ES2044889T3 - Procedimiento para la eliminacion de suciedades en los taladros de perforacion de circuitos impresos. - Google Patents

Procedimiento para la eliminacion de suciedades en los taladros de perforacion de circuitos impresos.

Info

Publication number
ES2044889T3
ES2044889T3 ES87114988T ES87114988T ES2044889T3 ES 2044889 T3 ES2044889 T3 ES 2044889T3 ES 87114988 T ES87114988 T ES 87114988T ES 87114988 T ES87114988 T ES 87114988T ES 2044889 T3 ES2044889 T3 ES 2044889T3
Authority
ES
Spain
Prior art keywords
dirt
elimination
procedure
printed circuits
drilling drills
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87114988T
Other languages
English (en)
Inventor
Walter Meyer
Hans-Joachim Grapentin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6313771&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2044889(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2044889T3 publication Critical patent/ES2044889T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Detergent Compositions (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

EL INVENTO SE TRATA DE UN PROCEDIMIENTO PARA LA ELIMINACION DE LA SUCIEDAD EN TALADROS DE LA PLACA DE CIRCUITO IMPRESO, BAJO LA APLICACION DE MEDIOS DE OXIDACION, COMO PERMANGANATOS EN DISOLUCION ACUOSA Y/O EN MEDIOS DE HINCHAMIENTO ASI COMO BAJO EL EMPLEO DE UN TRATAMIENTO DE ULTRASONIDO, DE ESE MODO ES CARACTERISTICO, QUE DURANTE EL TRATAMIENTO SE LLEVE LA PLACA DE CIRCUITO IMPRESO HORIZONTAL.
ES87114988T 1986-11-11 1987-10-14 Procedimiento para la eliminacion de suciedades en los taladros de perforacion de circuitos impresos. Expired - Lifetime ES2044889T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863638630 DE3638630A1 (de) 1986-11-11 1986-11-11 Verfahren zur entfernung von harzverschmutzungen in bohrloechern von leiterplatten

Publications (1)

Publication Number Publication Date
ES2044889T3 true ES2044889T3 (es) 1994-01-16

Family

ID=6313771

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87114988T Expired - Lifetime ES2044889T3 (es) 1986-11-11 1987-10-14 Procedimiento para la eliminacion de suciedades en los taladros de perforacion de circuitos impresos.

Country Status (6)

Country Link
EP (1) EP0267452B1 (es)
JP (1) JPS63141391A (es)
AT (1) AT397330B (es)
CA (1) CA1307353C (es)
DE (2) DE3638630A1 (es)
ES (1) ES2044889T3 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01258488A (ja) * 1988-04-08 1989-10-16 Elna Co Ltd プリント配線板の製造装置
DE3922477A1 (de) * 1989-07-06 1991-01-17 Schering Ag Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung
DE3935831A1 (de) * 1989-10-27 1991-05-02 Hoellmueller Maschbau H Anlage zur herstellung von durchkontaktierten leiterplatten und multilayern
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
DE4040226C2 (de) * 1990-12-15 1994-09-29 Hoellmueller Maschbau H Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern)
JP2613336B2 (ja) * 1991-11-26 1997-05-28 帝人株式会社 アラミド基材プリント回路板の形成方法
DE19534521C1 (de) * 1995-09-06 1996-11-21 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von sich in Werkstücke erstreckende Löcher oder Vertiefungen mit flüssigen Behandlungsmitteln und Anwendung des Verfahrens zur Behandlung von Leiterplatten

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5621147A (en) * 1979-07-27 1981-02-27 Xerox Corp Sheet collector and sorter
JPS60798B2 (ja) * 1981-06-09 1985-01-10 株式会社石井表記 超音波洗滌装置
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4597988A (en) * 1983-06-06 1986-07-01 Macdermid, Incorporated Process for preparing printed circuit board thru-holes
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
FR2587241B1 (fr) * 1985-05-28 1988-07-29 Outillages Scient Laboratoir Appareil de nettoyage pour composants electroniques et/ou pour pieces mecaniques de precision
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten

Also Published As

Publication number Publication date
AT397330B (de) 1994-03-25
EP0267452A3 (en) 1989-06-14
EP0267452B1 (de) 1993-10-06
JPS63141391A (ja) 1988-06-13
ATA297087A (de) 1993-07-15
EP0267452A2 (de) 1988-05-18
DE3638630A1 (de) 1988-05-26
CA1307353C (en) 1992-09-08
JPH0556037B2 (es) 1993-08-18
DE3787701D1 (de) 1993-11-11

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