CA1307353C - Ultrasonic removal of contaminants from boreholes of printed circuit boards - Google Patents
Ultrasonic removal of contaminants from boreholes of printed circuit boardsInfo
- Publication number
- CA1307353C CA1307353C CA000551556A CA551556A CA1307353C CA 1307353 C CA1307353 C CA 1307353C CA 000551556 A CA000551556 A CA 000551556A CA 551556 A CA551556 A CA 551556A CA 1307353 C CA1307353 C CA 1307353C
- Authority
- CA
- Canada
- Prior art keywords
- process according
- rinsing
- soaking
- conductor plates
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Abstract
ABSTRACT OF THE DISCLOSURE
The present invention relates to a process for the removal of contaminants from holes of printed circuit boards using oxidants, such as permanganates in aqueous solutions, and/or swelling (soaking) agents as well as employing an ultransonic treatment wherein the boards are passed horizontally during the treatment.
The present invention relates to a process for the removal of contaminants from holes of printed circuit boards using oxidants, such as permanganates in aqueous solutions, and/or swelling (soaking) agents as well as employing an ultransonic treatment wherein the boards are passed horizontally during the treatment.
Description
` 1 307353 The present invention relates to a process for the removal of contaminats from boreholes of printed circuit boards (pcs) using oxidants such as permanganates in aqueous ~ oa~,~) solutions and/or swelling~agents, and employing an ultrasonic treatment.
In the production of multilayer structures it is necessary to carry cut a pretreatment procedure in order to remove resinous smearings caused by drilling ~called "smear"
in the common technical usage). The removal of the "drill smear" is effected to ensure a proper electrical contact of the conducting inner layers with the through-contacts in the boreholes. Moreover, the removal of "smear" eliminates the residues of PCB materials, either loosely attached or stuck to the boreholes, which facilitates the adhesion of the metal layer which is deposited during the through-contacting. This is important, above all, after the thermal treatment that printed circuit boards undergo in the soldering operation.
It is known to remove smear using potassium or sodium permanganate solutions. In many cases, this oxidlzing treatment is preceded by soaking (swelling) in aqueous solu-tions containing various solvents and/or surfactants. The duration of the treatment is very long, and therefore it has also been known to accelerate such procedures by employing ultrasonic treatment. There is, however, a problem associated with the above prior art process in that a uniform ultrasonic field cannot be set up with the conventional arrangement of the printed circuit boards in the processing basket. As a result, cleaning action of varying force takes place depending on the positioning of the board in the basket and thus, a uni-form and complete remova~ of the drilling residue is not guar-anteed.
The present invention provides a process that 3~
enables a complete removal of contaminants from the boreholes.
According to the present invention there is provided in a process for the removal of boring smear contaminations from the bore holes of conductor plates, of the type wherein said conductor plates are treated by applying oxidation agents and/or soaking agents, a well as an ul-trasonic treatment, the improvement comprising transporting said conductor plates horizontally during said treatment~ Suitably the oxidants and the soaking (swelling) agents are splashed onto the horizontally passed boards by means of a nozzle which is disposed below the board feed path and at right angles to the direction of feed.
The oxidants are suitably aqueous solutions of permanganate.
. ., The aqueous permanganate solution suitably contains 30 - 65 gJl sodium permanganate or 30 - 60 g/l potassium permanganate.
In the production of multilayer structures it is necessary to carry cut a pretreatment procedure in order to remove resinous smearings caused by drilling ~called "smear"
in the common technical usage). The removal of the "drill smear" is effected to ensure a proper electrical contact of the conducting inner layers with the through-contacts in the boreholes. Moreover, the removal of "smear" eliminates the residues of PCB materials, either loosely attached or stuck to the boreholes, which facilitates the adhesion of the metal layer which is deposited during the through-contacting. This is important, above all, after the thermal treatment that printed circuit boards undergo in the soldering operation.
It is known to remove smear using potassium or sodium permanganate solutions. In many cases, this oxidlzing treatment is preceded by soaking (swelling) in aqueous solu-tions containing various solvents and/or surfactants. The duration of the treatment is very long, and therefore it has also been known to accelerate such procedures by employing ultrasonic treatment. There is, however, a problem associated with the above prior art process in that a uniform ultrasonic field cannot be set up with the conventional arrangement of the printed circuit boards in the processing basket. As a result, cleaning action of varying force takes place depending on the positioning of the board in the basket and thus, a uni-form and complete remova~ of the drilling residue is not guar-anteed.
The present invention provides a process that 3~
enables a complete removal of contaminants from the boreholes.
According to the present invention there is provided in a process for the removal of boring smear contaminations from the bore holes of conductor plates, of the type wherein said conductor plates are treated by applying oxidation agents and/or soaking agents, a well as an ul-trasonic treatment, the improvement comprising transporting said conductor plates horizontally during said treatment~ Suitably the oxidants and the soaking (swelling) agents are splashed onto the horizontally passed boards by means of a nozzle which is disposed below the board feed path and at right angles to the direction of feed.
The oxidants are suitably aqueous solutions of permanganate.
. ., The aqueous permanganate solution suitably contains 30 - 65 gJl sodium permanganate or 30 - 60 g/l potassium permanganate.
2~
The particularly suitable soaking ~swelling) agents are methoxyethanol, ethoxyethanol, l-methyl-2-pyrrolidinone, butyl-carbitol, dimethylformamide alone or in a mixture with or without ethylene glycol and surfactants in neutral to strongly alkaline agents.
2~
The particularly suitable soaking ~swelling) agents are methoxyethanol, ethoxyethanol, l-methyl-2-pyrrolidinone, butyl-carbitol, dimethylformamide alone or in a mixture with or without ethylene glycol and surfactants in neutral to strongly alkaline agents.
2~
3~
Conventional ultrasonic vibrators can be employed for the ultrasonic treatment.
The circuit boards can be led horizontally in a known manner using apparatus such as described for instance in DE~ - 3~ 36 545.
The process of the present invention makes it possible to achievel in a known way, a uniform cleaning, or removal, of drilling residues in all the treatment steps in order to ensure a positive electrical contact of the multilayered inner laminations.
Another advantage of the invention is a substantial imnrovem~n-t ~f the qllality ~f the boreholes, since a partial "~ver-etching" is avoicled.
Further unexpected benefits of the invention include a markedl,v improved purification of even very small boreholes due to the directed flow (of the solution~ through the holes and a significantly shortened treatment time (0.2 to 2 min) and hence improved operational efficiency of the treatment facilities.
The process of the present invention is carried out for instance in a following manner. The drilled multilayer boards are passed horizontally through a flushing device with an,-ultrasonic (attachment). In this connection, it is possible to pretreat the coating (sticky) surface, in the first stage, with a "swelling~ solution, then rinse it, like-wise during a continuous horizontal pass, and subject the board to the oxldizing treatment with potassium or sodium per-manganate. Subsequently, the residual permanganate from the treatment is removed by passing the rinsed board again trough a flushing treatment zone where the build-up of manganese dioxide is reduced. Finally, the board is rinsed again and can be passed on to the through-metallization step.
The invention will be further illustrated by the following Examples.
Example 1 Soaking (swelling) with 120 ml/l ethoxyethanol, 80 ml/l methoxyethanol 60-90C
and 90 g/l NaOH
Rinsing Etching with 60 g/l XMnO4 c. 30 g/l NaOH 60-90 C
Rinsing Decontamination with hydroxylammonium chloride in a hydro-chloric acid or sul-f.uric acid solution 60-90C
Rinsing _5_ 1 3~7353 ,. . .
o O /' ~ ~ ~ o r~ e Soakillg with 120 ml/l 1-met.hy~-2-p~rolid;nc, 80 ml/l methoxyethanol and RT ~40 C
90 g/l NaOH
R;ns;ng ~tching wi-~h 60 g/l KMnO4 and 3n g/l NaOH 60-90 C
Rinsing Decontamination with hydroxylammonium chloride in a hydrochloric acid or 25-90C
sulfllric acid solut.ion Rinsing Exam~le 3 Soakin~ with 120 ml/l dimethylformamide, 80 ml/1 methoxyethanol and RT -40C
90 g/l NaOH
Rinsing Etching with - 60 g/l KMnO4 and 30 g/l NaOH 60-90 C
Rinsing Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or sulfuric acid solution , Rinsing ~ 3~353 ~xample 4 Soaking with 120 ml/l butyl~ ~ , 80 ml/l methoxyethanol RT -90 C
90 g/l NaOH
Rinsing Etching with 60 g/l KMnO4 and 30 g/l NaOH 60-90C
Rinsing Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or sulfuric acid solution Rinsina Example 5 Soakina with 120 ml/l ethYlene glycol, 60-90C
80 ml/l methoxyet.hanol and 90 g/l NaOH
R;.ns;ng ~tching witll 60 g/l KMnO~ and 30 g/l NaO~I 60-90 C
Rinsing Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or sulfuric ac;d solution Rinsinq .
_7_ 1 307353 Example 6 Soaking as in examples 1 to 5 but with the addition of ca-tionic, anionic or nonionic surfactants.
ExamPle 7 .
Soaking with 120 ml/l ethylene ~lycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etching with 60 g/l KMnO4 and pH ea. 12-14 X g/l NaOH
Rinsinq Decontamination with hvdroxylammonium chloride 25-90C
in a hydroehlorie or sulfurie aeid solution Rinsing Exam~le 8 -Soaking with 120 ml/l ethylene glyeol 60-90C
80 ml/l ~Qethoxyethanol ~nd 90 g/l NaOH
R;nsing Deeontamination with hydroxylammonium ehloride in 25-90C
hydrochloric acid or sulfuric aeid solution Rinsing Exaln~le 9 Soakin~ with 120 ml/l ethylene glycol, 60-90C
80 ml/l me~thoxyethanol and g n g/l NaOH
R;nsin~
Etching with 60 g/l KMnO4 and 30-100 g/l K~H
R;nsing 10 Decnnt~minat;on with hy~.xoxylammnni~lm chloride 25-90C
i.n a hydrochloric acid Rinsing ~3xampl~ 1 0 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsinq Etching with 60 g/l KMnO4, X g/l NaOH or KOH and 0.1 g/l fluorinated wetting agent Rinsing Decontamination with hydroxylammonium chloride in a hydrochloric acid or sulfuric acid solution 25-90C
Rinsing _9_ Example 11 -Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOEI
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing 10Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or . sulfuric acid solution Rinsing Rxam~le 12 Soakinq with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsinq Etching with 200 q/l NaMnO4 and 70 g/l NaOlI
Rinsinq Decontamination with stannous chloridè solution in hydrochloric acid Rinsing -lo- 1 307353 Example 13 -Soakinq with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOII
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaO~
Rinsing Decontamination with an acidic solution of formaldehyde Rinsing Example 14 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etching with ~00 g/l NaMnO4 and 70 g/l NaOM
Rinsing Decontamination with an acidic solution of hydrazine hydrate Rinsing Example 15 Soa]ci.ny wi.th 120 ml/1 e-thylene glyco], 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing Decontamination with an acidic glyoxal solution Exam~le 16 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etehing with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing Deeontamination with redueiny diearboxylic acids, alone or in a mixture with inorganic acid supplement Rinsing ~anlp]e 17 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaO~
Rinsing Etching with 60 g/l KmnO4 and 30 g/l NaOII 60-90C
Rinsing `
Decontamination with sodium bisulfite solution Rinsing Example 18 Soa]cing with 120 ml/l ethylene glycol 60-90C
80 ml/l methoxye-thanol 90 g/l NaOII
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing \~
Decontamination with simultaneous glass etclling back adding ammonium bifluoride or another fluoride-containing additive Rinsing \
Conventional ultrasonic vibrators can be employed for the ultrasonic treatment.
The circuit boards can be led horizontally in a known manner using apparatus such as described for instance in DE~ - 3~ 36 545.
The process of the present invention makes it possible to achievel in a known way, a uniform cleaning, or removal, of drilling residues in all the treatment steps in order to ensure a positive electrical contact of the multilayered inner laminations.
Another advantage of the invention is a substantial imnrovem~n-t ~f the qllality ~f the boreholes, since a partial "~ver-etching" is avoicled.
Further unexpected benefits of the invention include a markedl,v improved purification of even very small boreholes due to the directed flow (of the solution~ through the holes and a significantly shortened treatment time (0.2 to 2 min) and hence improved operational efficiency of the treatment facilities.
The process of the present invention is carried out for instance in a following manner. The drilled multilayer boards are passed horizontally through a flushing device with an,-ultrasonic (attachment). In this connection, it is possible to pretreat the coating (sticky) surface, in the first stage, with a "swelling~ solution, then rinse it, like-wise during a continuous horizontal pass, and subject the board to the oxldizing treatment with potassium or sodium per-manganate. Subsequently, the residual permanganate from the treatment is removed by passing the rinsed board again trough a flushing treatment zone where the build-up of manganese dioxide is reduced. Finally, the board is rinsed again and can be passed on to the through-metallization step.
The invention will be further illustrated by the following Examples.
Example 1 Soaking (swelling) with 120 ml/l ethoxyethanol, 80 ml/l methoxyethanol 60-90C
and 90 g/l NaOH
Rinsing Etching with 60 g/l XMnO4 c. 30 g/l NaOH 60-90 C
Rinsing Decontamination with hydroxylammonium chloride in a hydro-chloric acid or sul-f.uric acid solution 60-90C
Rinsing _5_ 1 3~7353 ,. . .
o O /' ~ ~ ~ o r~ e Soakillg with 120 ml/l 1-met.hy~-2-p~rolid;nc, 80 ml/l methoxyethanol and RT ~40 C
90 g/l NaOH
R;ns;ng ~tching wi-~h 60 g/l KMnO4 and 3n g/l NaOH 60-90 C
Rinsing Decontamination with hydroxylammonium chloride in a hydrochloric acid or 25-90C
sulfllric acid solut.ion Rinsing Exam~le 3 Soakin~ with 120 ml/l dimethylformamide, 80 ml/1 methoxyethanol and RT -40C
90 g/l NaOH
Rinsing Etching with - 60 g/l KMnO4 and 30 g/l NaOH 60-90 C
Rinsing Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or sulfuric acid solution , Rinsing ~ 3~353 ~xample 4 Soaking with 120 ml/l butyl~ ~ , 80 ml/l methoxyethanol RT -90 C
90 g/l NaOH
Rinsing Etching with 60 g/l KMnO4 and 30 g/l NaOH 60-90C
Rinsing Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or sulfuric acid solution Rinsina Example 5 Soakina with 120 ml/l ethYlene glycol, 60-90C
80 ml/l methoxyet.hanol and 90 g/l NaOH
R;.ns;ng ~tching witll 60 g/l KMnO~ and 30 g/l NaO~I 60-90 C
Rinsing Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or sulfuric ac;d solution Rinsinq .
_7_ 1 307353 Example 6 Soaking as in examples 1 to 5 but with the addition of ca-tionic, anionic or nonionic surfactants.
ExamPle 7 .
Soaking with 120 ml/l ethylene ~lycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etching with 60 g/l KMnO4 and pH ea. 12-14 X g/l NaOH
Rinsinq Decontamination with hvdroxylammonium chloride 25-90C
in a hydroehlorie or sulfurie aeid solution Rinsing Exam~le 8 -Soaking with 120 ml/l ethylene glyeol 60-90C
80 ml/l ~Qethoxyethanol ~nd 90 g/l NaOH
R;nsing Deeontamination with hydroxylammonium ehloride in 25-90C
hydrochloric acid or sulfuric aeid solution Rinsing Exaln~le 9 Soakin~ with 120 ml/l ethylene glycol, 60-90C
80 ml/l me~thoxyethanol and g n g/l NaOH
R;nsin~
Etching with 60 g/l KMnO4 and 30-100 g/l K~H
R;nsing 10 Decnnt~minat;on with hy~.xoxylammnni~lm chloride 25-90C
i.n a hydrochloric acid Rinsing ~3xampl~ 1 0 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsinq Etching with 60 g/l KMnO4, X g/l NaOH or KOH and 0.1 g/l fluorinated wetting agent Rinsing Decontamination with hydroxylammonium chloride in a hydrochloric acid or sulfuric acid solution 25-90C
Rinsing _9_ Example 11 -Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOEI
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing 10Decontamination with hydroxylammonium chloride 25-90C
in a hydrochloric acid or . sulfuric acid solution Rinsing Rxam~le 12 Soakinq with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsinq Etching with 200 q/l NaMnO4 and 70 g/l NaOlI
Rinsinq Decontamination with stannous chloridè solution in hydrochloric acid Rinsing -lo- 1 307353 Example 13 -Soakinq with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOII
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaO~
Rinsing Decontamination with an acidic solution of formaldehyde Rinsing Example 14 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etching with ~00 g/l NaMnO4 and 70 g/l NaOM
Rinsing Decontamination with an acidic solution of hydrazine hydrate Rinsing Example 15 Soa]ci.ny wi.th 120 ml/1 e-thylene glyco], 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing Decontamination with an acidic glyoxal solution Exam~le 16 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaOH
Rinsing Etehing with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing Deeontamination with redueiny diearboxylic acids, alone or in a mixture with inorganic acid supplement Rinsing ~anlp]e 17 Soaking with 120 ml/l ethylene glycol, 60-90C
80 ml/l methoxyethanol and 90 g/l NaO~
Rinsing Etching with 60 g/l KmnO4 and 30 g/l NaOII 60-90C
Rinsing `
Decontamination with sodium bisulfite solution Rinsing Example 18 Soa]cing with 120 ml/l ethylene glycol 60-90C
80 ml/l methoxye-thanol 90 g/l NaOII
Rinsing Etching with 200 g/l NaMnO4 and 70 g/l NaOH
Rinsing \~
Decontamination with simultaneous glass etclling back adding ammonium bifluoride or another fluoride-containing additive Rinsing \
Claims (7)
1. In a process for the removal of boring smear contaminations from the bore holes of conductor plates, of the type wherein said conductor plates are treated by applying oxidation agents and/or soaking agents, well as an ultrasonic treatment, the improvement comprising transporting said conductor plates horizontally during said treatment.
2. The process according to claim 1, wherein said oxidation agent is splashed onto said soaking agent on said horizontally transported conductor plates by means of a nozzle disposed below the path of transport and perpendicular to the direction of transport.
3. The process according to claim 1, wherein said oxidation agent comprises an aqueous permanganate solution.
4. The process according to claim 3, wherein aid permanganate solution contains sodium permanganate in a concentration from 30 - 65 g/liter or potassium permanganate in a concentration from 30 - 60 g/liter.
5. The process according to claim 1, wherein said soaking agent comprises methyl glycol, ethyl glycol, 1-methyl-2-pyrrolidinone, butyl carbitol or dimethylformamide, alone or in mixture.
6. The process according to claim 1, wherein said soaking agent further comprises ethylene glycol and tensides.
7. The process according to claim 1, wherein said soaking agent is provided in neutral to strongly alkaline medium.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863638630 DE3638630A1 (en) | 1986-11-11 | 1986-11-11 | METHOD FOR REMOVING RESIN POLLUTION IN DRILL HOLES FROM CIRCUIT BOARDS |
| DEP3638630.8 | 1986-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1307353C true CA1307353C (en) | 1992-09-08 |
Family
ID=6313771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000551556A Expired - Lifetime CA1307353C (en) | 1986-11-11 | 1987-11-10 | Ultrasonic removal of contaminants from boreholes of printed circuit boards |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0267452B1 (en) |
| JP (1) | JPS63141391A (en) |
| AT (1) | AT397330B (en) |
| CA (1) | CA1307353C (en) |
| DE (2) | DE3638630A1 (en) |
| ES (1) | ES2044889T3 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01258488A (en) * | 1988-04-08 | 1989-10-16 | Elna Co Ltd | Manufacture of printed wiring board and device therefor |
| DE3922477A1 (en) * | 1989-07-06 | 1991-01-17 | Schering Ag | SOURCING AGENT FOR PRE-TREATING SYNTHETIC RESIN BEFORE ELECTRICIZED METALIZATION |
| DE3935831A1 (en) * | 1989-10-27 | 1991-05-02 | Hoellmueller Maschbau H | SYSTEM FOR THE PRODUCTION OF CONTACTED CIRCUIT BOARDS AND MULTILAYERS |
| US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
| DE4040226C2 (en) * | 1990-12-15 | 1994-09-29 | Hoellmueller Maschbau H | Process for the production of plated-through printed circuit boards or multilayer printed circuit boards (multilayers) |
| JP2613336B2 (en) * | 1991-11-26 | 1997-05-28 | 帝人株式会社 | Method for forming aramid substrate printed circuit board |
| DE19534521C1 (en) * | 1995-09-06 | 1996-11-21 | Atotech Deutschland Gmbh | Treating holes or recesses in workpieces esp. through holes in PCBs |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621147A (en) * | 1979-07-27 | 1981-02-27 | Xerox Corp | Sheet collector and sorter |
| JPS60798B2 (en) * | 1981-06-09 | 1985-01-10 | 株式会社石井表記 | Ultrasonic cleaning device |
| US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
| US4425380A (en) * | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
| US4597988A (en) * | 1983-06-06 | 1986-07-01 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
| US4515829A (en) * | 1983-10-14 | 1985-05-07 | Shipley Company Inc. | Through-hole plating |
| FR2587241B1 (en) * | 1985-05-28 | 1988-07-29 | Outillages Scient Laboratoir | CLEANING APPARATUS FOR ELECTRONIC COMPONENTS AND / OR PRECISION MECHANICAL PARTS |
| DE3528575A1 (en) * | 1985-08-06 | 1987-02-19 | Schering Ag | METHOD AND DEVICE FOR CLEANING, ACTIVATING AND / OR METALLIZING DRILL HOLES IN HORIZONTALLY GUIDED PCBS |
-
1986
- 1986-11-11 DE DE19863638630 patent/DE3638630A1/en not_active Withdrawn
-
1987
- 1987-10-14 DE DE87114988T patent/DE3787701D1/en not_active Revoked
- 1987-10-14 ES ES87114988T patent/ES2044889T3/en not_active Expired - Lifetime
- 1987-10-14 EP EP87114988A patent/EP0267452B1/en not_active Revoked
- 1987-11-09 JP JP62281180A patent/JPS63141391A/en active Granted
- 1987-11-10 AT AT0297087A patent/AT397330B/en not_active IP Right Cessation
- 1987-11-10 CA CA000551556A patent/CA1307353C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| AT397330B (en) | 1994-03-25 |
| EP0267452A2 (en) | 1988-05-18 |
| JPH0556037B2 (en) | 1993-08-18 |
| EP0267452B1 (en) | 1993-10-06 |
| ATA297087A (en) | 1993-07-15 |
| DE3638630A1 (en) | 1988-05-26 |
| JPS63141391A (en) | 1988-06-13 |
| EP0267452A3 (en) | 1989-06-14 |
| DE3787701D1 (en) | 1993-11-11 |
| ES2044889T3 (en) | 1994-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |