ES2022137B3 - Procedimiento de reciclaje de una tarjeta que consta de un compuesto, y tarjeta prevista para su reciclaje. - Google Patents

Procedimiento de reciclaje de una tarjeta que consta de un compuesto, y tarjeta prevista para su reciclaje.

Info

Publication number
ES2022137B3
ES2022137B3 ES86402465T ES86402465T ES2022137B3 ES 2022137 B3 ES2022137 B3 ES 2022137B3 ES 86402465 T ES86402465 T ES 86402465T ES 86402465 T ES86402465 T ES 86402465T ES 2022137 B3 ES2022137 B3 ES 2022137B3
Authority
ES
Spain
Prior art keywords
recycling
card
compound
intended
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES86402465T
Other languages
English (en)
Inventor
Jean-Pierre Gloton
Philippe Peres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Composants Militaires et Spatiaux
Original Assignee
Thomson Composants Militaires et Spatiaux
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Composants Militaires et Spatiaux filed Critical Thomson Composants Militaires et Spatiaux
Application granted granted Critical
Publication of ES2022137B3 publication Critical patent/ES2022137B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
ES86402465T 1985-11-08 1986-11-04 Procedimiento de reciclaje de una tarjeta que consta de un compuesto, y tarjeta prevista para su reciclaje. Expired - Lifetime ES2022137B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8516604A FR2590052B1 (fr) 1985-11-08 1985-11-08 Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee

Publications (1)

Publication Number Publication Date
ES2022137B3 true ES2022137B3 (es) 1991-12-01

Family

ID=9324661

Family Applications (1)

Application Number Title Priority Date Filing Date
ES86402465T Expired - Lifetime ES2022137B3 (es) 1985-11-08 1986-11-04 Procedimiento de reciclaje de una tarjeta que consta de un compuesto, y tarjeta prevista para su reciclaje.

Country Status (7)

Country Link
US (1) US4810865A (es)
EP (1) EP0229538B1 (es)
JP (1) JPS62114086A (es)
DE (1) DE3679305D1 (es)
DK (1) DK168900B1 (es)
ES (1) ES2022137B3 (es)
FR (1) FR2590052B1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2724477B1 (fr) * 1994-09-13 1997-01-10 Gemplus Card Int Procede de fabrication de cartes sans contact
EP1174881A1 (en) * 2000-06-22 2002-01-23 STMicroelectronics S.r.l. Integrated circuit for memory card and memory card using the circuit

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
GB1442339A (en) * 1973-01-04 1976-07-14 Amp Inc Substrate connector
DE2305883A1 (de) * 1973-02-07 1974-08-15 Finsterhoelzl Rafi Elekt Leiterplatte
JPS5151281A (es) * 1974-10-31 1976-05-06 Tokyo Shibaura Electric Co
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2455320B1 (fr) * 1979-04-25 1986-01-24 Cii Honeywell Bull Dispositif de recyclage de supports d'enregistrement identifiables a l'aide de donnees d'identification et composes de memoires monolithiques non volatiles effacables
GB2073947B (en) * 1980-04-11 1983-12-21 Philips Electronic Associated Integrated circuit encapsulation
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
US4621278A (en) * 1981-12-30 1986-11-04 Sanyo Electric Co., Ltd. Composite film, semiconductor device employing the same and method of manufacturing
US4396457A (en) * 1982-03-17 1983-08-02 E. I. Du Pont De Nemours And Company Method of making bumped-beam tape
JPS58206147A (ja) * 1982-05-26 1983-12-01 Fujitsu Ltd 半導体装置モジユ−ル
US4480150A (en) * 1982-07-12 1984-10-30 Motorola Inc. Lead frame and method
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
JPS60589A (ja) * 1983-06-16 1985-01-05 Kyodo Printing Co Ltd Ｉｃカ−ド
JPH0631959B2 (ja) * 1983-09-28 1994-04-27 沖電気工業株式会社 音楽装置
US4536825A (en) * 1984-03-29 1985-08-20 Unitrode Corporation Leadframe having severable fingers for aligning one or more electronic circuit device components
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
US4649415A (en) * 1985-01-15 1987-03-10 National Semiconductor Corporation Semiconductor package with tape mounted die

Also Published As

Publication number Publication date
DK168900B1 (da) 1994-07-04
DK527386A (da) 1987-05-09
EP0229538A1 (fr) 1987-07-22
EP0229538B1 (fr) 1991-05-15
US4810865A (en) 1989-03-07
FR2590052B1 (fr) 1991-03-01
FR2590052A1 (fr) 1987-05-15
DK527386D0 (da) 1986-11-05
DE3679305D1 (de) 1991-06-20
JPS62114086A (ja) 1987-05-25

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