ES2124965T3 - Metodo para deposito selectivo. - Google Patents
Metodo para deposito selectivo.Info
- Publication number
- ES2124965T3 ES2124965T3 ES95305962T ES95305962T ES2124965T3 ES 2124965 T3 ES2124965 T3 ES 2124965T3 ES 95305962 T ES95305962 T ES 95305962T ES 95305962 T ES95305962 T ES 95305962T ES 2124965 T3 ES2124965 T3 ES 2124965T3
- Authority
- ES
- Spain
- Prior art keywords
- deposit method
- selective deposit
- imidazole
- deposition
- selective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
SE PUEDEN INCORPORAR IMIDAZOL Y DERIVADOS DE IMIDAZOL EN VARIAS SOLUCIONES ACTIVADORAS PARA LA ACTIVACION Y DEPOSICION SELECTIVAS DE SUPERFICIES METALICAS. LA INVENCION ES PARTICULARMENTE UTIL PARA LA DEPOSICION DE LAS SUPERFICIES DE COBRE AL DESCUBIERTO DE TABLEROS DE CIRCUITOS IMPRESOS SIN QUE TENGA LUGAR UNA DEPOSICION EXTRAÑA SUSTANCIAL SOBRE LAS SUPERFICIES DE LAS MASCARAS DE SOLDAR.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/324,114 US5468515A (en) | 1994-10-14 | 1994-10-14 | Composition and method for selective plating |
US08/409,673 US5518760A (en) | 1994-10-14 | 1995-03-22 | Composition and method for selective plating |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2124965T3 true ES2124965T3 (es) | 1999-02-16 |
Family
ID=26984290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95305962T Expired - Lifetime ES2124965T3 (es) | 1994-10-14 | 1995-08-25 | Metodo para deposito selectivo. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5518760A (es) |
EP (1) | EP0707093B1 (es) |
DE (1) | DE69505626T2 (es) |
ES (1) | ES2124965T3 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
US5733599A (en) * | 1996-03-22 | 1998-03-31 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
US6373137B1 (en) * | 2000-03-21 | 2002-04-16 | Micron Technology, Inc. | Copper interconnect for an integrated circuit and methods for its fabrication |
US6660154B2 (en) | 2000-10-25 | 2003-12-09 | Shipley Company, L.L.C. | Seed layer |
WO2002072915A1 (fr) * | 2001-03-13 | 2002-09-19 | Ebara-Udylite Co., Ltd. | Agent modificateur et ses utilisations |
US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US20090239079A1 (en) * | 2008-03-18 | 2009-09-24 | Mark Wojtaszek | Process for Preventing Plating on a Portion of a Molded Plastic Part |
EP2233608B1 (en) | 2009-03-23 | 2016-03-23 | ATOTECH Deutschland GmbH | Pre-treatment process for electroless nickel plating |
KR101445461B1 (ko) * | 2010-03-23 | 2014-09-26 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 무전해 도금 전처리제, 그것을 이용하는 무전해 도금 방법 및 무전해 도금물 |
US8591637B2 (en) * | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronic Materials Llc | Plating catalyst and method |
EP2910666A1 (en) | 2014-02-21 | 2015-08-26 | ATOTECH Deutschland GmbH | Pre-treatment process for electroless plating |
CN104878422B (zh) * | 2014-02-28 | 2017-12-12 | 比亚迪股份有限公司 | 一种钯活化液及其制备方法及塑料的活化方法 |
US20210140052A1 (en) * | 2019-11-11 | 2021-05-13 | Rohm And Haas Electronic Materials Llc | Electroless copper plating and counteracting passivation |
CN110983305B (zh) * | 2019-12-19 | 2022-05-13 | 广东东硕科技有限公司 | 季铵盐化合物在制备抑制化学镀渗镀的组合物中的应用以及金属层的制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2116389C3 (de) * | 1971-03-30 | 1980-04-03 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Lösung zur Aktivierung von Oberflächen für die Metallisierung |
US4424352A (en) * | 1980-06-13 | 1984-01-03 | Minnesota Mining And Manufacturing Company | Palladium(II) bis(hexafluoroacetylacetonate) adducts and their preparation |
US4863758A (en) * | 1982-05-26 | 1989-09-05 | Macdermid, Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
EP0214097B1 (de) * | 1985-08-23 | 1989-12-27 | Ciba-Geigy Ag | Mischung aus Olefin und Dibenzalaceton-Palladiumkomplex und deren Verwendung |
DE3816494A1 (de) * | 1988-05-10 | 1989-11-16 | Schering Ag | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
US4940181A (en) * | 1989-04-06 | 1990-07-10 | Motorola, Inc. | Pad grid array for receiving a solder bumped chip carrier |
US5173130A (en) * | 1989-11-13 | 1992-12-22 | Shikoku Chemicals Corporation | Process for surface treatment of copper and copper alloy |
US5235139A (en) * | 1990-09-12 | 1993-08-10 | Macdermid, Incorprated | Method for fabricating printed circuits |
US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
US5296334A (en) | 1992-08-28 | 1994-03-22 | Macdermid, Incorporated | Radiation-curable composition useful for preparation of solder masks |
US5468515A (en) * | 1994-10-14 | 1995-11-21 | Macdermid, Incorporated | Composition and method for selective plating |
-
1995
- 1995-03-22 US US08/409,673 patent/US5518760A/en not_active Expired - Lifetime
- 1995-08-25 ES ES95305962T patent/ES2124965T3/es not_active Expired - Lifetime
- 1995-08-25 EP EP95305962A patent/EP0707093B1/en not_active Expired - Lifetime
- 1995-08-25 DE DE69505626T patent/DE69505626T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0707093A1 (en) | 1996-04-17 |
DE69505626T2 (de) | 1999-05-06 |
DE69505626D1 (de) | 1998-12-03 |
US5518760A (en) | 1996-05-21 |
EP0707093B1 (en) | 1998-10-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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