ES2022221B3 - Procedimiento para la galvanizacion adherente de materiales ceramicos. - Google Patents

Procedimiento para la galvanizacion adherente de materiales ceramicos.

Info

Publication number
ES2022221B3
ES2022221B3 ES87110335T ES87110335T ES2022221B3 ES 2022221 B3 ES2022221 B3 ES 2022221B3 ES 87110335 T ES87110335 T ES 87110335T ES 87110335 T ES87110335 T ES 87110335T ES 2022221 B3 ES2022221 B3 ES 2022221B3
Authority
ES
Spain
Prior art keywords
galvanization
adherent
procedure
ceramic materials
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87110335T
Other languages
English (en)
Inventor
Harald Suhr
Christian Oehr
Ernst Feurer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Application granted granted Critical
Publication of ES2022221B3 publication Critical patent/ES2022221B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
ES87110335T 1986-09-22 1987-07-17 Procedimiento para la galvanizacion adherente de materiales ceramicos. Expired - Lifetime ES2022221B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863632513 DE3632513A1 (de) 1986-09-22 1986-09-22 Verfahren zum haftfesten galvanisieren von keramischen materialien

Publications (1)

Publication Number Publication Date
ES2022221B3 true ES2022221B3 (es) 1991-12-01

Family

ID=6310279

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87110335T Expired - Lifetime ES2022221B3 (es) 1986-09-22 1987-07-17 Procedimiento para la galvanizacion adherente de materiales ceramicos.

Country Status (5)

Country Link
EP (1) EP0261334B1 (es)
JP (1) JPH0832609B2 (es)
AT (1) AT395600B (es)
DE (2) DE3632513A1 (es)
ES (1) ES2022221B3 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3814224C1 (en) * 1988-04-27 1989-07-13 W.C. Heraeus Gmbh, 6450 Hanau, De Process for pretreating aluminium nitride ceramic to be metallised
DE3833441A1 (de) * 1988-10-01 1990-04-05 Hoechst Ag Verfahren zum metallisieren von aluminiumoxid-substraten
DE4138214A1 (de) * 1991-11-21 1993-05-27 Daimler Benz Ag Verfahren zur metallisierung von aluminiumnitridkeramik

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2906888A1 (de) * 1979-02-22 1980-09-04 Degussa Verfahren zur herstellung hartloetfaehiger metallschichten auf keramik

Also Published As

Publication number Publication date
DE3769898D1 (de) 1991-06-13
EP0261334A3 (en) 1988-10-12
ATA237887A (de) 1992-06-15
JPS6389483A (ja) 1988-04-20
DE3632513A1 (de) 1988-03-24
JPH0832609B2 (ja) 1996-03-29
EP0261334A2 (de) 1988-03-30
EP0261334B1 (de) 1991-05-08
AT395600B (de) 1993-01-25

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