ES2070566T3 - Dispositivo para el recubrimiento de substratos para instalaciones de pulverizacion catodica. - Google Patents

Dispositivo para el recubrimiento de substratos para instalaciones de pulverizacion catodica.

Info

Publication number
ES2070566T3
ES2070566T3 ES92114604T ES92114604T ES2070566T3 ES 2070566 T3 ES2070566 T3 ES 2070566T3 ES 92114604 T ES92114604 T ES 92114604T ES 92114604 T ES92114604 T ES 92114604T ES 2070566 T3 ES2070566 T3 ES 2070566T3
Authority
ES
Spain
Prior art keywords
track
coating
substrates
closed area
cathodic spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92114604T
Other languages
English (en)
Inventor
Michael Dr Lubbehusen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Application granted granted Critical
Publication of ES2070566T3 publication Critical patent/ES2070566T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

SE DESCRIBE UN DISPOSITIVO PARA RECUBRIMIENTO DE SUBSTRATOS PARA INSTALACION DE PULVERIZACION DE CATODO, CON UN OBJETIVO DE FORMA PLANA DE GRANDES DIMENSIONES, SOBRE EL CUAL EL MATERIAL A DESPRENDER ESTA DISPUESTO EN UNA PISTA, FORMANDO UNA ZONA CERRADA, Y CON UNA DISPOSICION DE IMAN, QUE GENERA UN CAMPO MAGNETICO, CUYAS LINEAS DE CAMPO EN FORMA DE ARCO CUBREN EL OBJETIVO EN FORMA DE PISTA EN DIRECCION TRANSVERSAL. LA INVENCION SE CARACTERIZA PORQUE, AL MENOS SE HA PREVISTO DE UNA SEGUNDA ZONA CERRADA, QUE ESTA CONFIGURADA CON MATERIAL A DESMONTAR SEGUN UNA DISPOSICION EN FORMA DE PISTA, Y A LA QUE RODEA LA PRIMERA ZONA CERRADA, Y QUE LA PISTA DE LA PRIMERA Y LA PISTA DE LA SEGUNDA ZONA CERRADA ESTAN AISLADAS RESPECTIVAMENTE UNA DE OTRA DE FORMA ELECTRICA.
ES92114604T 1991-11-11 1992-08-27 Dispositivo para el recubrimiento de substratos para instalaciones de pulverizacion catodica. Expired - Lifetime ES2070566T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4136951A DE4136951C2 (de) 1991-11-11 1991-11-11 Vorrichtung zur Beschichtung von Substraten für Kathodenzerstäubungsanlagen

Publications (1)

Publication Number Publication Date
ES2070566T3 true ES2070566T3 (es) 1995-06-01

Family

ID=6444466

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92114604T Expired - Lifetime ES2070566T3 (es) 1991-11-11 1992-08-27 Dispositivo para el recubrimiento de substratos para instalaciones de pulverizacion catodica.

Country Status (4)

Country Link
EP (1) EP0541919B1 (es)
JP (1) JPH05222529A (es)
DE (2) DE4136951C2 (es)
ES (1) ES2070566T3 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4419167B4 (de) * 1994-06-01 2004-09-02 Leybold Optics Gmbh Vorrichtung zum Beschichten eines Substrates
DE19511946C2 (de) * 1995-03-31 1997-07-24 Leybold Ag Vorrichtung zur Kathodenzerstäubung
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD203075A1 (de) * 1981-12-17 1983-10-12 Wolfgang Sieber Verfahren zum reaktiven dc-plasmatron-zerstaeuben
DE3411536A1 (de) * 1983-07-06 1985-01-17 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode fuer katodenzerstaeubungsanlagen
DE3480145D1 (en) * 1983-12-05 1989-11-16 Leybold Ag Magnetron cathode for the sputtering of ferromagnetic targets
US4606802A (en) * 1983-12-21 1986-08-19 Hitachi, Ltd. Planar magnetron sputtering with modified field configuration
DE3624150C2 (de) * 1986-07-17 1994-02-24 Leybold Ag Zerstäubungskatode nach dem Magnetronprinzip
DE3738845A1 (de) * 1987-11-16 1989-05-24 Leybold Ag Zerstaeubungskatode nach dem magnetronprinzip
DE4127262C1 (en) * 1991-08-17 1992-06-04 Forschungsges Elektronenstrahl Sputtering equipment for coating large substrates with (non)ferromagnetic material - consisting of two sub-targets electrically isolated and cooling plates whose gap in between is that in region of pole units

Also Published As

Publication number Publication date
EP0541919B1 (de) 1995-03-29
DE4136951A1 (de) 1993-05-13
DE59201775D1 (de) 1995-05-04
EP0541919A1 (de) 1993-05-19
DE4136951C2 (de) 1996-07-11
JPH05222529A (ja) 1993-08-31

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