ES2124965T3 - Metodo para deposito selectivo. - Google Patents

Metodo para deposito selectivo.

Info

Publication number
ES2124965T3
ES2124965T3 ES95305962T ES95305962T ES2124965T3 ES 2124965 T3 ES2124965 T3 ES 2124965T3 ES 95305962 T ES95305962 T ES 95305962T ES 95305962 T ES95305962 T ES 95305962T ES 2124965 T3 ES2124965 T3 ES 2124965T3
Authority
ES
Spain
Prior art keywords
deposit method
selective deposit
imidazole
deposition
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95305962T
Other languages
English (en)
Inventor
Donald Ferrier
Eric Yakobson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/324,114 external-priority patent/US5468515A/en
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of ES2124965T3 publication Critical patent/ES2124965T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

SE PUEDEN INCORPORAR IMIDAZOL Y DERIVADOS DE IMIDAZOL EN VARIAS SOLUCIONES ACTIVADORAS PARA LA ACTIVACION Y DEPOSICION SELECTIVAS DE SUPERFICIES METALICAS. LA INVENCION ES PARTICULARMENTE UTIL PARA LA DEPOSICION DE LAS SUPERFICIES DE COBRE AL DESCUBIERTO DE TABLEROS DE CIRCUITOS IMPRESOS SIN QUE TENGA LUGAR UNA DEPOSICION EXTRAÑA SUSTANCIAL SOBRE LAS SUPERFICIES DE LAS MASCARAS DE SOLDAR.
ES95305962T 1994-10-14 1995-08-25 Metodo para deposito selectivo. Expired - Lifetime ES2124965T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/324,114 US5468515A (en) 1994-10-14 1994-10-14 Composition and method for selective plating
US08/409,673 US5518760A (en) 1994-10-14 1995-03-22 Composition and method for selective plating

Publications (1)

Publication Number Publication Date
ES2124965T3 true ES2124965T3 (es) 1999-02-16

Family

ID=26984290

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95305962T Expired - Lifetime ES2124965T3 (es) 1994-10-14 1995-08-25 Metodo para deposito selectivo.

Country Status (4)

Country Link
US (1) US5518760A (es)
EP (1) EP0707093B1 (es)
DE (1) DE69505626T2 (es)
ES (1) ES2124965T3 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US5733599A (en) * 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US6373137B1 (en) * 2000-03-21 2002-04-16 Micron Technology, Inc. Copper interconnect for an integrated circuit and methods for its fabrication
US6660154B2 (en) 2000-10-25 2003-12-09 Shipley Company, L.L.C. Seed layer
WO2002072915A1 (fr) * 2001-03-13 2002-09-19 Ebara-Udylite Co., Ltd. Agent modificateur et ses utilisations
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US7255782B2 (en) 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US20090239079A1 (en) * 2008-03-18 2009-09-24 Mark Wojtaszek Process for Preventing Plating on a Portion of a Molded Plastic Part
EP2233608B1 (en) 2009-03-23 2016-03-23 ATOTECH Deutschland GmbH Pre-treatment process for electroless nickel plating
KR101445461B1 (ko) * 2010-03-23 2014-09-26 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 무전해 도금 전처리제, 그것을 이용하는 무전해 도금 방법 및 무전해 도금물
US8591637B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronic Materials Llc Plating catalyst and method
EP2910666A1 (en) 2014-02-21 2015-08-26 ATOTECH Deutschland GmbH Pre-treatment process for electroless plating
CN104878422B (zh) * 2014-02-28 2017-12-12 比亚迪股份有限公司 一种钯活化液及其制备方法及塑料的活化方法
US20210140052A1 (en) * 2019-11-11 2021-05-13 Rohm And Haas Electronic Materials Llc Electroless copper plating and counteracting passivation
CN110983305B (zh) * 2019-12-19 2022-05-13 广东东硕科技有限公司 季铵盐化合物在制备抑制化学镀渗镀的组合物中的应用以及金属层的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2116389C3 (de) * 1971-03-30 1980-04-03 Schering Ag, 1000 Berlin Und 4619 Bergkamen Lösung zur Aktivierung von Oberflächen für die Metallisierung
US4424352A (en) * 1980-06-13 1984-01-03 Minnesota Mining And Manufacturing Company Palladium(II) bis(hexafluoroacetylacetonate) adducts and their preparation
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
EP0214097B1 (de) * 1985-08-23 1989-12-27 Ciba-Geigy Ag Mischung aus Olefin und Dibenzalaceton-Palladiumkomplex und deren Verwendung
DE3816494A1 (de) * 1988-05-10 1989-11-16 Schering Ag Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
US5173130A (en) * 1989-11-13 1992-12-22 Shikoku Chemicals Corporation Process for surface treatment of copper and copper alloy
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
US5160579A (en) * 1991-06-05 1992-11-03 Macdermid, Incorporated Process for manufacturing printed circuit employing selective provision of solderable coating
US5296334A (en) 1992-08-28 1994-03-22 Macdermid, Incorporated Radiation-curable composition useful for preparation of solder masks
US5468515A (en) * 1994-10-14 1995-11-21 Macdermid, Incorporated Composition and method for selective plating

Also Published As

Publication number Publication date
EP0707093A1 (en) 1996-04-17
DE69505626T2 (de) 1999-05-06
DE69505626D1 (de) 1998-12-03
US5518760A (en) 1996-05-21
EP0707093B1 (en) 1998-10-28

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