ES2080027A1 - Composicion de resina fotosensible para una placa de impresion de panel ondulado. - Google Patents

Composicion de resina fotosensible para una placa de impresion de panel ondulado.

Info

Publication number
ES2080027A1
ES2080027A1 ES09450032A ES9450032A ES2080027A1 ES 2080027 A1 ES2080027 A1 ES 2080027A1 ES 09450032 A ES09450032 A ES 09450032A ES 9450032 A ES9450032 A ES 9450032A ES 2080027 A1 ES2080027 A1 ES 2080027A1
Authority
ES
Spain
Prior art keywords
weight
parts
corrugated board
board printing
printing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES09450032A
Other languages
English (en)
Other versions
ES2080027B1 (es
Inventor
Norihiko Sakata
Shusaku Tabata
Yoko Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of ES2080027A1 publication Critical patent/ES2080027A1/es
Application granted granted Critical
Publication of ES2080027B1 publication Critical patent/ES2080027B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
    • C08F283/008—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00 on to unsaturated polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • C08F299/028—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight photopolymerisable compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

COMPOSICION DE RESINA FOTOSENSIBLE PARA UNA PLACA DE IMPRESION DE PANEL ONDULADO. LA PRESENTE INVENCION PROPORCIONA UNA RESINA FOTOSENSIBLE LIQUIDA PARA FORMACION DE PLACAS DE IMPRESION SOBRE PANEL ONDULADO QUE COMPRENDE: (A) 100 PARTES EN PESO DE UN PREPOLIMERO DE POLIURETANO NO SATURADO QUE TIENE UN POLIETER POLIOL COMO SEGMENTO POLIOL, (B) 17 A 200 PARTES EN PESO DE UN COMPUESTO ETILENICAMENTE INSATURADO Y (C) 0,01 A 10 PARTES EN PESO DE UN INICIADOR DE POLIMERIZACION, CARACTERIZADO POR COMPRENDER 17 A 65 PARTES EN PESO DE UN MONOMERO DE ACRILATO REPRESENTADO POR LA SIGUIENTE FORMULA (I) POR 100 PARTES EN PESO DEL PREPOLIMERO DEL COMPONENTE (A) COMO COMPUESTO ETILENICAMENTE INSATURADO DEL COMPONENTE (B): CH2 = CH - CO - O - (C2H4O)N - R (I)EN LA QUE N REPRESENTA UN NUMERO DEL 1 A 20, R REPRESENTA UN GRUPO ALQUILO LINEAL O RAMIFICADO QUE TIENE DE 2 A 22 ATOMOS DE CARBONO.
ES09450032A 1993-06-18 1994-12-09 Composicion de resina fotosensible para una placa de impresion de panel ondulado. Expired - Fee Related ES2080027B1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17086793 1993-06-18

Publications (2)

Publication Number Publication Date
ES2080027A1 true ES2080027A1 (es) 1996-01-16
ES2080027B1 ES2080027B1 (es) 1996-08-01

Family

ID=15912789

Family Applications (1)

Application Number Title Priority Date Filing Date
ES09450032A Expired - Fee Related ES2080027B1 (es) 1993-06-18 1994-12-09 Composicion de resina fotosensible para una placa de impresion de panel ondulado.

Country Status (7)

Country Link
US (1) US5716757A (es)
EP (1) EP0656378B1 (es)
CN (1) CN1077114C (es)
AU (1) AU675552B2 (es)
ES (1) ES2080027B1 (es)
GB (1) GB2283244B (es)
WO (1) WO1995000567A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996018932A1 (en) * 1994-12-13 1996-06-20 Macdermid Imaging Technology, Inc. Photosensitive compositions and clean running photopolymer printing plates therefrom
US5965460A (en) * 1997-01-29 1999-10-12 Mac Dermid, Incorporated Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads
JP2003277453A (ja) * 2002-03-27 2003-10-02 Jsr Corp 液状硬化性樹脂組成物
JP4093557B2 (ja) * 2002-11-14 2008-06-04 東洋合成工業株式会社 感光性樹脂組成物および含水ゲルの形成方法並びに含水ゲル
EP2100907B1 (en) 2006-12-26 2013-02-20 Asahi Kasei E-materials Corporation Resin composition for printing plate
WO2008125200A1 (en) * 2007-04-11 2008-10-23 Bayer Materialscience Ag Radiation-crosslinking and thermally crosslinking pu systems based on isocyanate-reactive block copolymers
JP5495799B2 (ja) * 2008-02-15 2014-05-21 旭化成イーマテリアルズ株式会社 樹脂組成物
KR102665293B1 (ko) * 2019-04-01 2024-05-09 주식회사 엘지화학 항균성 고분자 코팅 조성물 및 항균성 고분자 필름

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3960572A (en) * 1973-02-21 1976-06-01 Asahi Kasei Kogyo Kabushiki Kaisha Photosensitive compositions comprising a polyester-polyether block polymer
ES2034890A1 (es) * 1990-08-08 1993-04-01 Asahi Chemical Ind "compuesto liquido de resina fotocurable para la fabricacion de planchas para la impresion flexografica y su procedimiento de fabricacion".
JPH05301935A (ja) * 1992-04-28 1993-11-16 Sekisui Chem Co Ltd 光硬化型樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS527363B2 (es) * 1973-05-21 1977-03-02
JPS5335481B2 (es) * 1974-04-08 1978-09-27
JPS5921541B2 (ja) * 1977-05-18 1984-05-21 東洋紡績株式会社 印刷版用感光性樹脂組成物
US4298630A (en) * 1978-03-23 1981-11-03 Northern Telecom Ltd. Method of manufacturing electrically insulated conductors with ultra-violet cured coatings
US4932750A (en) * 1982-12-09 1990-06-12 Desoto, Inc. Single-coated optical fiber
JPS6121118A (ja) * 1984-07-10 1986-01-29 Yokohama Rubber Co Ltd:The 光硬化型樹脂組成物
US5288571A (en) * 1986-10-02 1994-02-22 Asahi Kasei Kogyo Kabushiki Kaisha Photoresin printing plate for use in printing a corrugated board
JPH07113767B2 (ja) * 1986-10-02 1995-12-06 旭化成工業株式会社 段ボ−ル印刷用感光性樹脂印刷版
US4854666A (en) * 1987-02-04 1989-08-08 Mitsui Toatsu Chemicals, Incorporated Photosetting resin composition
JP2644898B2 (ja) * 1989-11-16 1997-08-25 旭化成工業株式会社 レリーフ形成用感光性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3960572A (en) * 1973-02-21 1976-06-01 Asahi Kasei Kogyo Kabushiki Kaisha Photosensitive compositions comprising a polyester-polyether block polymer
ES2034890A1 (es) * 1990-08-08 1993-04-01 Asahi Chemical Ind "compuesto liquido de resina fotocurable para la fabricacion de planchas para la impresion flexografica y su procedimiento de fabricacion".
JPH05301935A (ja) * 1992-04-28 1993-11-16 Sekisui Chem Co Ltd 光硬化型樹脂組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Patent Abstracts of Japan, vol 18, n‘ 107, (C-1169), 1994 & JP 05301935 A (SEKISUI CHEM Co.Ltd.) 16.11.93 * Resumen * *

Also Published As

Publication number Publication date
ES2080027B1 (es) 1996-08-01
AU675552B2 (en) 1997-02-06
US5716757A (en) 1998-02-10
AU6982094A (en) 1995-01-17
GB9422035D0 (en) 1995-03-01
EP0656378A4 (en) 1997-12-29
EP0656378B1 (en) 1999-12-08
CN1077114C (zh) 2002-01-02
GB2283244A (en) 1995-05-03
CN1107278A (zh) 1995-08-23
GB2283244B (en) 1997-08-13
WO1995000567A1 (fr) 1995-01-05
EP0656378A1 (en) 1995-06-07

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