EP4594823A1 - Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlage - Google Patents
Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlageInfo
- Publication number
- EP4594823A1 EP4594823A1 EP23758333.1A EP23758333A EP4594823A1 EP 4594823 A1 EP4594823 A1 EP 4594823A1 EP 23758333 A EP23758333 A EP 23758333A EP 4594823 A1 EP4594823 A1 EP 4594823A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cooling
- gas
- liquid
- space
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
- G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
Definitions
- the present invention relates to a cooling device for cooling a position-sensitive component of a lithography system, a corresponding lithography system and a method for operating a cooling device of a lithography system.
- the content of the priority application DE 102022125354.6 is fully incorporated by reference.
- Microlithography is used to produce microstructured components, such as integrated circuits. The microlithography process is carried out with a lithography system which has an illumination system and a projection system.
- EUV lithography systems are currently being developed that use light with a wavelength in the range of 0.1 nm to 30 nm, in particular 13.5 nm. Since most materials absorb light of this wavelength, such EUV lithography systems must use reflective optics, i.e. mirrors, instead of - as was previously the case - refractive optics, i.e. lenses.
- one object of the present invention is to provide an improved cooling device for a lithography system, a corresponding lithography system and a method for operating a cooling device of a lithography system.
- a cooling device for cooling a position-sensitive component of a lithography system is proposed.
- the cooling device has: a cooling line with a liquid space for transporting a cooling liquid to the position-sensitive component and a gas space for receiving a gas, and an elastic separating membrane arranged within the cooling line, which separates the gas space from the liquid space.
- the position-sensitive component of the lithography system can be an optical or a mechanical component of the lithography system, e.g. a projection optics of the lithography system.
- the position-sensitive component is in particular a component that must be held in a precise position with only small tolerances during operation of the lithography system. Carl Zeiss SMT GmbH et al.
- the position-sensitive component of the lithography system is, for example, a mirror of the lithography system, e.g. a mirror of the projection optics of the lithography system.
- the mirrors of a projection optics of an EUV lithography system are usually movably attached to a support frame by means of actuators in order to be able to precisely adjust the position of the respective mirror.
- the position-sensitive component of the lithography system can also be a frame structure that serves as a (e.g. optical) reference.
- the position-sensitive component can, for example, be a sensor frame of the lithography system, e.g. the projection optics of the lithography system.
- a sensor frame usually has a sensor device for measuring a current position of one or more optical components of the lithography system relative to the sensor frame.
- the sensor frame is mounted in a vibration-decoupled manner with respect to a support frame of the optical component(s).
- the sensor device e.g. comprises a sensor frame for measuring the current position of one or more optical components of the lithography system.
- the optical component(s) can, for example, have reflector elements for reflecting a light emitted by the sensors (e.g. laser light).
- the one or more sensors are used to detect a position of the optical component(s) in six degrees of freedom.
- the six degrees of freedom include in particular three translational degrees of freedom (e.g. in three mutually perpendicular spatial directions) and three rotational degrees of freedom (e.g. with respect to a rotation around the three mutually perpendicular spatial directions).
- the proposed cooling device with the compressible gas volume integrated in the cooling line can dampen pressure fluctuations in the cooling liquid and reduce or avoid transmission to the position-sensitive component. Consequently, a greater precession can be achieved.
- Carl Zeiss SMT GmbH et al. 5 the position and thus the optical properties or reference properties of the position-sensitive component can be achieved. Consequently, an imaging property of the lithography system can be improved.
- interference excitation can be better compensated even in increasingly complex lithography systems with an increasing number of interference sources.
- the lithography system is, for example, an EUV or a DUV lithography system.
- EUV stands for "extreme ultraviolet” (EUV) and refers to a wavelength of the working light in the range of 0.1 nm to 30 nm, in particular 13.5 nm.
- DUV also stands for “deep ultraviolet” (DUV) and refers to a wavelength of the working light between 30 nm and 250 nm.
- EUV or DUV lithography system comprises an illumination system and a projection system.
- the image of a mask (reticle) illuminated by means of the illumination system is projected by means of the projection system onto a substrate coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, for example a silicon wafer, in order to transfer the mask structure onto the light-sensitive coating of the substrate.
- the cooling line is, for example, a pipe for passing the cooling liquid through.
- the cooling line has, for example, a metal pipe and/or a stainless steel pipe.
- the cooling line can, for example, have a circular cross-section.
- the cooling liquid is or comprises, for example, water.
- the cooling line serves, for example, to transport the cooling liquid to and/or from the position-sensitive component.
- the cooling line serves, for example, to transport the cooling liquid from a cooling unit of the cooling device to the position-sensitive component and/or from the Carl Zeiss SMT GmbH et al. 6 position-sensitive component (back) to the cooling unit.
- the cooling device can also have more than one cooling line.
- the cooling device is used in particular to avoid high temperatures and temperature fluctuations in the position-sensitive component.
- mirrors of an EUV lithography system (as an example of position-sensitive components) heat up as a result of absorption of the high-energy EUV radiation.
- the high temperatures and temperature fluctuations in the mirror caused by this and the associated thermal deformations of the mirror can lead to wavefront aberrations and thus impair the imaging properties of the mirrors.
- mirrors of the lithography system can be actively cooled.
- the cooling device can also be used (in addition to or instead of this) to cool, for example, a sensor frame (as an example of a position-sensitive component). This can prevent the sensor frame from heating up due to thermal radiation. Thermal radiation is caused in particular by working light of the lithography system absorbed by mirror surfaces or structural elements. Other heat sources can be, for example, actuators and heating heads. With the help of the cooling device, a stable temperature environment can be created for the sensor frame. As a result, a position measurement of the mirror or the multiple mirrors can be carried out with greater accuracy using the sensor device held by the sensor frame.
- the cooling device further comprises, for example, a cooling unit for cooling the cooling liquid, one or more pumps for generating a Carl Zeiss SMT GmbH et al. 7 required coolant flow rate of the cooling liquid and one or more valves to control the cooling flow.
- a certain coolant flow rate is required for cooling, which is implemented via a pump system.
- coolant sound water sound, longitudinal water sound wave
- every change in cross-section and every deflection of the liquid line as well as every installed valve in the cooling circuit can represent a source of disturbance that causes local pressure fluctuations in the liquid. This type of dynamic disturbance is also called flow-induced vibrations (FIV).
- FMV flow-induced vibrations
- the disturbance is transmitted to the cooled position-sensitive component via water sound.
- This causes the position of the position-sensitive component to deviate from a target position.
- a pressure surge from the coolant acts on surfaces of the cooled position-sensitive component.
- the pressure surge is converted into a force on the surfaces on which it acts. Due to this force, the position of the position-sensitive component deviates from the target position.
- the liquid space of the cooling line is arranged inside the cooling line and serves for the flow of the coolant.
- the gas space is arranged inside the cooling line and serves for holding a gas.
- the elastic separating membrane which separates the liquid space from the gas space, means that the volume of the liquid space and the gas space is variable.
- the elastic separating membrane means that the volume of the coolant and the volume of the gas are variable.
- the cooling device is in operation, e.g. when the lithography system is in operation, the liquid space is completely filled with the coolant when viewed in the cross-section of the cooling line.
- the Carl Zeiss SMT GmbH et al. 8 Gas space is completely filled with gas when viewed in the cross-section of the cooling line.
- the elastic separating membrane is particularly designed to form a gas bubble together with a gas contained in the gas space.
- the gas bubble is, for example, an axial gas bubble in relation to a central longitudinal axis of the liquid line.
- the elastic separating membrane is, in particular, (reversibly) deformable to adapt the volume of the liquid space and thus of the cooling liquid to a pressure of the cooling liquid in the liquid space.
- the elastic separating membrane is, for example, liquid-tight and/or gas-tight.
- the elastic separating membrane has, for example, an elastic material (e.g. thin-walled).
- a material of the elastic separating membrane includes, for example, polyurethane, silicone, rubber, natural rubber, silicone rubber, fluororubber and/or another elastic material. Fluororubber is particularly well suited for use in a vacuum due to its resistance to aging and low outgassing.
- a material of the elastic separation membrane can also comprise, for example, a fluorothermoplastic such as tetrafluoroethylene, hexafluoropropylene and/or vinylidene fluoride.
- the elastic material e.g. a highly dampened polymer
- the gas space can be a closed gas space for holding a gas in a static state.
- the gas space can also be part of a gas circuit in which the gas flows through the gas space during operation. For example, in this case a gas flow can be realized using a gas pump.
- the gas is, for example, a gas that includes air, high-purity room air, helium and/or one or more noble gases.
- the cooling device includes a gas that is held in the gas space.
- the gas space is a closed gas space in which the gas remains (e.g. permanently).
- the cooling line with the integrated gas volume is designed to dampen and/or suppress pressure fluctuations of the cooling liquid in a frequency range of 1 to 2 kHz, 1 to 1 kHz, 1 to 800 Hz, 1 to 500 Hz, 1 to 400 Hz, 1 to 200 Hz, 1 to 100 Hz and/or 50 to 150 Hz.
- the elastic separating membrane is a pressure membrane which is designed to deform when the pressure of the cooling liquid changes, so that a volume of the gas space changes accordingly.
- the separating membrane deforms in accordance with the pressure change.
- the gas in the gas space is in particular compressed or expands.
- Carl Zeiss SMT GmbH et al. 10 the gas space separated by the elastic separating membrane is rotationally symmetrical when viewed in the cross-section of the cooling line. Due to a rotationally symmetrical design of the gas space and thus of the gas volume, all forces acting on the gas bubble formed by the separating membrane and the gas in the gas space balance each other out and a force-free system is present.
- the liquid space and the gas space separated from the liquid space by the elastic separating membrane are arranged coaxially when viewed in the cross-section of the cooling line. This enables even better damping of a pressure fluctuation caused by the gas volume.
- the gas space is an internal gas space or an external gas space when viewed in the cross-section of the cooling line and in relation to the liquid space.
- the advantage of an internal gas space and thus an internal compressible gas volume is that the gas volume is arranged where the greatest flow velocity of the cooling liquid occurs. This makes dampening pressure fluctuations in the coolant particularly effective.
- the advantage of an external gas chamber is that the gas chamber is easier to access from the outside and the gas can therefore be filled and/or refilled more easily.
- the gas can be fed into the gas chamber via an opening and/or a valve in a wall of the cooling line.
- Carl Zeiss SMT GmbH et al. 11 In the case of an internal gas space, the gas space is, for example, exclusively delimited by the separating membrane, but not by an inner wall of the cooling line. In the case of an external gas space, the gas space is, for example, delimited by both the separating membrane and an inner wall of the cooling line.
- the cooling device has an elastic hose that surrounds the elastic separating membrane to form the gas space. This enables a gas volume integrated into a cooling line to be particularly easily implemented.
- the gas space is formed inside the hose (an example of an internal gas space).
- the liquid space is then formed outside the hose (e.g. between an outside of the hose and an inner wall of the cooling line).
- the gas space can also be formed outside the hose (an example of an external gas space) (e.g. between an outside of the hose and an inner wall of the cooling line).
- the liquid space is then formed inside the hose.
- the cooling device has at least one spacer arranged between the elastic separating membrane and an inner wall of the cooling line. Carl Zeiss SMT GmbH et al. 12 The at least one spacer can improve the arrangement of the elastic separating membrane within the cooling line, for example also during operation of the cooling device.
- a movement of the elastic separating membrane within the cooling line, in particular during operation of the cooling device, can be restricted (but without restricting a deformation of the elastic separating membrane).
- a position of the gas space relative to the liquid space can be limited.
- a rotationally symmetrical and/or coaxial arrangement of the gas space relative to the liquid space can also be maintained during operation (e.g. essentially).
- the at least one spacer is arranged, for example, in the gas space or in the liquid space.
- the cooling device can also have several spacers. The several spacers can be arranged (e.g. radially) at a longitudinal position of the cooling line and/or (e.g. spaced apart from one another) at several longitudinal positions of the cooling line.
- the cooling device has several spacers which are formed by knobs arranged on an outer side of the elastic separating membrane.
- the knobs e.g. projections
- the knobs can, for example, be made of the same material as the separating membrane.
- the separating membrane with the knobs can, for example, also be manufactured in one piece. Carl Zeiss SMT GmbH et al. 13
- the cooling device has fastening means for fastening the elastic separating membrane to an inner wall of the cooling line.
- the cooling device has a device for adjusting a pressure of a gas in the gas space.
- a gas pressure preload pressure
- the set gas pressure is in particular a gas pressure in a resting state (i.e. an undeformed state) of the separating membrane.
- a damping effect of the gas volume is in particular dependent on a relative pressure between the gas pressure of the gas volume and a pressure of the liquid.
- the cooling device has two or more elastic separating membranes arranged within the cooling line, which accordingly form two or more gas spaces separated from one another and from the liquid space.
- pressure fluctuations can be dampened even more precisely.
- the gas pressure of a gas in the several gas spaces can be different from one another, so that pressure surges with different frequencies can be dampened.
- Carl Zeiss SMT GmbH et al. 14 gas spaces and thus gas volumes can also be specifically designed for individual position-sensitive components.
- a gas pressure of a gas in a respective gas space can be specifically set to dampen a disturbance excitation of a respective position-sensitive component.
- a respective gas space can be arranged adjacent to and in relation to a flow direction (flow direction) of the cooling liquid (e.g. immediately) in front of a respective position-sensitive component.
- the two or more gas spaces seen in the cross section of the cooling line, are separated from one another and from the liquid space, and/or the two or more gas spaces are separated from one another and from the liquid space in relation to a flow direction of the cooling liquid.
- the two or more gas spaces are separated from one another and from the liquid space in relation to a flow direction of the cooling liquid, the cooling device has a gas in each of the two or more gas spaces, and the respective gases have different pressures from one another.
- the cooling device comprises one or more devices that are designed to adjust a pressure of a gas in the respective gas space. This allows, for example, a gas pressure and thus a damping frequency to be set in a targeted manner in each gas space.
- the cooling device has a foam-like and/or sponge-like element with several bubbles and an elastic material surrounding the several bubbles, wherein the gas space is formed by the several bubbles of the foam-like and/or sponge-like element. Carl Zeiss SMT GmbH et al. 15 and the separating membrane is formed by the elastic material surrounding the plurality of bubbles.
- the foam-like and/or sponge-like element can be used to provide the gas space separated by the separating membrane in an alternative way.
- the cooling device is designed so that a cooling liquid flows through the cooling line in a flow direction, and a diameter of the cooling line tapers along the flow direction.
- This changed shape of the cooling line can influence the flow speed of the cooling liquid and thus set a frequency range of the damping.
- the diameter of the cooling line tapers evenly along the flow direction.
- the cooling line extends (e.g. straight) in a longitudinal direction and the cooling liquid flows along the longitudinal direction through the cooling line.
- the diameter of the cooling line tapers along the longitudinal direction.
- the cooling line can also be curved, e.g. B. also run helically (often also called spiral).
- the diameter of the cooling line tapers along the helically curved cooling line.
- a lithography system in particular an EUV lithography system, is proposed.
- the lithography system comprises a cooling device as described above. Carl Zeiss SMT GmbH et al. 16
- the lithography system has, for example, at least one position-sensitive component.
- a method for operating a cooling device is proposed.
- the cooling device serves to cool a position-sensitive component of a lithography system.
- the cooling device has a cooling line with a liquid space for transporting a cooling liquid to the position-sensitive component and a gas space for receiving a gas, and an elastic separating membrane arranged within the cooling line, which separates the gas space from the liquid space.
- the method comprises the steps: a) flowing a cooling liquid through the liquid space of the cooling line, and b) changing a volume of the liquid space by deforming the elastic separating membrane in response to a pressure change of the cooling liquid in the liquid space.
- Changing a volume of the liquid space means in particular changing a volume of the cooling liquid in the liquid space.
- the position-sensitive component is preferably a position-sensitive component of a projection optics of the lithography system (projection exposure system).
- the position-sensitive component can also be a position-sensitive component of an illumination system of the lithography system.
- a tempering device for tempering a position-sensitive component of a lithography system has: Carl Zeiss SMT GmbH et al. 17 a liquid line with a liquid space for transporting a tempering liquid to the position-sensitive component and a gas space for receiving a gas, and an elastic separating membrane arranged within the liquid line, which separates the gas space from the liquid space.
- the tempering device can be used to influence a thermal condition of the position-sensitive component.
- the position-sensitive component can be tempered, i.e. cooled or heated, using the tempering device.
- the tempering device is a cooling device or a heating device.
- the tempering liquid is a cooling liquid or a heating liquid.
- a cooling device cooling, cooling liquid, cooling line, method for operating a cooling device, etc.
- a heating device heating, heating liquid, heating line, method for operating a heating device, etc.
- Any other counting word used here is also not to be understood as meaning that there is a restriction to exactly the number of elements mentioned. Rather, numerical deviations upwards and downwards are possible unless otherwise stated.
- Fig.1 shows a schematic meridional section of a projection exposure system for EUV projection lithography
- Fig.2 shows a positioning system with an optical component of the projection exposure system from Fig.1 according to an embodiment
- Fig.3 shows a cooling device for cooling the optical component from Fig.2 according to an embodiment, wherein the cooling device comprises a cooling line device with an integrated compressible gas volume
- Fig.4 shows a cross-sectional view of a functional principle of the cooling line device from Fig.3
- Fig.5 shows a cross-sectional view of the cooling line device from Fig.3, wherein an elastic separating membrane of the cooling line device is in a resting state
- Fig.6 shows a view similar to Fig.5, wherein the elastic separating membrane is in an elastically deformed state
- Fig.7 shows a cross-sectional view of a further embodiment of the cooling line device of the cooling device from Fig.3
- Fig.8 shows a cross-sectional view of a further embodiment of the cooling line device of the cooling device from Fig.3
- Fig.9 shows a cross-sectional view of a further embodiment of the cooling line device of the cooling device from Fig.3
- Fig.10 shows a cross-sectional view of a further embodiment of the cooling line device of the cooling device from Fig.3, wherein the separating membrane of the cooling line device has spacers
- Fig.11 shows a perspective view of a further embodiment of the cooling line device of the cooling device from Fig.3, wherein the cooling line device has fastening means according to a first variant
- Fig.12 shows a perspective view of a further embodiment of the cooling line device of the cooling device from Fig.3, where
- Fig.15 shows a side view of another embodiment of the cooling line device of the cooling device from Fig.3; and Fig.16 shows a flow chart of a method for operating a cooling device of a projection exposure system according to an embodiment.
- Fig.1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system.
- One embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, an illumination optics 4 for illuminating an object field 5 in an object plane 6.
- the light source 3 can also be provided as a separate module from the rest of the illumination system 2.
- the illumination system 2 does not include the light source 3.
- a reticle 7 arranged in the object field 5 is exposed.
- the reticle 7 is held by a reticle holder 8.
- the reticle holder 8 can be displaced via a reticle displacement drive 9, in particular in a scanning direction.
- a Cartesian coordinate system with an x-direction x, a y-direction y and a z-direction z is shown in Fig. 1.
- the x-direction x runs perpendicularly into the plane of the drawing.
- the y-direction y runs horizontally and the z-direction z runs vertically.
- the scanning direction runs in Carl Zeiss SMT GmbH et al. 21 of Fig. 1 along the y-direction y.
- the z-direction z runs perpendicular to the object plane 6.
- the projection exposure system 1 comprises a projection optics 10.
- the projection optics 10 are used to image the object field 5 in an image field 11 in an image plane 12.
- the image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.
- a structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the area of the image field 11 in the image plane 12.
- the wafer 13 is held by a wafer holder 14.
- the wafer holder 14 can be displaced via a wafer displacement drive 15, in particular along the y-direction y.
- the displacement of the reticle 7 on the one hand via the reticle displacement drive 9 and the wafer 13 on the other hand via the wafer displacement drive 15 can be synchronized with each other.
- the light source 3 is an EUV radiation source.
- the light source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light.
- the useful radiation 16 has in particular a wavelength in the range between 5 nm and 30 nm.
- the light source 3 can be a plasma source, for example an LPP source (Laser Produced Plasma, plasma generated with the aid of a laser) or a DPP source (Gas Discharged Produced Plasma, plasma generated by means of gas discharge). It can also be a synchrotron-based radiation source.
- the light source 3 can be a free-electron laser (FEL). Carl Zeiss SMT GmbH et al. 22
- the illumination radiation 16, which emanates from the light source 3, is bundled by a collector 17.
- the collector 17 can be a collector with one or more ellipsoidal and/or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be exposed to the illumination radiation 16 in grazing incidence (GI), i.e.
- GI grazing incidence
- the collector 17 can be structured and/or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress stray light.
- the intermediate focus plane 18 can represent a separation between a radiation source module, having the light source 3 and the collector 17, and the illumination optics 4.
- the illumination optics 4 comprise a deflection mirror 19 and a first facet mirror 20 arranged downstream of this in the beam path.
- the deflection mirror 19 can be a flat deflection mirror or alternatively a mirror with a beam-influencing effect beyond the pure deflection effect.
- the deflection mirror 19 can be designed as a spectral filter that separates a useful light wavelength of the illumination radiation 16 from false light of a different wavelength.
- the first facet mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugated to the object plane 6 as a field plane, it is also referred to as a field facet mirror.
- the first facet mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Only a few of these first facets 21 are shown in Fig. 1 as examples. Carl Zeiss SMT GmbH et al. 23
- the first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or partially circular edge contour.
- the first facets 21 can be designed as flat facets or alternatively as convex or concave curved facets. As is known, for example, from DE 102008009600 A1, the first facets 21 themselves can also be composed of a large number of individual mirrors, in particular a large number of micromirrors.
- the first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 102008009600 A1.
- MEMS system microelectromechanical system
- the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror.
- the second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4.
- the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006/0132747 A1, EP 1614 008 B1 and US 6,573,978.
- the second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets. Carl Zeiss SMT GmbH et al.
- the second facets 23 can also be macroscopic facets, which can be round, rectangular or hexagonal, for example, or alternatively facets composed of micromirrors. In this regard, reference is also made to DE 102008009600 A1.
- the second facets 23 can have flat or alternatively convex or concave curved reflection surfaces.
- the illumination optics 4 thus form a double-faceted system. This basic principle is also referred to as a fly's eye integrator. It can be advantageous not to arrange the second facet mirror 22 exactly in a plane that is optically conjugated to a pupil plane of the projection optics 10. In particular, the second facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 102017220586 A1.
- the second facet mirror 22 is the last bundle-forming or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.
- a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which in particular contributes to the image of the first facets 21 in the object field 5.
- the transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4.
- the transmission optics can in particular have one or two mirrors for Carl Zeiss SMT GmbH et al.
- the illumination optics 4 has exactly three mirrors after the collector 17, namely the deflection mirror 19, the first facet mirror 20 and the second facet mirror 22.
- the deflection mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.
- the imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optics in the object plane 6 is usually only an approximate imaging.
- the projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.
- the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible.
- the projection optics 10 is a double-obscured optic.
- the penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16.
- the projection optics 10 have a numerical aperture on the image side that is greater than 0.5 and can also be greater than 0.6 and can be, for example, 0.7 or 0.75. Carl Zeiss SMT GmbH et al.
- Reflection surfaces of the mirrors Mi can be designed as free-form surfaces without a rotational symmetry axis.
- the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape.
- the mirrors Mi just like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.
- the projection optics 10 have a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11.
- This object-image offset in the y-direction y can be approximately as large as a z-distance between the object plane 6 and the image plane 12.
- the projection optics 10 can in particular be designed anamorphically. In particular, it has different imaging scales ⁇ x, ⁇ y in the x and y directions x, y.
- a positive imaging scale ⁇ means an image without image inversion.
- a negative sign for the image scale ⁇ means an image with image inversion.
- the projection optics 10 thus lead to a reduction in the ratio 4:1 in the x-direction x, i.e.
- the projection optics 10 lead to a reduction in the y-direction y, i.e. in the scanning direction, of 8:1.
- Carl Zeiss SMT GmbH et al. 27 Other image scales are also possible. Image scales with the same sign and absolutely the same in the x and y directions x, y, for example with absolute values of 0.125 or 0.25, are also possible.
- the number of intermediate image planes in the x and y directions x, y in the beam path between the object field 5 and the image field 11 can be the same or can be different, depending on the design of the projection optics 10.
- Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from US 2018/0074303 A1.
- One of the second facets 23 is assigned to exactly one of the first facets 21 to form a respective illumination channel for illuminating the object field 5. This can in particular result in illumination according to the Köhler principle.
- the far field is broken down into a plurality of object fields 5 using the first facets 21.
- the first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to them.
- the first facets 21 are each imaged onto the reticle 7 by an assigned second facet 23, superimposed on one another, to illuminate the object field 5.
- the illumination of the object field 5 is in particular as homogeneous as possible.
- the field uniformity can be achieved by superimposing different illumination channels.
- the illumination of the entrance pupil of the projection optics 10 can be defined geometrically by arranging the second facets 23. By selecting the illumination channels, in particular the subset of the second facets 23 that guide light, the intensity distribution in the entrance pupil of the Carl Zeiss SMT GmbH et al. 28 projection optics 10. This intensity distribution is also referred to as illumination setting or illumination pupil filling.
- a pupil uniformity that is also preferred in the area of defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels. Further aspects and details of the illumination of the object field 5 and in particular of the entrance pupil of the projection optics 10 are described below.
- the projection optics 10 can in particular have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.
- the entrance pupil of the projection optics 10 cannot usually be illuminated exactly with the second facet mirror 22.
- the projection optics 10 images the center of the second facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point.
- a surface can be found in which the pairwise determined distance of the aperture rays is minimal.
- This surface represents the entrance pupil or a surface conjugated to it in spatial space. In particular, this surface shows a finite curvature. It may be that the projection optics 10 have different positions of the entrance pupil for the tangential and the sagittal beam path.
- an imaging element in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7.
- this optical element With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.
- Carl Zeiss SMT GmbH et al. 29 In the arrangement of the components of the illumination optics 4 shown in Fig.1, the second facet mirror 22 is arranged in a surface conjugated to the entrance pupil of the projection optics 10.
- the first facet mirror 20 is arranged tilted to the object plane 6.
- the first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the deflection mirror 19.
- the first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the second facet mirror 22.
- Fig.2 shows a positioning system 100 with an optical component 102 (as an example of a position-sensitive component) according to an embodiment.
- the optical component 102 is, for example, a mirror of the projection exposure system 1 (lithography system), in particular the projection optics 10, from Fig.1.
- the optical component 102 is, for example, one of the mirrors M1 - M6.
- the optical component 102 is described as a mirror; in other examples, however, it can also be an optical component other than a mirror.
- the mirror 102 comprises a coating 104 with an optically active surface 106.
- the mirror 102 also comprises a substrate 108.
- Cooling lines 110 are arranged in the substrate 108, through which a cooling liquid 112, such as water, is passed in order to actively cool the mirror 102. Cooling the mirror 102 serves to avoid thermal deformations of the mirror 102, even when exposed to high-energy EUV radiation 16 (Fig.1).
- the mirror 102 is movably attached to a support frame 116 by means of an actuator device 114.
- the actuator device 114 has, for example, several Carl Zeiss SMT GmbH et al. 30 actuators 118 and a drive unit (not shown).
- the actuator device 114 serves, for example, to position the mirror 102 with respect to six degrees of freedom (translation in the X, Y and Z directions and rotation about the X, Y and Z directions).
- the positioning system 100 also has a sensor device 120 to detect a current position of the mirror 102.
- the sensor device 120 is only indicated schematically in Fig.2.
- the sensor device 120 has one or more sensors, such as interferometers.
- the sensors of the sensor device 120 are, for example, attached to a sensor frame (not shown).
- the sensor frame is, for example, attached to the support frame 116 in a vibration-decoupled manner.
- a current position of the mirror 102 is detected using laser beams 122.
- a cooling device 200 for cooling the mirror 102 is shown.
- the cooling device has a cooling circuit 202.
- the cooling device 200 comprises a cooling unit 204 for cooling a cooling liquid 112 (Fig.2) and cooling lines 206, 110 for transporting the cooling liquid 112.
- the cooling device 200 also comprises one or more pumps 208 for generating a required coolant flow rate of the cooling liquid 112.
- the cooling device 202 further comprises one or more valves 210 for controlling the cooling flow.
- the cooling device 200 can be used to cool several components of the lithography system 1.
- the mirror 102 from Fig.2 is shown in Fig.3 as a cooled component.
- the cooling lines 110 (Fig.2), which are arranged in the mirror substrate 108, are shown schematically in Fig.3.
- two further mirrors 102' and 102" - similar to the mirror 102 from Fig.2 - are shown as additional cooled components in Fig.3. Carl Zeiss SMT GmbH et al.
- Pumps of the cooling device 200 such as the pump 208, cause local pressure fluctuations in the liquid 112, which generates a dynamic disturbance. These pressure fluctuations are transmitted through the entire cooling circuit 202 via longitudinal water sound waves. Furthermore, cross-sectional changes (not shown) of the cooling line 206, deflections 212 of the cooling line 206 and valves 210 of the cooling device 200 can also represent sources of disturbance that cause local pressure fluctuations in the liquid 112. Such acoustic disturbance is transmitted to the cooled optical component 102, 102', 102" (the mirror 102, 102', 102") via water sound.
- the cooling device 200 serves, for example, to cool the mirrors 102, 102', 102". In other examples, however, the cooling device 200 can also serve to cool other position-sensitive components, such as other mirrors and/or a sensor frame (not shown) of the projection exposure system 1 (lithography system). To dampen pressure fluctuations of the cooling liquid 112, the cooling device 200 comprises a cooling line device 214 with an integrated compressible gas volume 216.
- the cooling line device 214 comprises the cooling line 206 or a section of the cooling line 206, a liquid space 218 for the cooling liquid 112 to flow through and a gas space 220 for receiving a gas 222 (gas volume 216). Furthermore, the cooling line device 214 comprises an elastic separating membrane 224 which separates the gas space 220 from the liquid space 218.
- Carl Zeiss SMT GmbH et al. 32 Fig.4 shows a functional principle of the cooling line device 200' from Fig.3. On the left side of Fig.4, a cooling line device 214' with a cooling line 206' and an elastic separating membrane 224' arranged in the cooling line 206' is shown, which is in a rest state.
- the elastic separating membrane 224' on the left side of Fig.4 is in a relaxed, undeformed state.
- the elastic separating membrane 224' separates the cooling liquid 112 in the liquid space 218' from the gas 222 in the gas space 220'.
- a volume of the cooling liquid 112 is VF1 in the rest state and a volume of the gas 222 is VG1 in the rest state.
- the cooling line device 214' with the elastic separating membrane 224' is shown in a state in which the elastic separating membrane 224' is in an elastically deformed state.
- the separating membrane 224' was deformed by an increase in the pressure of the cooling liquid 112, so that the volume V F2 of the liquid space 218' increased and at the same time the volume VG2 of the gas space 220' decreased accordingly.
- an increase in the pressure of the cooling liquid 112 can be dampened by expanding the liquid 112 and compressing the gas 222 in the gas space 220'.
- the dashed line in Fig.4 illustrates a deformation of the separating membrane 224' in the event of a reduction in the pressure of the cooling liquid 112 in the liquid space 218', which would lead to an increase in the volume of the gas space 220'. Accordingly, periodic pressure fluctuations of the cooling liquid 112 can also be dampened using the compressible gas bubble 216'.
- Fig.5 shows a cross-sectional view of the cooling line device 214 from Fig.3 along line VV.
- the elastic separating membrane 224 is a hose 226, in the interior 228 of which the gas 220 is located.
- the gas space 220 is an internal space with respect to the liquid space 218. Carl Zeiss SMT GmbH et al. 33 Gas space 220.
- the liquid space 218 through which the cooling liquid 112 flows is formed between an outer wall 230 of the hose 226 and an inner wall 232 of the cooling line 206.
- the gas space 220 is arranged and designed rotationally symmetrically with respect to the cooling line 206.
- the gas space 220, the liquid space 218 and the cooling line 206 are arranged coaxially with respect to one another.
- a central axis of the cooling line 206 is identified by the reference symbol A1
- a central axis of the liquid space 218 is identified by the reference symbol A2
- a central axis of the gas space 220 is identified by the reference symbol A3.
- the elastic separating membrane 224 ie the hose 226) is in a resting state.
- a volume of the gas 222 is V G1 ' and a volume of the cooling liquid 112 is V F1 '.
- Fig.6 shows the cooling line device 214 from Fig.5, wherein the elastic separating membrane 224 is in an elastically deformed state.
- Fig.7 shows a cross-sectional view of another embodiment of a cooling line device 314 of a cooling device 300 of the lithography system 1.
- the cooling line device 314 comprises a cooling line 306 with a Carl Zeiss SMT GmbH et al. 34 with respect to a liquid space 318 external gas space 320.
- a separating membrane 324 in this embodiment is designed in the form of a hose 326.
- Fig.8 shows a cross-sectional view of another embodiment of a cooling line device 414 of a cooling apparatus 400 of the lithography system 1.
- the cooling line device 414 comprises a cooling line 406 with two separating membranes 424 and 424', which are arranged coaxially. It can also be said that the two separating membranes 424 and 424' are concentric when viewed in the cross section of the cooling line 406.
- three spaces are created which are separated from one another by means of the two separating membranes 424 and 424' in the cross-section of the cooling line 406: two gas spaces 420 and 420' for receiving a gas 222 and a liquid space 418 for the cooling liquid 112 to flow through.
- the liquid space 418 which is annular in cross-section, is in contact with a respective gas space 420 and gas space 420' for pressure equalization from both sides, i.e. both on its inner side 434 and on its outer side 436.
- an annular gas space can also be flanked by two liquid spaces.
- Fig.9 shows a cross-sectional view of another embodiment of a cooling line device 514 of a cooling device 500 of the lithography system 1.
- the cooling line device 514 comprises a cooling line 506 with two separating membranes 524 and 524', each in the form of a hose 526, 526'.
- the separating membranes 524 and 524' are not arranged coaxially when viewed in cross section, but rather next to one another.
- Each of the hoses 526, 526' is filled with a gas 222 to provide a compressible gas volume 516, 516' for damping Carl Zeiss SMT GmbH et al. 35 Pressure fluctuations of the cooling liquid 112.
- Fig.9 is an example of two internal gas spaces 520, 520'.
- two liquid spaces formed within the hoses 526, 526' can also be provided.
- a gas space arranged between an outer wall 530, 530' of the hoses 526, 526' and an inner wall 532 of the cooling line 506 can be provided.
- Fig.10 shows a cross-sectional view of another embodiment of a cooling line device 614 of a cooling apparatus 600 of the lithography system 1.
- the cooling line device 614 is a variant of the cooling line device 214 shown in Fig.5.
- the cooling line device 614 according to the embodiment of Fig.10 differs from the cooling line device 214 according to the embodiment of Fig.5 in that several spacers 638 are arranged on the separating membrane 624.
- three of the spacers 638 shown in Fig.10 are provided with a reference number.
- the spacers 638 are arranged in particular between an outer wall 630 of the elastic separating membrane 624 and an inner wall 632 of the cooling line 606.
- the spacers 638 are formed by knobs 640 arranged on the outer wall 630 of the elastic separating membrane 624.
- the nubs 640 can in particular be made of the same material as the elastic separating membrane 624.
- the nubs can also be formed in one piece with the elastic separating membrane 624.
- Fig.11 shows a perspective view of another embodiment of a cooling line device 714 of a cooling device 700 of the lithography system 1.
- the cooling line device 714 comprises in particular fastening means 742 for fastening the elastic separating membrane 724 to an inner wall 732 of the cooling line 706.
- the elastic separating membrane 724 is in particular in Carl Zeiss SMT GmbH et al. 36 form of a hose 726.
- the fastening means 742 comprise, for example, a pipe clamp 744 which is arranged around the hose 726 and is clamped to the hose 726.
- the fastening means 742 also comprise, for example, a strut and/or a web 746 which connects the pipe clamp 744 to an inner wall 732 of the cooling line 706.
- the strut/web 746 is fastened on one side to the pipe clamp 744 and on its other side to the inner wall 732 of the cooling line 706.
- the strut/web 746 represents in particular an example of a spacer which holds the hose 726 in position within the liquid space 718 filled with the cooling liquid 112.
- Fig.12 shows a perspective view of a further embodiment of a cooling line device 814 of a cooling apparatus 800 of the lithography system 1.
- the cooling line device 814 has fastening means 842 according to a further variant.
- the fastening means 842 comprise struts 844 arranged between an outer wall 830 of the separating membrane 824 and an inner wall 832 of the cooling line 806.
- the struts are arranged radially in particular. In Fig.12, five struts are shown as an example, three of which have been provided with a reference number. In Fig.12, an internal gas space 820 is shown which is surrounded by an annular liquid space 818, but this arrangement can also be reversed so that there is an external gas space and an internal liquid space.
- the embodiments of the cooling line devices 214, 214', 214", 314, 414, 514, 614, 714 and 814 shown in Figures 3 to 12 can be combined with one another in many ways.
- the spacers 638 shown in Figure 10, the fastening means 742 shown in Figure 11 and the fastening means 842 shown in Figure 12 can be combined with any of the embodiments and variants shown and/or described in connection with Figures 3 to 9.
- Figures 8 and 9 show two examples of cooling line devices 414 and 514 in which more than one separating membrane 424, 524 is provided in order to provide more than one gas space 420, 520 for dampening pressure fluctuations of the cooling liquid 112, as seen in the cross section of the cooling line 406, 506.
- two separating membranes 424 and 424' or 524 and 524' are shown in each case in Figures 8 and 9 for forming two gas spaces 420 and 420' or 520 and 520'.
- more than two separating membranes can also be provided in such a way that more than two gas spaces are provided, as seen in the cross section of the cooling line 406, 506.
- more than two separating membranes 224, 224" can be provided such that they are separated from one another and from the liquid space 218 with respect to a flow direction (flow direction) R of the cooling liquid 112.
- the cooling device 200 can have two or more gas spaces 220, 220" which are separated from the liquid space 218 by means of the two or more separating membranes 224, 224".
- the two or more gas spaces 220, 220" are separated from one another and from the liquid space 218 in particular with respect to the flow direction (flow direction) R of the cooling liquid 112.
- a gas 222, 222" is accommodated in each of the two or more gas spaces 220, 220", wherein the gases 222, 222" can have different pressures P, P".
- the pressures P, P" refer in particular to pressures of the gases 222, 222" (preload pressures) in a resting state of the separating membrane 224, 224".
- a frequency range of a dampening can be set by setting the preload pressure P, P" of the respective gas volume 216, 216".
- Carl Zeiss SMT GmbH et al. 38 For example, low-frequency pressure surges can be dampened by a first gas volume 216 in the cooling circuit 202 in Fig.3.
- the first gas volume 216 can be specifically designed for low-frequency suppression and this can be implemented as close to the water cabinet as possible.
- higher frequency pressure surges can be dampened, for example, by a second gas volume 216" in the cooling circuit 202 in Fig.3.
- the preload pressure P" of the second gas volume 216" is set to a higher value than the preload pressure P of the first gas volume 216.
- the position control of the mirrors 102 results in a sensitive frequency range between approximately 50 and 150 Hz.
- the second gas volume 216" could be arranged directly in front of the actively controlled and cooled mirrors 102, which shows good suppression precisely in this frequency range.
- a cascading of the pressure damping in the cooling circuit 202 can also be realized in this way.
- gas volumes 216, 216" can also be specifically adapted to the damping requirements of individual position-sensitive components 102, 102', 102".
- the three gas volumes 216" which are connected upstream of the three optical components 102, 102', 102" in the flow direction R, have the same preload pressure P".
- a respective preload pressure P" of a gas volume 216" can also be specifically adapted to the damping requirements of a respective optical component 102, 102', 102".
- the cooling device 200 can comprise one or more devices 250 for adjusting a pressure P, P" of the gas 222, 222" of one or more gas volumes 216, 216".
- the one or more pressure adjusting devices 250 can be used to selectively adjust damping properties of closed gas volumes 216, 216" over the entire cooling circuit 202.
- the pre-tension pressures P, P" are set before starting up the cooling device 200 and/or the lithography system 1.
- the embodiments of the cooling devices 300, 400, 500, 600, 700, 800 can also comprise one or more devices similar to the device 250 (Fig. 3) for setting a pressure of the gas 222 in one or more gas spaces 320, 420, 420', 520, 520', 620, 720, 820.
- FIG. 13 shows a cross-sectional view of a further embodiment of a cooling line device 914 of a cooling device 900 of the lithography system 1.
- the cooling device 900 comprises a cooling line 906 with a liquid space 918, a gas space 920 and a separating membrane 924 separating the liquid space 918.
- the cooling device 900 further comprises a foam-like and/or sponge-like element 952.
- the foam-like and/or sponge-like element 952 comprises a plurality of bubbles 954 (gas bubbles 954) and an elastic material 956 surrounding the plurality of bubbles 954.
- the gas space 920 is formed in particular by the plurality of bubbles 954 of the foam-like and/or sponge-like element 952.
- the elastic material 956 surrounding the plurality of bubbles 954 forms the separating membrane 924.
- Fig. 14 shows a side view of another embodiment of a cooling line device 1014 of a cooling device 1000 of the lithography system 1.
- the cooling device 1000 comprises a cooling line 1006.
- the cooling line 1006 - like the cooling lines described above - has a liquid space, a gas space and a separating membrane separating the liquid space.
- the cooling device 1000 is designed so that a cooling liquid flows through the cooling line 1006 in a flow direction R. Furthermore, a diameter D1 of the cooling line 1006 tapers (e.g. evenly) along the flow direction R.
- the reference symbol D1 designates a first diameter and D2 a second diameter which is smaller than the first diameter D1.
- the flow speed of the cooling liquid can be influenced. In this way, a frequency range for damping pressure waves of the cooling liquid can be set. Carl Zeiss SMT GmbH et al. 41
- the cooling line 1006 extends straight in a longitudinal direction L and the cooling liquid flows along the longitudinal direction L through the cooling line 1006.
- the flow direction R and the longitudinal direction L are arranged parallel to one another.
- the diameter D1 of the cooling line 1006 tapers along the longitudinal direction L.
- Fig.15 shows a further variant of a cooling line 1114 of a cooling device 1100 that tapers along a flow direction R' of a cooling liquid.
- the cooling line 1114 in Fig.15 is in particular curved.
- the cooling line 1114 is shaped like a spiral W.
- the diameter D1 of the cooling line 1114 tapers along the helically curved W cooling line 1114.
- the reference symbol D1' denotes a first diameter and D2' a second diameter which is smaller than the first diameter D1'.
- a method for operating a cooling device 200, 200', 300, 400, 500, 600, 700, 800, 900, 1000, 1100 (Figs. 4 to 15) of a projection exposure system 1 (Fig. 1) according to an embodiment is described with reference to Fig. 16.
- the cooling device 200, 200', 300, 400, 500, 600, 700, 800, 900, 1000, 1100 serves to cool a position-sensitive component 102, 102', 102" (Fig.3) of the projection exposure system 1 (Fig.1).
- the cooling device 200, 200', 300, 400, 500, 600, 700, 800, 900, 1000, 1100 comprises a cooling line device 214, 214', 314, 414, 514, 614, 714, 814, 914, 1014, 1114 (Fig.4 to 15) with a cooling line 206, 206', 306, 406, 506, 606, 706, 806, 906, 1006, 1106.
- the cooling line device 214, 214', 314, 414, 514, 614, 714, 814, 914, 1014, 1114 also comprises a liquid space 218, 218', 318, 418, 518, 618, 718, 818, 918 for transporting a cooling liquid 112 to the position-sensitive component 102, 102', 102".
- a liquid space 218, 218', 318, 418, 518, 618, 718, 818, 918 for transporting a cooling liquid 112 to the position-sensitive component 102, 102', 102".
- the cooling line device 214, 214', 314, 414, 514, 614, 714, 814, 914, 1014, 1114 also comprises one or more gas spaces 220, 220', 320, 420, 420', 520, 520', 620, 720, 820, 920 for receiving a gas 222.
- the respective gas space 220, 220', 320, 420, 420', 520, 520', 620, 720, 820, 920 is connected by means of an elastic separating membrane 224, 224', 324, 424, 424', 524, 524', 624, 724, 824, 924 are separated from the liquid space 218, 218', 318, 418, 518, 618, 718, 818, 918.
- a first step S1 of the method the liquid space 218, 218', 318, 418, 518, 618, 718, 818, 918 of the cooling line 206, 206', 306, 406, 506, 606, 706, 806, 906, 1006, 1106 is flowed through by the cooling liquid 112.
- a volume VF1 of the liquid space 218, 218', 318, 418, 518, 618, 718, 818, 918 (and thus a volume V F1 of the cooling liquid 112) is changed by deforming the elastic separating membrane 224, 224', 324, 424, 424', 524, 524', 624, 724, 824, 924.
- the volume VF1 of the liquid space 218, 218', 318, 418, 518, 618, 718, 818, 918 is changed in response to a pressure change of the cooling liquid 112.
- a pressure change e.g. a pressure fluctuation
- a transmission of a pressure fluctuation to the position-sensitive component 102, 102', 102" can be reduced or avoided.
- Cooling line 112 Cooling liquid 114
- Actuator device 116 Support frame 118
- Actuator 120 Sensor device 122
- Laser beam 200 Cooling device 202
- Cooling circuit 204 Cooling unit 206
- Cooling line 208 Pump 210
- Valve 212 Deflection 214, 214' Cooling line device 216, 216', 216" Gas volume 218, 218' Liquid space 220, 220', 220" Gas space 222, 222" Gas 224, 224', 224" Separating membrane 226 Hose 228 Interior 230
- Cooling device 306 Cooling line 314
- Cooling line device 316 Gas volume 318 Liquid space Carl Zeiss SMT GmbH et al.
- Cooling device 632 Inner wall 638 Spacer 640 Stud 700 Cooling device 706 Cooling line 714 Cooling line device 716 Gas volume 718 Liquid space 720 Gas space 724 Separating membrane 726 Hose 732 Inner wall 742 Fastener 744 Pipe clamp 746 Web/strut 800 Cooling device 806 Cooling line 814 Cooling line device 816 Gas volume 818 Liquid space 820 Gas space 824 Separating membrane 830 Outer wall 832 Inner wall 842 Fastener 844 Strut 900 Cooling device 906 Cooling line 914 Cooling line device 918 Liquid space Carl Zeiss SMT GmbH et al.
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Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022125354.6A DE102022125354A1 (de) | 2022-09-30 | 2022-09-30 | Kühlvorrichtung zum Kühlen einer positionssensitiven Komponente einer Lithographieanlage |
| PCT/EP2023/072998 WO2024068138A1 (de) | 2022-09-30 | 2023-08-22 | Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlage |
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| EP4594823A1 true EP4594823A1 (de) | 2025-08-06 |
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| EP23758333.1A Pending EP4594823A1 (de) | 2022-09-30 | 2023-08-22 | Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlage |
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| Country | Link |
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| US (1) | US20250224681A1 (de) |
| EP (1) | EP4594823A1 (de) |
| JP (1) | JP2025532888A (de) |
| KR (1) | KR20250078958A (de) |
| DE (1) | DE102022125354A1 (de) |
| WO (1) | WO2024068138A1 (de) |
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|---|---|---|---|---|
| DE102022125354A1 (de) | 2022-09-30 | 2024-04-04 | Asml Netherlands B.V. | Kühlvorrichtung zum Kühlen einer positionssensitiven Komponente einer Lithographieanlage |
| DE102023212263A1 (de) * | 2023-12-06 | 2025-06-12 | Carl Zeiss Smt Gmbh | Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlage, lithographieanlage und verfahren zum herstellen einer kühlvorrichtung |
| WO2025186071A1 (en) * | 2024-03-06 | 2025-09-12 | Carl Zeiss Smt Gmbh | Assembly for semiconductor apparatuses to suppress acoustic wave propagation within a semiconductor apparatus and semiconductor apparatus |
| DE102024202671A1 (de) * | 2024-03-21 | 2025-01-09 | Carl Zeiss Smt Gmbh | Temperiermediumleitung, optisches system und projektionsbelichtungsanlage |
| EP4625048A1 (de) * | 2024-03-29 | 2025-10-01 | ASML Netherlands B.V. | Akustische dämpfungsvorrichtung, flüssigkeitstransportsystem, temperaturkonditionierungssystem und lithografische vorrichtung |
| DE102024204464A1 (de) * | 2024-05-14 | 2025-05-08 | Carl Zeiss Smt Gmbh | Kühlvorrichtung zum kühlen einer positionssensitiven komponente einer lithographieanlage und lithographieanlage |
| DE102024205567A1 (de) * | 2024-06-17 | 2025-12-18 | Carl Zeiss Smt Gmbh | Temperiervorrichtung zum temperieren einer positionssensitiven komponente einer lithographieanlage, lithographieanlage und verfahren zum herstellen einer temperiervorrichtung |
| DE102024207791A1 (de) * | 2024-08-15 | 2026-02-19 | Carl Zeiss Smt Gmbh | Dämpfungselement zur Verwendung in Anlagen für die Halbleitertechnologie |
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| JPH071075B2 (ja) * | 1986-06-16 | 1995-01-11 | 株式会社小松製作所 | 脈動低減ホ−スの製造方法 |
| DE3735081A1 (de) * | 1987-10-16 | 1989-04-27 | Klaus Obermann | Druckpulsations-daempfer fuer stroemungsmedien |
| US5074324A (en) * | 1991-07-12 | 1991-12-24 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for reducing drag and noise associated with fluid flow in a conduit |
| US6573978B1 (en) | 1999-01-26 | 2003-06-03 | Mcguire, Jr. James P. | EUV condenser with non-imaging optics |
| JP2004095993A (ja) * | 2002-09-03 | 2004-03-25 | Nikon Corp | 光学部品冷却方法、光学部品冷却装置及びそれを有するeuv露光装置 |
| DE10317667A1 (de) | 2003-04-17 | 2004-11-18 | Carl Zeiss Smt Ag | Optisches Element für ein Beleuchtungssystem |
| EP1843206B1 (de) * | 2006-04-06 | 2012-09-05 | ASML Netherlands B.V. | Lithografisches Gerät und Verfahren zur Herstellung einer Vorrichtung |
| DE102008009600A1 (de) | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie |
| DE102013213855A1 (de) * | 2013-07-16 | 2014-07-31 | Carl Zeiss Smt Gmbh | Vibrationsreduktion in Kühlsystemen |
| DE102015226531A1 (de) | 2015-04-14 | 2016-10-20 | Carl Zeiss Smt Gmbh | Abbildende Optik zur Abbildung eines Objektfeldes in ein Bildfeld sowie Projektionsbelichtungsanlage mit einer derartigen abbildenden Optik |
| DE102017220586A1 (de) | 2017-11-17 | 2019-05-23 | Carl Zeiss Smt Gmbh | Pupillenfacettenspiegel, Beleuchtungsoptik und optisches System für eine Projek-tionsbelichtungsanlage |
| WO2021013441A1 (en) * | 2019-07-19 | 2021-01-28 | Asml Netherlands B.V. | Temperature conditioning system |
| GB2616521B (en) * | 2020-12-22 | 2024-11-06 | Halliburton Energy Services Inc | Density constant flow device with flexible tube |
| DE102022125354A1 (de) | 2022-09-30 | 2024-04-04 | Asml Netherlands B.V. | Kühlvorrichtung zum Kühlen einer positionssensitiven Komponente einer Lithographieanlage |
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| JP2025532888A (ja) | 2025-10-03 |
| KR20250078958A (ko) | 2025-06-04 |
| DE102022125354A1 (de) | 2024-04-04 |
| US20250224681A1 (en) | 2025-07-10 |
| WO2024068138A1 (de) | 2024-04-04 |
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