Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
  • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B30/00—Heat pumps
  • F25B30/02—Heat pumps of the compression type
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F24—HEATING; RANGES; VENTILATING
  • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
  • F24D3/00—Hot-water central heating systems
  • F24D3/18—Hot-water central heating systems using heat pumps
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B49/00—Arrangement or mounting of control or safety devices
  • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2309/00—Gas cycle refrigeration machines
  • F25B2309/06—Compression machines, plants or systems characterised by the refrigerant being carbon dioxide
  • F25B2309/061—Compression machines, plants or systems characterised by the refrigerant being carbon dioxide with cycle highest pressure above the supercritical pressure
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2339/00—Details of evaporators; Details of condensers
  • F25B2339/04—Details of condensers
  • F25B2339/047—Water-cooled condensers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2600/00—Control issues
  • F25B2600/11—Fan speed control
  • F25B2600/111—Fan speed control of condenser fans
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2600/00—Control issues
  • F25B2600/25—Control of valves
  • F25B2600/2513—Expansion valves
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
  • F25B2700/19—Pressures
  • F25B2700/195—Pressures of the condenser
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
  • F25B2700/21—Temperatures
  • F25B2700/2115—Temperatures of a compressor or the drive means therefor
  • F25B2700/21152—Temperatures of a compressor or the drive means therefor at the discharge side of the compressor
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
  • F25B2700/21—Temperatures
  • F25B2700/2116—Temperatures of a condenser
  • F25B2700/21161—Temperatures of a condenser of the fluid heated by the condenser
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B6/00—Compression machines, plants or systems, with several condenser circuits
  • F25B6/04—Compression machines, plants or systems, with several condenser circuits arranged in series
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
  • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
  • F25B9/008—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant the refrigerant being carbon dioxide

Definitions

• the present invention relates to a cooling and heating apparatus, and particularly relates to a cooling and heating apparatus that is used to adjust, for example, various manufacturing apparatuses such as a semiconductor manufacturing apparatus and various measuring apparatuses to predetermined temperatures.
• a cooling and heating apparatus which includes a circulation path where a heating medium circulates, and cools or heats a control target whose temperature needs to be adjusted by use of the heating medium that circulates along the circulation path.
• This type of cooling and heating apparatus includes: for example, a chiller of the vapor-compression refrigeration cycle that cools a circulating heating medium; and, for example, a heating device that heats the cooled heating medium.
• the circulation fluid that is supplied to the control target is cooled, properly using a method that cools the circulation fluid by use of the refrigeration cycle and a method that cools the circulation fluid by use of the coolant of the cooling tower.
• the circulation fluid cooled by the refrigeration cycle or the cooling tower is heated to a predetermined temperature by the heating device such as a heater, and is supplied to the control target.
• Patent Literature 2 discloses a cooling apparatus including: a first circulation system that circulates a first refrigerant in a condenser back to the condenser through a pump, a heating device, a throttle valve, and a vaporizer; and a second circulation system that includes a heat exchanger placed in the condenser, and circulates a second refrigerant that cools the first refrigerant.
• the above cooling and heating apparatus of the known technology needs some improvements in shortening the time required to adjust temperature and encouraging an increase in efficiency in a production process of, for example, a semiconductor manufacturing apparatus and in reducing the amount of energy consumed to adjust temperature and encouraging energy savings.
• the cooling and heating apparatus includes a refrigeration cycle circuit where a compression means, a gas cooler, a throttle means, and an evaporator are sequentially connected and a refrigerant circulates; and a circulation fluid circuit provided with a circulating pump and a heating device, in which circulation fluid that adjusts a temperature of a control target circulates, the circulation fluid circuit includes: a freely openable and closable low-temperature path where the circulation fluid flows through the evaporator in such a manner that heat is exchangeable between the circulation fluid and the refrigerant, and a freely openable and closable high-temperature path where the circulation fluid flows through the gas cooler in such a manner that heat is exchangeable between the circulation fluid and the refrigerant.
• Such a configuration allows the cooling and heating apparatus to adjust temperature with high efficiency by supplying the circulation fluid cooled or heated by the refrigerant of the refrigeration cycle circuit to the control target such as a semiconductor manufacturing apparatus.
• the cooling and heating apparatus can heat the circulation fluid by use of heat dissipated from the refrigerant flowing through the gas cooler of the refrigeration cycle circuit.
• the circulation fluid heated by the gas cooler of the refrigeration cycle circuit is then heated to a predetermined temperature by the heating device of the circulation fluid circuit, and is supplied at the suitable temperature to the control target in such a manner that the control target reaches an exact set temperature.
• the circulation fluid can be heated by use of the heat dissipation of the gas cooler of the refrigeration cycle circuit. Therefore, the temperature can be adjusted with high efficiency while the amount of energy to be consumed by the heating device of the circulation fluid circuit is kept low.
• the cooling and heating apparatus of the present invention can adjust temperature with low loss of exhaust heat and with high efficiency by using both cold heat and hot heat, which are generated in the refrigeration cycle circuit.
• the high-temperature path is provided with a high-temperature tank where the circulation fluid heated by the refrigerant in the gas cooler is stored. Consequently, for example, if a temperature setting for the control target is changed due to a change in, for example, a processing process to significantly increase the temperature of the circulation fluid, the temperature of the circulation fluid that circulates in the circulation fluid circuit can be quickly increased to a predetermined temperature in a short time by supplying, to the circulation fluid circuit, the high-temperature circulation fluid stored in the high-temperature tank. Hence, it is possible to significantly shorten the time required to change the temperature setting and reduce the loss of time accompanied by the change in temperature before the start of, for example, a processing process or a measurement process.
• the refrigerant may be carbon dioxide, and may heat the circulation fluid under supercritical pressure in the gas cooler. Consequently, it is possible to efficiently heat the circulation fluid to a high temperature.
• the cooling and heating apparatus of the present invention can heat the circulation fluid, with the gas cooler of the refrigeration cycle circuit, to a high-temperature region that is not achievable by a condenser of, for example, a chiller of a known technology using an HFC (hydrofluorocarbon)-based refrigerant, an HFO (hydrofluoroolefin)-based refrigerant, or a mixed refrigerant of them.
• HFC hydrofluorocarbon
• HFO hydrofluoroolefin
• the heating device of the circulation fluid circuit can be reduced. Therefore, it is possible to reduce the amount of energy consumed by the heating device and encourage energy savings.
• the refrigeration cycle circuit may include a second gas cooler that releases heat of the refrigerant to the outside, on a downstream side of the gas cooler.
• the gas cooler may be provided in the high-temperature tank in such a manner that the refrigerant flows from up to down, and the refrigerant flowing through the gas cooler may heat the circulation fluid in the high-temperature tank.
• the refrigerant flowing through the gas cooler can heat the circulation fluid in the high-temperature tank also in a state where the circulation fluid in the high-temperature path is not used as the circulation fluid to be supplied to the control target and is not flowing.
• the circulation fluid stored in the high-temperature tank can be heated to a high temperature by the gas cooler without providing, for example, a circulating pump that feeds the circulation fluid in the high-temperature path for heating with the gas cooler.
• exhaust heat from the gas cooler can be effectively used without circulating the circulation fluid in the high-temperature path.
• the low-temperature path may be provided with a low-temperature tank where the circulation fluid is stored, a low-temperature pump that feeds the circulation fluid, and a low-temperature circulation path that returns the circulation fluid to an inlet side of the low-temperature path without feeding the circulation fluid to the control target.
• the low-temperature tank is provided; therefore, if the temperature setting for the control target is changed due to a change in, for example, a processing process to significantly reduce the temperature of the circulation fluid, the temperature of the circulation fluid that circulates in the circulation fluid circuit can be quickly reduced to a predetermined temperature in a short time by supplying the low-temperature circulation fluid stored in the cold tank to the circulation fluid circuit.
• the low-temperature path is provided with the low-temperature pump that feeds the circulation fluid, and the low-temperature circulation path that returns the circulation fluid from the outlet side to the inlet side of the low-temperature path.
• the circulation fluid in the low-temperature path is not used as the circulation fluid to be supplied to the control target, the circulation fluid can be cooled by the refrigerant flowing through the evaporator by circulating the circulation fluid in the low-temperature path.
• the refrigerant can be stored in the low-temperature tank.
• the circulation fluid in the high-temperature path can be heated by the refrigerant of the gas cooler by operating the refrigeration cycle circuit.
• the circulation fluid circuit may be provided with a three-way valve that switches between whether or not the circulation fluid returning from the control target is fed to the high-temperature path, and a mixing valve that is provided downstream of the three-way valve and mixes the circulation fluid that has passed through the low-temperature path with the circulation fluid to be supplied to the control target.
• the mixing valve is adjusted to mix the circulation fluid cooled by the evaporator with the circulation fluid that has returned from the control target and make the temperature suitable.
• temperature adjustment operation in which the circulation fluid heated by the gas cooler and the circulation fluid cooled by the evaporator are not supplied to the control target, and only the circulation fluid that has returned from the control target is heated by the heating device, fed to the control target, and circulated. In this manner, it is possible to circulate the circulation fluid along a suitable path in accordance with the state of the control target and adjust the temperature of the control target efficiently with a little amount of energy consumed.
• Fig. 1 is a diagram illustrating a schematic configuration of the cooling and heating apparatus 1 according to the embodiment of the present invention.
• the cooling and heating apparatus 1 is an apparatus that is used to adjust a control target 46, for example, various manufacturing apparatuses such as a semiconductor manufacturing apparatus, or various measuring apparatuses used in, for example, semiconductor manufacturing processes, to a predetermined temperature according to the process (refer to Fig. 1 ).
• the circulation fluid circuit 20 configures a closed circuit where the circulation fluid that cools or heats the control target 46 circulates.
• the circulation fluid circuit 20 includes: a plurality of circuit modules 21 that are connected to the control targets 46 and circulate the circulation fluid; a low-temperature path 31 that is connected to the circuit modules 21 and in which the circulation fluid flows through the evaporator 15 in such a manner as to be able to exchange heat with the refrigerant; and the high-temperature path 38 that is connected to the circuit modules 21 and in which the circulation fluid flows through the gas cooler 12 in such a manner as to be able to exchange heat with the refrigerant.
• the basic circulation path 22 of the each of the circuit modules 21 is provided with a solenoid valve 28 that opens and closes the feed path 23. Consequently, if the control target 46 connected to the circuit module 21 does not require temperature control, the flow of the circulation fluid can be stopped by closing the solenoid valve 28.
• the low-temperature path 31 is a path for the refrigeration cycle circuit 10 to cool the circulation fluid.
• the low-temperature path 31 is connected on an inlet side thereof to a return path 24 side of the circuit module 21 and on an outlet side thereof to a feed path 23 side of the circuit module 21 in such a manner as to form a bypass path for the circulation fluid in the basic circulation path 22.
• the circulation fluid that has returned from the control target 46 is mixed with the circulation fluid cooled by the evaporation of the refrigerant by the evaporator 15 of the refrigeration cycle circuit 10 on the basis of adjustment by the mixing valve 30. Therefore, operation that achieves a suitable temperature can be performed.
• the low-temperature path 31 is provided with a low-temperature tank 32 where the circulation fluid is stored, a low-temperature pump 33 that feeds the circulation fluid, and a low-temperature circulation path 34 that returns the circulation fluid to the inlet side of the low-temperature path 31 without feeding the circulation fluid to the control target 46.
• the low-temperature tank 32 is provided on the inlet side of the low-temperature path 31.
• the low-temperature pump 33 is provided downstream of the low-temperature tank 32.
• the evaporator 15 is provided downstream of the low-temperature pump 33.
• the low-temperature circulation path 34 may be provided in such a manner as to connect a branch line pipe 36 provided downstream of the evaporator 15 of the low-temperature path 31, and the low-temperature tank 32 provided on the inlet side of the low-temperature path 31.
• the low-temperature tank 32 is provided with a low-temperature sensor 37 that measures the temperature of the circulation fluid in the low-temperature tank 32.
• the low-temperature pump 33 and the low-temperature sensor 37 are connected to the control device 43.
• the control device 43 may control, for example, operation of the circulating pump 25 and the low-temperature pump 33 and the adjustment of the degree of opening of the mixing valve 30 by using information on the temperature of the circulation fluid measured by the low-temperature sensor 37 to make a computation.
• the low-temperature path 31 is provided with the low-temperature tank 32, the low-temperature pump 33 that feeds the circulation fluid, and the low-temperature circulation path 34 that returns the circulation fluid from the outlet side to the inlet side of the low-temperature path 31.
• the circulation fluid in the low-temperature path 31 can be cooled by the refrigerant flowing through the evaporator 15 by circulating the circulation fluid in the low-temperature path 31.
• the circulation fluid cooled by the refrigerant can be stored in the low-temperature tank 32, and the stored low-temperature circulation fluid can be supplied to the circulation fluid circuit 20 if needed. For example, if the temperature setting for the control target 46 is changed due to a change in, for example, a processing process to significantly reduce the temperature of the circulation fluid, the low-temperature circulation fluid stored in the cold tank can be supplied to the circulation fluid circuit 20.
• the temperature of the circulation fluid that circulates in the circulation fluid circuit 20 can be quickly reduced to a predetermined temperature in a short time.
• the time required to change the temperature setting is significantly shortened; therefore, the loss of time accompanied by the change of the temperature before the start of, for example, a processing process or a measurement process can be reduced.
• the low-temperature path 31 is provided with the low-temperature tank 32, the low-temperature pump 33, and the low-temperature circulation path 34. Hence, even if the circulation fluid in the low-temperature path 31 is not supplied to the control target 46, it is possible to operate the refrigeration cycle circuit 10 and heat the circulation fluid in the high-temperature path 38 with the refrigerant of the gas cooler 12.
• the high-temperature path 38 is a path for the refrigeration cycle circuit 10 to heat the circulation fluid.
• the high-temperature path 38 is connected on an inlet side thereof to the return path 24 side of the circuit module 21 and on an outlet side thereof to the feed path 23 side of the circuit module 21 in such a manner as to form a bypass path for the circulation fluid in the basic circulation path 22.
• the basic circulation path 22 of the circulation fluid circuit 20 is provided with a three-way valve 29 upstream of the branch point to the low-temperature path 31.
• the three-way valve 29 is a valve that switches between whether or not the circulation fluid returning from the control target 46 is fed to the high-temperature path 38. In other words, the three-way valve 29 can freely open and close the high-temperature path 38.
• the inlet of the high-temperature path 38 is connected to the three-way valve 29.
• the outlet of the high-temperature path 38 is connected downstream of the three-way valve 29 of the basic circulation path 22 and upstream of the branch point to the low-temperature path 31.
• the switching of the three-way valve 29 allows switching between operation in which the circulation fluid heated by the gas cooler 12 of the refrigeration cycle circuit 10 is supplied to the control target 46, and operation in which the circulation fluid heated by the gas cooler 12 of the refrigeration cycle circuit 10 is not supplied to the control target 46, and executing the operation.
• the high-temperature path 38 is provided with the high-temperature tank 39 where the circulation fluid heated to a high temperature is stored, and a high-temperature sensor 42 that measures the temperature of the circulation fluid in the high-temperature tank 39.
• the gas cooler 12 of the refrigeration cycle circuit 10 is provided in the high-temperature tank 39 in such a manner that the refrigerant can heat the circulation fluid.
• the high-temperature tank 39 is formed with a circulation fluid inlet in a lower part thereof, and is formed with a circulation fluid outlet in an upper part thereof. Consequently, the high-temperature circulation fluid stored in the high-temperature tank 39 can be efficiently supplied to the control target 46.
• the cooling and heating apparatus 1 includes the high-temperature tank 39, and can feed the high-temperature circulation fluid stored in the high-temperature tank 39 to the basic circulation path 22.
• the temperature setting for the control target 46 is changed due to a change in, for example, a processing process to significantly increase the temperature of the circulation fluid, the temperature can be changed with high efficiency.
• the cooling and heating apparatus 1 can significantly shorten the time required to change the temperature setting and reduce the loss of time accompanied by the change in temperature before the start of, for example, a processing process or a measurement process.
• the low-temperature path 31 and the high-temperature path 38 are provided with line junction pipes 35 and 40 and the branch line pipe 36 and a branch line pipe 41, which connect the plurality of circuit modules 21.
• the low-temperature path 31 is provided on the inlet side with the line junction pipe 35 and on the outlet side with the branch line pipe 36.
• the high-temperature path 38 is provided on the inlet side with the line junction pipe 40 and on the outlet side with the branch line pipe 41.
• Each of the plurality of circuit modules 21 includes the circulating pump 25 and the heating device 26, and can circulate the circulation fluid to another control target 46. Consequently, it is possible to cool or heat the control targets 46 in, for example, a plurality of spots to be processed or measured with high efficiency by use of one refrigeration cycle circuit 10 and adjust the control targets 46 to their suitable temperatures.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Combustion & Propulsion (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (1)

Publications (1)

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Family Applications (1)

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• 2022
  • 2022-09-15 WO PCT/JP2022/034637 patent/WO2024057506A1/ja not_active Ceased
  • 2022-09-15 US US19/111,228 patent/US20250264253A1/en not_active Abandoned
  • 2022-09-15 JP JP2024546643A patent/JP7650118B2/ja active Active
  • 2022-09-15 EP EP22958826.4A patent/EP4589216A1/en not_active Withdrawn
• 2023
  • 2023-09-13 TW TW112134761A patent/TW202414517A/zh unknown

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