ES2131383T3 - Montaje electronico con drenaje termico, en especial para transformador de alta tension para lampara de descarga de proyector de vehiculo automovil. - Google Patents

Montaje electronico con drenaje termico, en especial para transformador de alta tension para lampara de descarga de proyector de vehiculo automovil.

Info

Publication number
ES2131383T3
ES2131383T3 ES96402679T ES96402679T ES2131383T3 ES 2131383 T3 ES2131383 T3 ES 2131383T3 ES 96402679 T ES96402679 T ES 96402679T ES 96402679 T ES96402679 T ES 96402679T ES 2131383 T3 ES2131383 T3 ES 2131383T3
Authority
ES
Spain
Prior art keywords
thermal drain
electronic assembly
card
high voltage
discharge lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96402679T
Other languages
English (en)
Inventor
Erick Herzberger
Patrick Wacheux
Jean-Marc Nicolai
Bruno Cassese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Electronique SA
Original Assignee
Valeo Electronique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique SA filed Critical Valeo Electronique SA
Application granted granted Critical
Publication of ES2131383T3 publication Critical patent/ES2131383T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

CONJUNTO ELECTRONICO QUE LLEVA UN DREN TERMICO, ASI COMO UNA TARJETA DE CIRCUITOS IMPRESOS DE DOBLE CARA MONTADA POR PRENSADO EN CALIENTE SOBRE DICHO DREN TERMICO (12), LLEVANDO DICHA TARJETA (11) SOBRE SU CARA OPUESTA A DICHO DREN TERMICO (12) UNA PLURALIDAD DE COMPONENTES (13) DE MONTAJE DE SUPERFICIE, CARACTERIZADO PORQUE DICHA TARJETA (11) LLEVA TAMBIEN AL MENOS UN COMPONENTE PASANTE (13A, 13B), PRESENTANDO EL DREN TERMICO UNA CAVIDAD (14) A LA ALTURA DE LA ZONA DE LA TARJETA (11) DE CIRCUITOS IMPRESOS QUE RECIBE ESTE COMPONENTE PASANTE (13A, 13B), ESTANDO LOS EXTREMOS DE LAS PATILLAS DE DICHO COMPONENTES SOLDADAS SOBRE DICHA TARJETA (11) EN EL INTERIOR DE DICHA CAVIDAD (14).
ES96402679T 1995-12-11 1996-12-10 Montaje electronico con drenaje termico, en especial para transformador de alta tension para lampara de descarga de proyector de vehiculo automovil. Expired - Lifetime ES2131383T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9514647A FR2742294B1 (fr) 1995-12-11 1995-12-11 Assemblage electronique a drain thermique, notamment pour transformateur haute tension de lampe a decharge de projecteur de vehicule automobile

Publications (1)

Publication Number Publication Date
ES2131383T3 true ES2131383T3 (es) 1999-07-16

Family

ID=9485364

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96402679T Expired - Lifetime ES2131383T3 (es) 1995-12-11 1996-12-10 Montaje electronico con drenaje termico, en especial para transformador de alta tension para lampara de descarga de proyector de vehiculo automovil.

Country Status (5)

Country Link
US (1) US5798908A (es)
EP (1) EP0779775B1 (es)
DE (1) DE69602245T2 (es)
ES (1) ES2131383T3 (es)
FR (1) FR2742294B1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197870A (ja) * 1997-09-19 1999-04-09 Mitsubishi Heavy Ind Ltd 電子装置
FR2798814B1 (fr) 1999-09-22 2001-11-16 Valeo Vision Perfectionnements aux assemblages electroniques a drain thermique, notamment pour module de commande de lampe a decharge de projecteur de vehicule automobile
US6215663B1 (en) 2000-03-16 2001-04-10 Philips Electronics North America Corporation Printed circuit board assembly with improved thermal performance
US6608752B2 (en) 2001-09-24 2003-08-19 General Electric Company Adaptive heat sink for electronics applications
JP4466256B2 (ja) * 2004-07-29 2010-05-26 アイシン・エィ・ダブリュ株式会社 自動変速機用電子制御装置
US8654528B2 (en) * 2006-11-16 2014-02-18 Autonetworks Technologies, Ltd. Electric connection box
GB2471497B (en) * 2009-07-01 2014-08-20 Tdk Lambda Uk Ltd Heat sink
FR3036918B1 (fr) * 2015-05-29 2018-08-10 Thales Carte electronique et procede de fabrication associe
DE102016108868A1 (de) * 2016-05-13 2017-11-16 Kathrein Werke Kg Adapterplatte für HF-Strukturen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
US4974119A (en) * 1988-09-14 1990-11-27 The Charles Stark Draper Laboratories, Inc. Conforming heat sink assembly
US4979074A (en) * 1989-06-12 1990-12-18 Flavors Technology Printed circuit board heat sink
DE3932213A1 (de) * 1989-09-27 1991-04-04 Bosch Gmbh Robert Verbundanordnung mit leiterplatte
US5196990A (en) * 1990-03-01 1993-03-23 Fuji Electric Co., Ltd. Metal printed circuit board
GB2249825B (en) * 1990-10-15 1994-06-22 Koito Mfg Co Ltd Vehicular headlamp
US5218516A (en) * 1991-10-31 1993-06-08 Northern Telecom Limited Electronic module
DE4240996C1 (de) * 1992-12-05 1994-06-16 Bosch Gmbh Robert Verfahren zur Herstellung einer Verbundanordnung
ES2095733T3 (es) * 1994-01-12 1997-02-16 Magnetek Spa Placa laminar para producir circuitos impresos, circuitos impresos fabricados con dicha placa y metodo para su fabricacion.
KR0126781Y1 (ko) * 1994-08-23 1999-05-01 이형도 반도체소자 방열장치

Also Published As

Publication number Publication date
FR2742294A1 (fr) 1997-06-13
EP0779775B1 (fr) 1999-04-28
EP0779775A1 (fr) 1997-06-18
DE69602245D1 (de) 1999-06-02
DE69602245T2 (de) 1999-09-09
FR2742294B1 (fr) 1998-02-27
US5798908A (en) 1998-08-25

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