ES2134039T3 - Procedimiento para la metalizacion galvanotecnica de superficies de plastico. - Google Patents
Procedimiento para la metalizacion galvanotecnica de superficies de plastico.Info
- Publication number
- ES2134039T3 ES2134039T3 ES97103913T ES97103913T ES2134039T3 ES 2134039 T3 ES2134039 T3 ES 2134039T3 ES 97103913 T ES97103913 T ES 97103913T ES 97103913 T ES97103913 T ES 97103913T ES 2134039 T3 ES2134039 T3 ES 2134039T3
- Authority
- ES
- Spain
- Prior art keywords
- electrolytic
- plastic surfaces
- galvanotechnical
- metalization
- procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000001465 metallisation Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
LA PRESENTE INVENCION ESTA RELACIONADA CON UN METODO PARA LA METALIZACION GALVANICA DE SUPERFICIES PLASTICAS. LA SUPERFICIE PLASTICA A TRATAR SE METALIZA SIN CORRIENTE EXTERNA CON UNA CAPA BASE METALICA. A CONTINUACION SE DEPOSITA ELECTROLITICAMENTE UNA CAPA DE NIQUELADO SEMIBRILLANTE CON UN ELECTROLITO AL SULFAMATO DE NIQUEL. A CONTINUACION SE APLICAN OTRAS CAPAS ELECTROLITICAS Y/O NO ELECTROLITICAS EN LA SUPERFICIE PLASTICA, ESPECIALMENTE UNA CAPA ELECTROLITICA DE METALIZADO BRILLANTE. EN ESTE METODO SE ELIMINA LA PRECIPITACION ELECTROLITICA DE LA CAPA INTERMEDIA DE COBRE PREVIA AL RECUBRIMIENTO FINAL ELECTROLITICO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19613135A DE19613135A1 (de) | 1996-04-01 | 1996-04-01 | Verfahren zur galvanotechnischen Metallisierung von Kunststoffoberflächen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2134039T3 true ES2134039T3 (es) | 1999-09-16 |
Family
ID=7790244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97103913T Expired - Lifetime ES2134039T3 (es) | 1996-04-01 | 1997-03-08 | Procedimiento para la metalizacion galvanotecnica de superficies de plastico. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0799912B1 (es) |
JP (1) | JPH1018055A (es) |
DE (2) | DE19613135A1 (es) |
ES (1) | ES2134039T3 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT405842B (de) | 1998-06-19 | 1999-11-25 | Miba Gleitlager Ag | Verfahren zum aufbringen einer metallischen schicht auf eine polymeroberfläche eines werkstückes |
US6468672B1 (en) | 2000-06-29 | 2002-10-22 | Lacks Enterprises, Inc. | Decorative chrome electroplate on plastics |
DE10150581A1 (de) | 2001-10-12 | 2003-04-17 | Schlafhorst & Co W | Garnsensor |
DE10303650A1 (de) * | 2003-01-27 | 2004-07-29 | Hansgrohe Ag | Beschichtungsverfahren |
DE10303649A1 (de) * | 2003-01-27 | 2004-07-29 | Hansgrohe Ag | Beschichtungsverfahren |
JP4494309B2 (ja) * | 2005-08-05 | 2010-06-30 | 柿原工業株式会社 | 銅フリーのニッケル−クロム樹脂めっきの耐食性向上方法 |
DE102012221203A1 (de) * | 2012-11-20 | 2014-05-22 | Schaeffler Technologies Gmbh & Co. Kg | Linearführungsanordnung |
CN109219265A (zh) * | 2018-10-18 | 2019-01-15 | 东莞联桥电子有限公司 | 一种基板修金清洗工艺 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4603092A (en) * | 1981-07-01 | 1986-07-29 | Daniel Luch | Metal-polymer composite |
-
1996
- 1996-04-01 DE DE19613135A patent/DE19613135A1/de not_active Withdrawn
-
1997
- 1997-03-08 EP EP97103913A patent/EP0799912B1/de not_active Expired - Lifetime
- 1997-03-08 ES ES97103913T patent/ES2134039T3/es not_active Expired - Lifetime
- 1997-03-08 DE DE59700246T patent/DE59700246D1/de not_active Expired - Lifetime
- 1997-03-31 JP JP9080898A patent/JPH1018055A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE19613135A1 (de) | 1997-10-02 |
DE59700246D1 (de) | 1999-08-12 |
JPH1018055A (ja) | 1998-01-20 |
EP0799912A1 (de) | 1997-10-08 |
EP0799912B1 (de) | 1999-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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