BR9708382A - Aparelho de distribuição de preparado de solda - Google Patents

Aparelho de distribuição de preparado de solda

Info

Publication number
BR9708382A
BR9708382A BR9708382A BR9708382A BR9708382A BR 9708382 A BR9708382 A BR 9708382A BR 9708382 A BR9708382 A BR 9708382A BR 9708382 A BR9708382 A BR 9708382A BR 9708382 A BR9708382 A BR 9708382A
Authority
BR
Brazil
Prior art keywords
dispensing apparatus
solder preparation
preparation dispensing
solder
preparation
Prior art date
Application number
BR9708382A
Other languages
English (en)
Inventor
Walter Benedette
Medhat Said
Andrew Z Glovatsky
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Publication of BR9708382A publication Critical patent/BR9708382A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
BR9708382A 1996-04-01 1997-03-13 Aparelho de distribuição de preparado de solda BR9708382A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/627,793 US5743457A (en) 1996-04-01 1996-04-01 Controlled zone solder dispensing
PCT/GB1997/000696 WO1997036710A1 (en) 1996-04-01 1997-03-13 A solder dispensing apparatus

Publications (1)

Publication Number Publication Date
BR9708382A true BR9708382A (pt) 1999-08-03

Family

ID=24516158

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9708382A BR9708382A (pt) 1996-04-01 1997-03-13 Aparelho de distribuição de preparado de solda

Country Status (8)

Country Link
US (1) US5743457A (pt)
EP (1) EP0894036B1 (pt)
JP (1) JP2000508117A (pt)
BR (1) BR9708382A (pt)
DE (1) DE69701977T2 (pt)
ES (1) ES2147438T3 (pt)
TW (1) TW357954U (pt)
WO (1) WO1997036710A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2792861B1 (fr) * 1999-04-30 2001-07-06 Eric Pilat Procede de realisation de plots de soudure sur un substrat et guide pour la mise en oeuvre du procede
US6702592B1 (en) 1999-12-03 2004-03-09 Seagate Technology Llc Printed circuit board assembly with secondary side rigid electrical pin to mate with compliant contact
US20020129768A1 (en) * 2001-03-15 2002-09-19 Carpenter Craig M. Chemical vapor deposition apparatuses and deposition methods
US6605176B2 (en) * 2001-07-13 2003-08-12 Taiwan Semiconductor Manufacturing Co., Ltd. Aperture for linear control of vacuum chamber pressure
US6677250B2 (en) * 2001-08-17 2004-01-13 Micron Technology, Inc. CVD apparatuses and methods of forming a layer over a semiconductor substrate
US6787185B2 (en) * 2002-02-25 2004-09-07 Micron Technology, Inc. Deposition methods for improved delivery of metastable species
US6887521B2 (en) * 2002-08-15 2005-05-03 Micron Technology, Inc. Gas delivery system for pulsed-type deposition processes used in the manufacturing of micro-devices
US9093446B2 (en) 2013-01-21 2015-07-28 International Business Machines Corporation Chip stack with electrically insulating walls
US9138821B2 (en) * 2014-01-17 2015-09-22 Medtronic, Inc. Methods for simultaneously brazing a ferrule and lead pins
JP6355407B2 (ja) * 2014-04-24 2018-07-11 三菱電機株式会社 溶融はんだ供給装置
DE102018108915A1 (de) * 2018-04-16 2019-10-17 Atlas Copco Ias Gmbh Dosierventil

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US989818A (en) * 1911-03-10 1911-04-18 Harry K Smith Device for applying liquid solder.
US3025817A (en) * 1959-03-25 1962-03-20 Western Electric Co Apparatus for dispensing fluid material
US3711020A (en) * 1970-07-06 1973-01-16 R Zelna High frequency solder paste gun
JPS62142073A (ja) * 1985-12-16 1987-06-25 Nec Corp ソルダ−スタンプノズル機構
US5086953A (en) * 1990-04-09 1992-02-11 The Boeing Company Self metering countersink sealant tip
JPH0471293A (ja) * 1990-07-11 1992-03-05 Cmk Corp プリント配線板におけるスルーホール等への導電性物質等の充填方法
JPH0494593A (ja) * 1990-08-10 1992-03-26 Cmk Corp プリント配線板におけるスルーホールの形成方法
JP3583462B2 (ja) * 1993-04-05 2004-11-04 フォード モーター カンパニー 電子成分のための微小はんだ付け装置および方法

Also Published As

Publication number Publication date
DE69701977T2 (de) 2000-08-17
WO1997036710A1 (en) 1997-10-09
ES2147438T3 (es) 2000-09-01
TW357954U (en) 1999-05-01
JP2000508117A (ja) 2000-06-27
DE69701977D1 (de) 2000-06-15
EP0894036A1 (en) 1999-02-03
US5743457A (en) 1998-04-28
EP0894036B1 (en) 2000-05-10

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Legal Events

Date Code Title Description
FN Request pending
FM Others concerning applications: unknown petition
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time