BR9708382A - Aparelho de distribuição de preparado de solda - Google Patents
Aparelho de distribuição de preparado de soldaInfo
- Publication number
- BR9708382A BR9708382A BR9708382A BR9708382A BR9708382A BR 9708382 A BR9708382 A BR 9708382A BR 9708382 A BR9708382 A BR 9708382A BR 9708382 A BR9708382 A BR 9708382A BR 9708382 A BR9708382 A BR 9708382A
- Authority
- BR
- Brazil
- Prior art keywords
- dispensing apparatus
- solder preparation
- preparation dispensing
- solder
- preparation
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/627,793 US5743457A (en) | 1996-04-01 | 1996-04-01 | Controlled zone solder dispensing |
PCT/GB1997/000696 WO1997036710A1 (en) | 1996-04-01 | 1997-03-13 | A solder dispensing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9708382A true BR9708382A (pt) | 1999-08-03 |
Family
ID=24516158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9708382A BR9708382A (pt) | 1996-04-01 | 1997-03-13 | Aparelho de distribuição de preparado de solda |
Country Status (8)
Country | Link |
---|---|
US (1) | US5743457A (pt) |
EP (1) | EP0894036B1 (pt) |
JP (1) | JP2000508117A (pt) |
BR (1) | BR9708382A (pt) |
DE (1) | DE69701977T2 (pt) |
ES (1) | ES2147438T3 (pt) |
TW (1) | TW357954U (pt) |
WO (1) | WO1997036710A1 (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2792861B1 (fr) * | 1999-04-30 | 2001-07-06 | Eric Pilat | Procede de realisation de plots de soudure sur un substrat et guide pour la mise en oeuvre du procede |
US6702592B1 (en) | 1999-12-03 | 2004-03-09 | Seagate Technology Llc | Printed circuit board assembly with secondary side rigid electrical pin to mate with compliant contact |
US20020129768A1 (en) * | 2001-03-15 | 2002-09-19 | Carpenter Craig M. | Chemical vapor deposition apparatuses and deposition methods |
US6605176B2 (en) * | 2001-07-13 | 2003-08-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Aperture for linear control of vacuum chamber pressure |
US6677250B2 (en) * | 2001-08-17 | 2004-01-13 | Micron Technology, Inc. | CVD apparatuses and methods of forming a layer over a semiconductor substrate |
US6787185B2 (en) * | 2002-02-25 | 2004-09-07 | Micron Technology, Inc. | Deposition methods for improved delivery of metastable species |
US6887521B2 (en) * | 2002-08-15 | 2005-05-03 | Micron Technology, Inc. | Gas delivery system for pulsed-type deposition processes used in the manufacturing of micro-devices |
US9093446B2 (en) | 2013-01-21 | 2015-07-28 | International Business Machines Corporation | Chip stack with electrically insulating walls |
US9138821B2 (en) * | 2014-01-17 | 2015-09-22 | Medtronic, Inc. | Methods for simultaneously brazing a ferrule and lead pins |
JP6355407B2 (ja) * | 2014-04-24 | 2018-07-11 | 三菱電機株式会社 | 溶融はんだ供給装置 |
DE102018108915A1 (de) * | 2018-04-16 | 2019-10-17 | Atlas Copco Ias Gmbh | Dosierventil |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US989818A (en) * | 1911-03-10 | 1911-04-18 | Harry K Smith | Device for applying liquid solder. |
US3025817A (en) * | 1959-03-25 | 1962-03-20 | Western Electric Co | Apparatus for dispensing fluid material |
US3711020A (en) * | 1970-07-06 | 1973-01-16 | R Zelna | High frequency solder paste gun |
JPS62142073A (ja) * | 1985-12-16 | 1987-06-25 | Nec Corp | ソルダ−スタンプノズル機構 |
US5086953A (en) * | 1990-04-09 | 1992-02-11 | The Boeing Company | Self metering countersink sealant tip |
JPH0471293A (ja) * | 1990-07-11 | 1992-03-05 | Cmk Corp | プリント配線板におけるスルーホール等への導電性物質等の充填方法 |
JPH0494593A (ja) * | 1990-08-10 | 1992-03-26 | Cmk Corp | プリント配線板におけるスルーホールの形成方法 |
JP3583462B2 (ja) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | 電子成分のための微小はんだ付け装置および方法 |
-
1996
- 1996-04-01 US US08/627,793 patent/US5743457A/en not_active Expired - Fee Related
-
1997
- 1997-03-13 DE DE69701977T patent/DE69701977T2/de not_active Expired - Fee Related
- 1997-03-13 JP JP9535000A patent/JP2000508117A/ja active Pending
- 1997-03-13 WO PCT/GB1997/000696 patent/WO1997036710A1/en active IP Right Grant
- 1997-03-13 EP EP97907201A patent/EP0894036B1/en not_active Expired - Lifetime
- 1997-03-13 ES ES97907201T patent/ES2147438T3/es not_active Expired - Lifetime
- 1997-03-13 BR BR9708382A patent/BR9708382A/pt unknown
- 1997-03-28 TW TW087200429U patent/TW357954U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
DE69701977T2 (de) | 2000-08-17 |
WO1997036710A1 (en) | 1997-10-09 |
ES2147438T3 (es) | 2000-09-01 |
TW357954U (en) | 1999-05-01 |
JP2000508117A (ja) | 2000-06-27 |
DE69701977D1 (de) | 2000-06-15 |
EP0894036A1 (en) | 1999-02-03 |
US5743457A (en) | 1998-04-28 |
EP0894036B1 (en) | 2000-05-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FN | Request pending | ||
FM | Others concerning applications: unknown petition | ||
B11D | Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time |