JPH01258488A - Manufacture of printed wiring board and device therefor - Google Patents
Manufacture of printed wiring board and device thereforInfo
- Publication number
- JPH01258488A JPH01258488A JP8634688A JP8634688A JPH01258488A JP H01258488 A JPH01258488 A JP H01258488A JP 8634688 A JP8634688 A JP 8634688A JP 8634688 A JP8634688 A JP 8634688A JP H01258488 A JPH01258488 A JP H01258488A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- liquid
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000004080 punching Methods 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 13
- 239000002893 slag Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 210000003296 saliva Anatomy 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はプリント配線板の製造方法およびその装置に
関し、さらに詳しく言えば、プリント配線板を打抜くと
きに起こる打抜き滓による穴詰り不良を解消する打抜き
滓除去手段に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method and apparatus for manufacturing a printed wiring board, and more specifically, to eliminate clogging defects caused by punching residue that occur when punching a printed wiring board. This invention relates to a means for removing punching slag.
一般に、プリント配線板は銅張積層板をフォトリソ技術
を利用してエツチングし、回路パターンを形成し、その
表面にソルダーレジストなどを印刷した後に、電子部品
のリードを挿通するための透孔を打抜きプレスで穿設し
ている。この透孔を形成するに際しては、プリント配線
板を下金型上に載置し、穴明はピンを有する上金型を下
降させることによって、同穴明はピンにてプリント配線
板の所定箇所に透孔を穿設している。Generally, printed wiring boards are made by etching a copper-clad laminate using photolithography to form a circuit pattern, printing a solder resist on the surface, and then punching through holes for inserting the leads of electronic components. It is drilled using a press. When forming this through hole, the printed wiring board is placed on the lower mold, and the hole is made by lowering the upper mold having a pin. A through hole is drilled in the hole.
このようにして、プリント配線板に透孔を穿設するので
あるが、上金型を上昇させて穴明はピンをプリント配線
板から引き抜く際、同穴明はピンにかじり付いた抜き滓
が透孔内に戻され、透孔が塞がれてしまうという現象が
生じ、その対策に苦慮している。また、最近では回路パ
ターンの細線化に伴い、ピン径が小さくなり、かつピン
間が狭くなってきたため、より以」二に穴詰まりによる
不良が大きな問題となっている。In this way, through-holes are drilled in the printed wiring board, but when the upper mold is raised and the pins are pulled out from the printed wiring board, the holes are removed from the holes that are stuck to the pins. There is a phenomenon in which the material is returned to the hole and the hole is blocked, and we are struggling to find a countermeasure for this problem. Furthermore, in recent years, as circuit patterns have become thinner, the pin diameter has become smaller and the distance between the pins has become narrower, making defects due to hole clogging an even bigger problem.
従来、このような穴詰まりを有するプリント配線板の抜
き滓は、−度に複数の針を挿通させることによって除去
しているが、この工程は人手を介して行なっているため
に生産性の向上が期待できないとともに、自動化ライン
の構成を困難なものとしている。また、パターン化され
た針山はプリント配線板の透孔のパターンに対応させて
その都度製作しなければならず、さらには針が折れたり
、曲がったりするという欠点があった。Conventionally, the residue of printed wiring boards with clogging of holes is removed by inserting multiple needles at once, but this process is done manually, which improves productivity. This makes it difficult to configure an automated line. Further, the patterned needles must be manufactured each time in accordance with the pattern of the through holes in the printed wiring board, and there is also the disadvantage that the needles may break or bend.
この発明は上記した従来の事情に鑑みなされたもので、
その目的は、プリント配線板の透孔内に詰っている打抜
き滓を一連の流れ工程において自動的に除去し得るよう
にしたプリント配線板の製造方法およびその方法の実施
に好適な装置を提供することにある。This invention was made in view of the above-mentioned conventional circumstances,
The purpose is to provide a method for manufacturing a printed wiring board that can automatically remove punching slag clogging the through holes of the printed wiring board in a series of flow steps, and an apparatus suitable for carrying out the method. There is a particular thing.
上記目的を達成するため、この発明においては、透孔を
有し、かつ透孔内にその打抜き滓に有するプリント配線
板を液体中において水平に移動させながら、その液体を
介して同プリント配線板に超音波による振動を与え、透
孔内の打抜き滓を脱落させるようにしている。In order to achieve the above object, in the present invention, a printed wiring board having a through hole and having its punching residue inside the through hole is moved horizontally in a liquid, and the printed wiring board is passed through the liquid. Ultrasonic vibration is applied to the hole to cause the punching slag inside the hole to fall out.
上記方法を実施するため、この発明の装置は対向する両
側壁にプリント配線板搬入口と搬出口とを有する液貯溜
槽を備えている。この液貯溜槽内にはに二記搬入Ｌ１と
搬出口を含む搬送径路に沿って搬送する搬送手段と、こ
の搬送径路上のプリント配線板に対して所定の間隔をも
って非接触状態に配置された超音波振動子とが設けられ
ている。この場合、液貯溜槽内には」：記搬送径路上の
プリント配線板および超音波振りＪ子のホーンチップの
少なくとも一部が液中に没する液面にまで所定の液体（
例えば水）が貯渭される。In order to carry out the above method, the apparatus of the present invention is equipped with a liquid storage tank having a printed wiring board loading port and a printed wiring board loading port on opposite side walls. Inside this liquid storage tank, there are two conveyance means for conveying along a conveyance path including an inlet L1 and an outlet, and a conveyance means disposed in a non-contact state at a predetermined interval with respect to the printed wiring board on this conveyance path. An ultrasonic vibrator is provided. In this case, the liquid storage tank is filled with a predetermined liquid (
For example, water) is stored.
」二記構成において、プリント配線板が液貯溜槽を通過
する際、同プリント配線板には超音波振動子から発生さ
れる超音波振動が液体を介して伝達され、その超音波振
動にて透孔内の打抜き滓が除去される。2, when the printed wiring board passes through the liquid storage tank, the ultrasonic vibrations generated by the ultrasonic vibrator are transmitted to the printed wiring board through the liquid, and the ultrasonic vibrations transmit the liquid to the printed wiring board. The punching slag inside the hole is removed.
以ド、この発明の一実施例を添付図面を参照しながら詳
細に説明する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.
このプリント配線板の製造装置は、所定の大きさに形成
されだ液貯溜槽１を備えている。この液貯溜槽ｌの対向
する両側壁１ａ、ｌｂにはプリント配線板搬入口２ａと
同搬出口２ｂとが形成されている。また、この液貯溜槽
１内には、プリント配線板３を一ヒ記搬入ロ２ａと搬出
口２ｂとを含む搬送径路に沿って搬送する搬送手段４と
、この搬送手段４にて搬送されるプリント配線板３に対
して超音波振動を与える例えば２つの超音波振動子５．
６とがＭけられている。この実施例において、搬送手段
４はウレタン樹脂を被覆してなる上下１対搬送ローラ４
ａ、４ｂを例えば３組備えている。This printed wiring board manufacturing apparatus includes a saliva storage tank 1 formed to a predetermined size. A printed wiring board loading port 2a and a printed wiring board loading port 2b are formed on opposite side walls 1a and lb of this liquid storage tank l. Further, inside this liquid storage tank 1, there is a conveyance means 4 for conveying the printed wiring board 3 along a conveyance path including a carry-in slot 2a and an outlet 2b, and a conveyance means 4 for conveying the printed wiring board 3 along a conveyance path including a carry-in slot 2a and an outlet 2b. For example, two ultrasonic vibrators 5. which apply ultrasonic vibration to the printed wiring board 3.
6 is marked with M. In this embodiment, the conveying means 4 is a pair of upper and lower conveying rollers 4 coated with urethane resin.
For example, three sets of a and 4b are provided.
一方、各超音波振動子５，６は例えばＮｉ−Ｃｒ鋼から
なるホーンチップ５ａ、６ａを備えている。On the other hand, each ultrasonic vibrator 5, 6 is provided with a horn tip 5a, 6a made of Ni--Cr steel, for example.
この場合、各ホーンチップ５ａ、６ａは上記搬送ローラ
４ａ、４ｂにて搬送されるプリント配線板３に対して非
接触状態、例えば１誼程度の間隔をもつように配置され
ている。なおこの実施例においては、一方のボーンチッ
プ５ａにてプリント配線板３の搬送方向左側半分を受持
たせ、他方のホーンチップ６ａにて同プリント配線板３
の右側半分を受持たせるようにしている。これはプリン
ト配線板３の幅寸法Ｗ１が例えば３０１と広いため、幅
寸法Ｗ２が例えば約１．５ ｃｓのホーンチップ５ａ。In this case, each horn chip 5a, 6a is arranged in a non-contact state, for example, at an interval of about one foot, with respect to the printed wiring board 3 conveyed by the conveyance rollers 4a, 4b. In this embodiment, one bone chip 5a is in charge of the left half of the printed wiring board 3 in the conveyance direction, and the other horn chip 6a is in charge of the left half of the printed wiring board 3 in the conveyance direction.
I am trying to assign the right half of the board to take charge. This is because the printed wiring board 3 has a wide width W1 of, for example, 301 cm, so the horn chip 5a has a width W2 of about 1.5 cs, for example.
６ａを２つ用いているのであるが、Ｗ１≦Ｗ２のような
場合には１つのホーンチップでもよい。Although two horn tips 6a are used, one horn tip may be used if W1≦W2.
液貯溜槽１内には水またはイミダゾールの誘導体等の液
体が入れられる。イミダゾールの誘導体としては例えば
グリコート液（商品名：四国化成工業■製）があり、同
波を使用するとプリント配線板への防錆付与工程を一緒
に行うことができる。A liquid such as water or an imidazole derivative is placed in the liquid storage tank 1 . Examples of imidazole derivatives include Glycoat liquid (trade name: manufactured by Shikoku Kasei Kogyo ■), and when Glycoat liquid is used, the process of imparting rust prevention to printed wiring boards can be carried out at the same time.
液体は図示しないポンプにより供給され、その液面はプ
リント配線板３および上記ホーンチップ５ａ、６ａの少
なくとも一部が没するレベルに制御される。図示されて
いないが、この液面レベル制御は例えばフロートスイッ
チにて液体供給ポンプをオンオフさせることにより行な
われる。すなわち、上記レベルにまで液体を入れると、
同液体は搬入口２ａおよび搬出口２ｂより常に流出する
ことになるが、その分ポンプより液体が補充され、液面
レベルがほぼ一定に保たれるようになされている。The liquid is supplied by a pump (not shown), and the liquid level is controlled to such a level that at least a portion of the printed wiring board 3 and the horn chips 5a, 6a are submerged. Although not shown, this liquid level control is performed, for example, by turning on and off a liquid supply pump using a float switch. In other words, if you add liquid to the above level,
The liquid always flows out from the carry-in port 2a and the carry-out port 2b, but the liquid is replenished by the pump to keep the liquid level almost constant.
なお、参照符号７ａ、７ｂはプリント配線板３の搬入ロ
ーラ、８ａ、８ｂは同搬出ローラ、９はプリント配線板
３を次段の工程に送るためのコンベアベルトである。Reference numerals 7a and 7b are rollers for carrying in the printed wiring board 3, 8a and 8b are rollers for carrying the printed wiring board 3, and 9 is a conveyor belt for sending the printed wiring board 3 to the next step.
（実 験 例）
超音波振動子；定振幅周波数自動追尾型、発振周波数１
９．５に土、最大出力６００Ｗ２基。(Experiment example) Ultrasonic transducer; constant amplitude frequency automatic tracking type, oscillation frequency 1
Sat on 9.5, 2 units with maximum output of 600W.
液体；水道水（特に液温調整せず）
プリント配線板の搬送速度；１２α／秒プリント配線板
；紙フェノール樹脂基板（透孔数２６００個）
穴明はピンにて２６００個の透孔を穿設したところ、抜
き滓による穴詰り箇所は１５５箇所であった。この基板
に上記の条件で液貯溜槽１内を通過させたところ、穴詰
り箇所は皆無であった。なお、打抜き滓は搬入口２ａお
よび搬出口２ｂよりオーバーフロー水とともに槽外へ搬
出され、好ましくは図示しないフィルタにて捕獲される
。Liquid: Tap water (no particular adjustment of liquid temperature) Conveyance speed of printed wiring board: 12α/sec Printed wiring board: Paper phenolic resin board (2600 holes) Drill 2600 holes with a pin. As a result, 155 holes were clogged with slag. When this substrate was passed through the liquid storage tank 1 under the above conditions, there were no clogged holes. Note that the punching slag is carried out of the tank together with overflow water from the carrying-in port 2a and the carrying-out port 2b, and is preferably captured by a filter (not shown).
プリント配線板は上記のようにして抜き滓を除去した後
、酸処理工程、ブラシ研磨工程、水洗工程、酸化防止処
理工程、水洗工程、乾燥工程、電気的ショートオープン
検査工程およびフラックスコート処理工程を経たのちホ
ールチエツクを受けて部品実装工程等に送られる。After removing the scum as described above, the printed wiring board undergoes an acid treatment process, a brush polishing process, a water washing process, an oxidation prevention process, a water washing process, a drying process, an electrical short-open inspection process, and a flux coating process. After that, it undergoes a hall check and is sent to the component mounting process.
以上説明したように、この発明によれば、一連の流れ工
程においてプリント配線板の透孔内に詰っている抜き滓
をほぼ完全に除去することができる。As explained above, according to the present invention, it is possible to almost completely remove the slag clogging the through holes of the printed wiring board in a series of flow steps.
第１図はこの発明の一実施例を示した概整的な断面図、
第２図はその平面配置図である。
図中、１は液貯溜槽、２ａは搬入口、２ｂは搬出口、３
はプリント配線板、４は搬送手段、４ａ。
４ｂは搬送ローラ、５，６は超音波振動子、５ａ。
６ａはホーンチップである。
特許出願人 エルナー株式会社
代理人 弁理士 大 原 拓 也第１図
第 ２ 図FIG. 1 is a schematic sectional view showing an embodiment of the present invention;
FIG. 2 is a plan layout thereof. In the figure, 1 is a liquid storage tank, 2a is an inlet, 2b is an outlet, 3
4 is a printed wiring board; 4 is a conveying means; 4a; 4b is a conveyance roller, 5 and 6 are ultrasonic transducers, and 5a. 6a is a horn tip. Patent Applicant Elnor Co., Ltd. Agent Patent Attorney Takuya Ohara Figure 1 Figure 2
Claims (4)
プリント配線板を液体中において水平に移動させながら
、その液体を介して同プリント配線板に超音波による振
動を与え、透孔内の打抜き滓を脱落除去することを特徴
とするプリント配線板の製造方法。(1) While horizontally moving a printed wiring board that has a through hole and the punching residue inside the through hole, ultrasonic vibration is applied to the printed wiring board through the liquid. A method for manufacturing a printed wiring board, characterized in that punching slag in the holes is dropped and removed.
内に詰まっている打抜き滓を除去する打抜き滓除去手段
を備えているプリント配線板の製造装置において、 対向する両側壁にプリント配線板搬入口と搬出口とを有
する液貯溜槽と、該液貯溜槽内において上記プリント配
線板を上記搬入口と搬出口を含む搬送径路に沿って搬送
する搬送手段と、該搬送径路上のプリント配線板に対し
て所定の間隔をもって非接触状態に配置された超音波振
動子とを備え、上記液貯溜槽内には上記搬送径路上のプ
リント配線板および上記超音波振動子のホーンチップの
少なくとも一部が液中に没する液面にまで所定の液体が
貯溜され、上記超音波振動子による超音波振動を液体を
介して上記プリント配線板に伝達させることにより、同
プリント配線板を搬送しながらその透孔内の打抜き滓を
脱落除去させるようにしたことを特徴とするプリント配
線板の製造装置。(2) In a printed wiring board manufacturing apparatus equipped with a punching slag removing means for removing punching slag stuck in the through hole of a printed wiring board punched with a hole punching pin, printed wiring is printed on opposite side walls. a liquid storage tank having a board loading port and a board loading port; a transport means for transporting the printed wiring board in the liquid storage tank along a transport path including the board loading port and the board loading port; an ultrasonic transducer disposed in a non-contact state at a predetermined interval with respect to the wiring board, and the liquid storage tank includes at least a printed wiring board on the conveyance path and a horn tip of the ultrasonic transducer. A predetermined liquid is stored up to the liquid level where a portion is submerged in the liquid, and the printed wiring board is transported by transmitting ultrasonic vibrations from the ultrasonic vibrator to the printed wiring board via the liquid. A printed wiring board manufacturing apparatus characterized in that the punching slag within the through hole is dropped and removed.
板の製造装置。(3) The printed wiring board manufacturing apparatus according to claim 1, wherein the liquid is water.
記載のプリント配線板の製造装置。(4) Claim 1, wherein the liquid is an imidazole derivative.
A manufacturing apparatus for the printed wiring board described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8634688A JPH01258488A (en) | 1988-04-08 | 1988-04-08 | Manufacture of printed wiring board and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8634688A JPH01258488A (en) | 1988-04-08 | 1988-04-08 | Manufacture of printed wiring board and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01258488A true JPH01258488A (en) | 1989-10-16 |
Family
ID=13884303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8634688A Pending JPH01258488A (en) | 1988-04-08 | 1988-04-08 | Manufacture of printed wiring board and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01258488A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996021341A1 (en) * | 1995-01-05 | 1996-07-11 | Hübel, Egon | Method and device for the treatment of plate-shaped workpieces having small holes |
| EP1109429A2 (en) * | 1999-12-17 | 2001-06-20 | Matsushita Electric Industrial Co., Ltd. | A method of manufacturing a circuit board and its manufacturing apparatus |
| WO2001072096A1 (en) * | 2000-03-23 | 2001-09-27 | Atotech Deutschland Gmbh | Treatment of circuit supports with impulse excitation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60107890A (en) * | 1983-11-17 | 1985-06-13 | 松下電器産業株式会社 | Substrate cleaning device |
| JPS6225495A (en) * | 1985-05-28 | 1987-02-03 | ウ−ランジエ シアンテイフイク エ デ ラボラトワ−ルズ オ．エス．エル．ソシエテ・アノニム | Apparatus for washing electronic component and/or precision mechanical part |
| JPS63141391A (en) * | 1986-11-11 | 1988-06-13 | シエーリング・アクチエンゲゼルシヤフト | Method of removing contamination while drilling holes in conductor plate |
-
1988
- 1988-04-08 JP JP8634688A patent/JPH01258488A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60107890A (en) * | 1983-11-17 | 1985-06-13 | 松下電器産業株式会社 | Substrate cleaning device |
| JPS6225495A (en) * | 1985-05-28 | 1987-02-03 | ウ−ランジエ シアンテイフイク エ デ ラボラトワ−ルズ オ．エス．エル．ソシエテ・アノニム | Apparatus for washing electronic component and/or precision mechanical part |
| JPS63141391A (en) * | 1986-11-11 | 1988-06-13 | シエーリング・アクチエンゲゼルシヤフト | Method of removing contamination while drilling holes in conductor plate |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996021341A1 (en) * | 1995-01-05 | 1996-07-11 | Hübel, Egon | Method and device for the treatment of plate-shaped workpieces having small holes |
| EP1109429A2 (en) * | 1999-12-17 | 2001-06-20 | Matsushita Electric Industrial Co., Ltd. | A method of manufacturing a circuit board and its manufacturing apparatus |
| EP1109429A3 (en) * | 1999-12-17 | 2003-09-17 | Matsushita Electric Industrial Co., Ltd. | A method of manufacturing a circuit board and its manufacturing apparatus |
| US6820331B2 (en) | 1999-12-17 | 2004-11-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a circuit board and its manufacturing apparatus |
| US7143772B2 (en) | 1999-12-17 | 2006-12-05 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a circuit board and its manufacturing apparatus |
| WO2001072096A1 (en) * | 2000-03-23 | 2001-09-27 | Atotech Deutschland Gmbh | Treatment of circuit supports with impulse excitation |
| DE10015349A1 (en) * | 2000-03-23 | 2001-10-25 | Atotech Deutschland Gmbh | Treatment method for wetting, removal of gas bubbles and improving material exchange in both through and blind holes in circuit boards by impulse generation |
| KR100751735B1 (en) * | 2000-03-23 | 2007-08-27 | 아토테크 도이칠란드 게엠베하 | Treatment of circuit supports with impulse excitation |
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