ES2147438T3 - Un aparato suministrador de material de soldadura. - Google Patents
Un aparato suministrador de material de soldadura.Info
- Publication number
- ES2147438T3 ES2147438T3 ES97907201T ES97907201T ES2147438T3 ES 2147438 T3 ES2147438 T3 ES 2147438T3 ES 97907201 T ES97907201 T ES 97907201T ES 97907201 T ES97907201 T ES 97907201T ES 2147438 T3 ES2147438 T3 ES 2147438T3
- Authority
- ES
- Spain
- Prior art keywords
- valve
- pin
- outlet
- hole
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
UN APARATO DE DISTRIBUCION DE SOLDADURA PARA DEPOSITAR SOLDADURA FLUIDA DENTRO Y ALREDEDOR DE UNA ZONA DE UNION DE "PATILLA DENTRO Y A TRAVES DEL AGUJERO" DE UN TABLERO DE CIRCUITO ELECTRONICO QUE COMPRENDE: UN MONTAJE DE VALVULA QUE DEFINE UNA CAMARA DE VALVULA (15) CON UNA ENTRADA Y UNA SALIDA (19), Y QUE TIENE EL ELEMENTO DE VALVULA (35) ACCIONADO POR LA PATILLA (30) DE DICHA ZONA DE UNION DE "PATILLA DENTRO Y A TRAVES DEL AGUJERO" CUANDO LA VALVULA ESTA POSICIONADA EN LA ZONA CONTRA EL TABLERO (22), MOVIENDOSE EL ELEMENTO DE VALVULA (35) DESDE UNA PRIMERA POSICION QUE CIERRA EL FLUJO DE FLUIDO A TRAVES DE LA SALIDA HASTA UNA SEGUNDA POSICION QUE PERMITE QUE EL FLUJO DE FLUIDO PASE A TRAVES DE LA SALIDA (19); MEDIOS (14) PARA MEDIR UN CUERPO PREDETERMINADO DE SOLDADURA FLUIDA (14) QUE SE RETIRA DE LA CAMARA (15) CUANDO DICHO ELEMENTO DE VALVULA (35) ESTA EN LA SEGUNDA POSICION CON EL MONTAJE POSICIONADO EN LA ZONA CONTRA EL TABLERO (22); Y MEDIOS (43) PARA CONTENER LA SOLDADURA FLUIDA RETIRADA (14) EN UNA FORMA PREDETERMINADA Y DENTRO Y ALREDEDOR DE LA ZONA DE UNION DE "PATILLA DENTRO Y A TRAVES DEL AGUJERO" MIENTRAS SE SOLIDIFICA LA SOLDADURA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/627,793 US5743457A (en) | 1996-04-01 | 1996-04-01 | Controlled zone solder dispensing |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2147438T3 true ES2147438T3 (es) | 2000-09-01 |
Family
ID=24516158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97907201T Expired - Lifetime ES2147438T3 (es) | 1996-04-01 | 1997-03-13 | Un aparato suministrador de material de soldadura. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5743457A (es) |
EP (1) | EP0894036B1 (es) |
JP (1) | JP2000508117A (es) |
BR (1) | BR9708382A (es) |
DE (1) | DE69701977T2 (es) |
ES (1) | ES2147438T3 (es) |
TW (1) | TW357954U (es) |
WO (1) | WO1997036710A1 (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2792861B1 (fr) * | 1999-04-30 | 2001-07-06 | Eric Pilat | Procede de realisation de plots de soudure sur un substrat et guide pour la mise en oeuvre du procede |
US6702592B1 (en) | 1999-12-03 | 2004-03-09 | Seagate Technology Llc | Printed circuit board assembly with secondary side rigid electrical pin to mate with compliant contact |
US20020129768A1 (en) * | 2001-03-15 | 2002-09-19 | Carpenter Craig M. | Chemical vapor deposition apparatuses and deposition methods |
US6605176B2 (en) * | 2001-07-13 | 2003-08-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Aperture for linear control of vacuum chamber pressure |
US6677250B2 (en) * | 2001-08-17 | 2004-01-13 | Micron Technology, Inc. | CVD apparatuses and methods of forming a layer over a semiconductor substrate |
US6787185B2 (en) * | 2002-02-25 | 2004-09-07 | Micron Technology, Inc. | Deposition methods for improved delivery of metastable species |
US6887521B2 (en) * | 2002-08-15 | 2005-05-03 | Micron Technology, Inc. | Gas delivery system for pulsed-type deposition processes used in the manufacturing of micro-devices |
US9093446B2 (en) | 2013-01-21 | 2015-07-28 | International Business Machines Corporation | Chip stack with electrically insulating walls |
US9138821B2 (en) * | 2014-01-17 | 2015-09-22 | Medtronic, Inc. | Methods for simultaneously brazing a ferrule and lead pins |
JP6355407B2 (ja) * | 2014-04-24 | 2018-07-11 | 三菱電機株式会社 | 溶融はんだ供給装置 |
DE102018108915A1 (de) * | 2018-04-16 | 2019-10-17 | Atlas Copco Ias Gmbh | Dosierventil |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US989818A (en) * | 1911-03-10 | 1911-04-18 | Harry K Smith | Device for applying liquid solder. |
US3025817A (en) * | 1959-03-25 | 1962-03-20 | Western Electric Co | Apparatus for dispensing fluid material |
US3711020A (en) * | 1970-07-06 | 1973-01-16 | R Zelna | High frequency solder paste gun |
JPS62142073A (ja) * | 1985-12-16 | 1987-06-25 | Nec Corp | ソルダ−スタンプノズル機構 |
US5086953A (en) * | 1990-04-09 | 1992-02-11 | The Boeing Company | Self metering countersink sealant tip |
JPH0471293A (ja) * | 1990-07-11 | 1992-03-05 | Cmk Corp | プリント配線板におけるスルーホール等への導電性物質等の充填方法 |
JPH0494593A (ja) * | 1990-08-10 | 1992-03-26 | Cmk Corp | プリント配線板におけるスルーホールの形成方法 |
JP3583462B2 (ja) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | 電子成分のための微小はんだ付け装置および方法 |
-
1996
- 1996-04-01 US US08/627,793 patent/US5743457A/en not_active Expired - Fee Related
-
1997
- 1997-03-13 EP EP97907201A patent/EP0894036B1/en not_active Expired - Lifetime
- 1997-03-13 BR BR9708382A patent/BR9708382A/pt unknown
- 1997-03-13 JP JP9535000A patent/JP2000508117A/ja active Pending
- 1997-03-13 WO PCT/GB1997/000696 patent/WO1997036710A1/en active IP Right Grant
- 1997-03-13 DE DE69701977T patent/DE69701977T2/de not_active Expired - Fee Related
- 1997-03-13 ES ES97907201T patent/ES2147438T3/es not_active Expired - Lifetime
- 1997-03-28 TW TW087200429U patent/TW357954U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2000508117A (ja) | 2000-06-27 |
WO1997036710A1 (en) | 1997-10-09 |
EP0894036A1 (en) | 1999-02-03 |
BR9708382A (pt) | 1999-08-03 |
DE69701977T2 (de) | 2000-08-17 |
EP0894036B1 (en) | 2000-05-10 |
US5743457A (en) | 1998-04-28 |
TW357954U (en) | 1999-05-01 |
DE69701977D1 (de) | 2000-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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