ES2047019T3 - Procedimiento para la fabricacion de componentes electricos y electronicos. - Google Patents
Procedimiento para la fabricacion de componentes electricos y electronicos.Info
- Publication number
- ES2047019T3 ES2047019T3 ES88200097T ES88200097T ES2047019T3 ES 2047019 T3 ES2047019 T3 ES 2047019T3 ES 88200097 T ES88200097 T ES 88200097T ES 88200097 T ES88200097 T ES 88200097T ES 2047019 T3 ES2047019 T3 ES 2047019T3
- Authority
- ES
- Spain
- Prior art keywords
- pct
- sec
- carboxylic acids
- date
- procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
Abstract
ESTE PRODUCTO DE SOLDADURA BLANDA SOBRE LA BASE DE ACIDOS CARBONICOS ORGANICOS, ES APROPIADA SOBRE TODO PARA SU USO EN LA FABRICACION DE ELEMENTOS ELECTRONICOS. LA CARACTERISTICA ESPECIAL DE ESTE PRODUCTO, ES QUE SIRVEN PARA SMT- MANUFACTURING Y PRUEBAS IN-CIRCUIT, DADO SU CONTENIDO REDUCIDO EN SUSTANCIAS SOLIDAS (POR EJEMPLO 6%). SE LOGRA ESTE ESTADO UTILIZANDO ALCOHOLES ALQUILOFLUORADOS DEL TIPO RF- CH2 - CH2 - OH Y ACIDOS DE POLICARBONO ALCIQUILICOS Y AROMATICOS, CON POR LO MENOS UN ANILLO DE CARBONO O SUS DERIVADOS, USANDO ACIDOS HIDROXICARBONO, ASI COMO SALES DE AMONIO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP88200097A EP0324194B1 (de) | 1988-01-12 | 1988-01-12 | Verfahren zur Herstellung von elektronischen Komponenten unter Verwendung eines Weichlötflussmittels auf Carbonsäurebasis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2047019T3 true ES2047019T3 (es) | 1994-02-16 |
Family
ID=8199740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES88200097T Expired - Lifetime ES2047019T3 (es) | 1988-01-12 | 1988-01-12 | Procedimiento para la fabricacion de componentes electricos y electronicos. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US5116432A (es) |
| EP (2) | EP0398871B1 (es) |
| JP (1) | JPH0825058B2 (es) |
| AT (1) | ATE80822T1 (es) |
| DE (1) | DE3874897D1 (es) |
| ES (1) | ES2047019T3 (es) |
| FI (1) | FI92660C (es) |
| RU (1) | RU2009032C1 (es) |
| UA (1) | UA13467A1 (es) |
| WO (1) | WO1989006584A1 (es) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5009725A (en) * | 1990-03-30 | 1991-04-23 | Air Products And Chemicals, Inc. | Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same |
| GB2257988B (en) * | 1990-05-04 | 1994-07-27 | Delco Electronics Corp | Low-residue rosin-free soldering flux |
| US5192360A (en) * | 1990-05-15 | 1993-03-09 | Hughes Aircraft Company | Water-soluble flux for cored solder |
| DE4126913A1 (de) * | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
| US5437738A (en) * | 1994-06-21 | 1995-08-01 | Gerenrot; Yum | Fluxes for lead-free galvanizing |
| US5507882A (en) * | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
| US5817190A (en) * | 1995-05-25 | 1998-10-06 | Matsushita Electric Industrial Co., Ltd. | Flux for soft soldering |
| JP3378139B2 (ja) * | 1996-03-19 | 2003-02-17 | 株式会社デンソー | はんだ付け用のフラックス |
| US6059894A (en) * | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
| RU2463144C2 (ru) * | 2010-12-15 | 2012-10-10 | Открытое акционерное общество "Авангард" | Флюс для низкотемпературной пайки |
| JP6215633B2 (ja) | 2013-09-30 | 2017-10-18 | 株式会社タムラ製作所 | ロジン含有量を低減させたはんだ付け用フラックスおよびはんだペースト組成物 |
| JP5790862B1 (ja) * | 2014-12-25 | 2015-10-07 | 千住金属工業株式会社 | やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ |
| CN114289932B (zh) * | 2022-01-24 | 2023-02-24 | 云南锡业锡材有限公司 | 一种无卤免清洗无铅焊锡丝助焊剂及其制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3734791A (en) * | 1970-10-23 | 1973-05-22 | Ibm | Surfactant-containing soldering fluxes |
| DE2114927C3 (de) * | 1971-03-27 | 1980-06-04 | Stannol-Loetmittelfabrik Wilhelm Paff, 5600 Wuppertal | LötfluBmittel |
| US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
| ATE44671T1 (de) * | 1984-05-14 | 1989-08-15 | Rudolf A Kerner | Verfahren zur herstellung von elektronischen komponenten unter verwendung eines weichloetflussmittels auf carbonsaeurebasis. |
| SE457335B (sv) * | 1984-07-20 | 1988-12-19 | Ytkemiska Inst | Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet |
| US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
-
1988
- 1988-01-12 WO PCT/EP1988/000017 patent/WO1989006584A1/de not_active Ceased
- 1988-01-12 EP EP88901033A patent/EP0398871B1/de not_active Expired - Lifetime
- 1988-01-12 EP EP88200097A patent/EP0324194B1/de not_active Expired - Lifetime
- 1988-01-12 AT AT88901033T patent/ATE80822T1/de not_active IP Right Cessation
- 1988-01-12 ES ES88200097T patent/ES2047019T3/es not_active Expired - Lifetime
- 1988-01-12 JP JP63501135A patent/JPH0825058B2/ja not_active Expired - Lifetime
- 1988-01-12 DE DE8888901033T patent/DE3874897D1/de not_active Expired - Lifetime
- 1988-01-12 US US07/499,401 patent/US5116432A/en not_active Expired - Fee Related
-
1990
- 1990-07-11 RU SU904830342A patent/RU2009032C1/ru active
- 1990-07-11 FI FI903524A patent/FI92660C/fi not_active IP Right Cessation
- 1990-07-11 UA UA4830342A patent/UA13467A1/uk unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FI903524A0 (fi) | 1990-07-11 |
| JPH0825058B2 (ja) | 1996-03-13 |
| DE3874897D1 (de) | 1992-10-29 |
| UA13467A1 (uk) | 1997-02-28 |
| EP0324194B1 (de) | 1993-10-20 |
| ATE80822T1 (de) | 1992-10-15 |
| FI92660C (fi) | 1994-12-27 |
| RU2009032C1 (ru) | 1994-03-15 |
| US5116432A (en) | 1992-05-26 |
| EP0398871B1 (de) | 1992-09-23 |
| FI92660B (fi) | 1994-09-15 |
| EP0324194A1 (de) | 1989-07-19 |
| WO1989006584A1 (fr) | 1989-07-27 |
| JPH03502662A (ja) | 1991-06-20 |
| EP0398871A1 (de) | 1990-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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