEGRATED CIRCUITS, OF THE SMART CARD TYPE OF REDUCED FORMAT IN RELATION TO THE STANDARD FORMAT |
EP1136941A1 (en) * | 2000-03-24 | 2001-09-26 | Infineon Technologies AG | Portable data carrier |
DE50015958D1 (en) | 2000-05-05 | 2010-08-26 | Infineon Technologies Ag | smart card |
FR2831991B1 (en) * | 2001-11-07 | 2005-02-18 | Gemplus Card Int | LOCALIZED ENCAPSULATION OF A CONNECTION FOR SMART INTELLIGENT PORTABLE OBJECT |
DE102007017133A1 (en) * | 2007-04-11 | 2008-10-16 | Giesecke & Devrient Gmbh | Card-shaped data carrier i.e. smart card, manufacturing method, involves producing card body with two dimensional recess, and applying label on card body in region of recess, where recess is hollowed during manufacturing of card body |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2511544A1 (en) * | 1981-08-14 | 1983-02-18 | Dassault Electronique | ELECTRONIC MODULE FOR AUTOMATIC TRANSACTION CARD AND CARD COMPRISING SUCH A MODULE |
US4766516A (en) * | 1987-09-24 | 1988-08-23 | Hughes Aircraft Company | Method and apparatus for securing integrated circuits from unauthorized copying and use |
DE69020077T2 (en) * | 1989-09-09 | 1995-11-09 | Mitsubishi Electric Corp | Integrated circuit card. |
JPH06122297A (en) * | 1992-08-31 | 1994-05-06 | Sony Chem Corp | Ic card and manufacture thereof |
DE4241482A1 (en) * | 1992-12-09 | 1994-06-16 | Siemens Ag | Chip-carrying card mfr. - involves chip recess prodn. by forming blind hole and then embossing |
FR2706701B1 (en) * | 1993-06-14 | 1997-03-21 | Apple Computer | Galvanic isolation device with optocoupler, and modem incorporating it. |
FR2727227B1 (en) * | 1994-11-17 | 1996-12-20 | Schlumberger Ind Sa | ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY |
-
1995
- 1995-07-21 DE DE19526672A patent/DE19526672A1/en not_active Withdrawn
-
1996
- 1996-07-19 EP EP96927555A patent/EP0842494B1/en not_active Expired - Lifetime
- 1996-07-19 DE DE59606555T patent/DE59606555D1/en not_active Expired - Lifetime
- 1996-07-19 RU RU98103334/09A patent/RU2160468C2/en not_active IP Right Cessation
- 1996-07-19 WO PCT/EP1996/003195 patent/WO1997004416A1/en active IP Right Grant
- 1996-07-19 AU AU67349/96A patent/AU6734996A/en not_active Abandoned
- 1996-07-19 ES ES96927555T patent/ES2154831T3/en not_active Expired - Lifetime
- 1996-07-19 AT AT96927555T patent/ATE199601T1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1997004416A1 (en) | 1997-02-06 |
ES2154831T3 (en) | 2001-04-16 |
ATE199601T1 (en) | 2001-03-15 |
EP0842494B1 (en) | 2001-03-07 |
DE59606555D1 (en) | 2001-04-12 |
RU2160468C2 (en) | 2000-12-10 |
DE19526672A1 (en) | 1997-01-23 |
EP0842494A1 (en) | 1998-05-20 |
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