EP4302125A1 - Dispositif de mesure radar comprenant un réseau d'éléments radar en cascade - Google Patents

Dispositif de mesure radar comprenant un réseau d'éléments radar en cascade

Info

Publication number
EP4302125A1
EP4302125A1 EP21709930.8A EP21709930A EP4302125A1 EP 4302125 A1 EP4302125 A1 EP 4302125A1 EP 21709930 A EP21709930 A EP 21709930A EP 4302125 A1 EP4302125 A1 EP 4302125A1
Authority
EP
European Patent Office
Prior art keywords
radar
elements
measuring device
virtual
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21709930.8A
Other languages
German (de)
English (en)
Inventor
Roland Welle
Levin Dieterle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vega Grieshaber KG
Original Assignee
Vega Grieshaber KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vega Grieshaber KG filed Critical Vega Grieshaber KG
Publication of EP4302125A1 publication Critical patent/EP4302125A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/032—Constructional details for solid-state radar subsystems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S13/06—Systems determining position data of a target
    • G01S13/42—Simultaneous measurement of distance and other co-ordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
    • G01S7/028—Miniaturisation, e.g. surface mounted device [SMD] packaging or housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/225—Supports; Mounting means by structural association with other equipment or articles used in level-measurement devices, e.g. for level gauge measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path

Definitions

  • the invention relates to the technical field of radar measurement technology, particularly in the field of process automation in industrial and private environments.
  • the invention relates to a radar measuring device and a specific use of such a measuring device.
  • multi-dimensional measuring i. H. two- or three-dimensional measuring radar systems are used.
  • New, advantageous applications have developed here, particularly in the field of process automation and factory automation.
  • Three-dimensional radar systems can be used to survey bulk material heaps or for microwave barriers.
  • Integrated radar chips are also known, which have a large number of digital and analog components for converting a number of radar transmission channels (Tx) and/or radar reception channels (Rx).
  • Tx radar transmission channels
  • Rx radar reception channels
  • Tx radar transmission channels
  • Rx radar reception channels
  • Tx radar transmission channels
  • Rx radar reception channels
  • Tx radar transmission channels
  • Rx radar reception channels
  • larger virtual array antennas can be synthesized by skilful positioning of the individual antennas, the signals of which in turn are the basis for carrying out digital beam shaping.
  • Frequencies above 80 GHz pose a major challenge in terms of positioning accuracy and synchronization.
  • a first aspect of the present disclosure relates to a radar measuring device, in particular a radar measuring device for process automation in an industrial or private environment, which has a carrier, for example a printed circuit board, and an arrangement of cascadable radar elements arranged on the carrier.
  • concise means that the individual radar elements can be connected or chained to one another in order to form an array which has a large number of transmitting and/or receiving antennas.
  • interconnecting the radar elements By interconnecting the radar elements, a two-dimensional or three-dimensional beam control can take place with high resolution.
  • the individual radar elements each have a radar chip and at least one transmitting antenna and/or at least one receiving antenna.
  • the at least one transmitting antenna and/or the at least one receiving antenna is arranged so close to the edge of the corresponding radar element (at least the outer antennas) that all adjacent transmitting antennas of at least two radar elements arranged next to one another are at the same distance from one another and/or all adjacent receiving antennas are at least two radar elements arranged next to one another have the same distance from one another.
  • the transmitting antennas of the radar elements together with a fully occupied virtual array of n virtual antenna positions from the receiving antennas in at least a first direction, where n is a natural number.
  • a core aspect of the present disclosure can be seen in proposing a new type of radar element with integrated antennas, which is suitable, after interconnection with a predeterminable number of similar radar elements, to provide an overall system that makes it possible to detect a large number of signals in order to generate a larger virtual one To form an overall array antenna without aperture gaps, and to be able to carry out a beamforming method with a high angular resolution on the basis of this.
  • the arrangement has cascadable radar elements with at least one transmitting and at least one receiving antenna, which are arranged in the chip or package (AoC or AiP), whose virtual individual arrays, at least in a first dimension, consist of n virtual antenna positions and one Distance from dge ⁇ have, consist at least in a second dimension of m virtual antenna positions and a distance of d m ⁇ have, wherein the outer dimension of the radar element is ⁇ nd n at least in a first dimension, - is ⁇ md m at least in a second dimension, and which are set up to acquire data for carrying out a digital beam shaping method, with at least two adjacent radar elements having a distance or lateral offset of ndn at least along a first dimension.
  • the transmitting antennas of the radar elements together with the receiving antennas form a fully occupied virtual array of m virtual antenna positions in at least a second direction, which typically runs perpendicular to the first direction, where m is a natural number.
  • the individual radar elements are arranged relative to one another in such a way that a complete virtual array is generated, the extent of which is typically greater than the physical extent of the arrangement of cascadable radar elements.
  • the distances between the receiving antennas of the radar elements in a first direction and/or a second direction are less than or equal to half the wavelength of the radar measurement signal to be radiated.
  • the distances between the transmitting antennas of the radar elements in the first direction and/or the second direction are less than or equal to half the wavelength of the radar measurement signal to be radiated.
  • the radar elements each have a length and a width which is typically specified by the distance between the virtual antenna positions and thus determines the respective extent of the carrier.
  • the width of the radar elements is less than or equal to n times the distance between the virtual antenna positions (nxd n ).
  • the length of the radar elements is less than or equal to m times the distance between the virtual antenna positions (m ⁇ d m ).
  • the carrier has a square or rectangular shape.
  • the at least one transmitting antenna and the at least one receiving antenna are part of a chip or package of the corresponding radar element.
  • the radar measuring device is a filling level radar measuring device that is set up to determine the filling level in a container.
  • the radar measuring device is a distance or limit standard radar measuring device, set up for process automation in an industrial or private environment.
  • Another aspect of the present disclosure relates to the use of a radar measuring device described above and below for level measurement or
  • a further aspect of the present disclosure relates to the use of a radar measuring device described above and below for area monitoring, for example in the danger area of a machine or a section of a machine
  • process automation in the industrial environment can be understood as a sub-area of technology that includes measures for the operation of machines and systems without human intervention.
  • One goal of process automation is to automate the interaction of individual components of a plant in the chemical, food, pharmaceutical, petroleum, paper, cement, shipping or mining sectors.
  • sensors can be used, which in particular to the specific requirements of the process industry, such as mechanical stability, insensitivity to contamination, extreme temperatures and extreme pressures. Measured values from these sensors are usually transmitted to a control room, in which process parameters such as fill level, limit level, flow rate, pressure or density can be monitored and settings for the entire plant can be changed manually or automatically.
  • a sub-area of process automation in the industrial environment relates to the logistics automation of plants and the logistics automation of supply chains.
  • processes inside or outside a building or within a single logistics facility are automated in the field of logistics automation.
  • Typical applications are found, for example, in systems for logistics automation in the area of baggage and freight handling at airports, in the area of traffic monitoring (toll systems), in retail, in parcel distribution or in the area of building security (access control).
  • presence detection in combination with precise measurement of the size and position of an object is required by the respective application.
  • Sensors based on optical measuring methods using lasers, LEDs, 2D cameras or 3D cameras, which record distances according to the transit time principle (time of flight, ToF), can be used for this purpose.
  • factory/manufacturing automation Another sub-area of process automation in the industrial environment relates to factory/manufacturing automation. Use cases for this can be found in a wide variety of industries such as automobile manufacturing, food production, the pharmaceutical industry or in general in the field of packaging.
  • the aim of factory automation is to automate the production of goods using machines, production lines and/or robots, i. H. run without human intervention.
  • the sensors used here and the specific requirements with regard to the measurement accuracy when detecting the position and size of an object are comparable to those in the previous example of logistics automation.
  • FIG. 1 shows a cascadable radar element according to an embodiment.
  • Fig. 2 shows the arrangement of two cascadable radar elements on a printed circuit board (carrier).
  • Figure 3 shows a cascadable radar element according to another embodiment.
  • FIG. 4 shows an electronic component of a radar measuring device according to an embodiment.
  • 5 shows a cascadable radar element according to a further embodiment.
  • FIG. 6 shows the interconnection of two cascadable radar elements according to an embodiment.
  • FIG. 7 shows the interconnection of three cascadable radar elements according to an embodiment.
  • FIG. 8 shows the interconnection of three radar elements according to a further embodiment.
  • FIG. 9 shows the interconnection of three radar elements according to a further embodiment.
  • FIG. 10 shows the interconnection of four radar elements according to a further embodiment.
  • Figure 11 shows a cascadable radar element according to another embodiment.
  • 12 shows the interconnection of three cascadable radar elements according to an embodiment.
  • FIG. 13 shows the interconnection of three cascadable radar elements according to a further embodiment.
  • FIG. 14 shows the interconnection of eight cascadable radar elements according to an embodiment.
  • Fig. 15 shows the interconnection of 16 cascadable radar elements according to a further embodiment.
  • 16 shows a radar measuring device with an electronic component according to an embodiment.
  • FIG. 1 shows a first embodiment 101 of a cascadable radar element.
  • the radar element 101 can be an electronic component 101 which comprises a housing (package) 102 in which at least one semiconductor chip 103 is integrated.
  • the semiconductor chip can have different circuit parts for generating and/or processing
  • the semiconductor chip 103 can be, in particular, a gallium arsenide semiconductor, a silicon-germanium semiconductor or a BiCMOS or HF-CMOS semiconductor, which is suitable for realizing circuits for processing high-frequency signals.
  • the package 102 can be implemented, for example, on the basis of a plastic material or some other dielectric molding compound.
  • the semiconductor chip 103 is connected via electrically conductive connections 108, for example bond connections 108, to at least one antenna 104, 105 (AIP, antenna in package) which is also integrated in the housing 102 and which in turn is suitable for radiating 106 and/or detecting 107 radar signals.
  • AIP antenna in package
  • the semiconductor chip 103 is connected via further electrically conductive connections 109, for example bonding wires 109, to contacting points 110 fitted on the outside of the radar element 101, for example the balls 110 of a BGA housing.
  • module 101 has at least one contact option 111 for introducing an external synchronization signal and at least one further contact option 112 for outputting an internal synchronization signal.
  • the synchronization signals can be local oscillator signals LO_IN, LO_OUT with a frequency above 1 GHz, for example. However, other synchronization signals can also be used.
  • a plurality of such radar elements can be cascaded by assembly, for example soldering onto a printed circuit board material.
  • FIG. 2 shows a corresponding arrangement on a printed circuit board material 201.
  • the electronic components 203, 204, both of which are of the radar element 101 type, are interconnected in a further development on a suitable carrier material 201, for example a printed circuit board material, to form a cascaded radar system 200. It is characteristic here that the two radar chips are operated together in one operating phase. Provision is made here in particular for radar signals to be emitted with a first element 203 and received again with a second element 204 .
  • the synchronization of the two units 203, 204 required for this is carried out by forwarding a synchronization signal used in the first radar chip 203, which is transmitted via an output contact LO_OUT 112 of the first component 203 and a conductor track 202, which can be applied to the printed circuit board 201, to an input point LO_IN 111 of the second component 204 can be forwarded.
  • FIG. 3 shows a further embodiment 301 of a cascadable radar element.
  • it can be a Act semiconductor chip 301, which in addition to the circuits for generating and / or processing of radar signals and antennas or primary radiator 302, 303 (AoC, Antenna on Chip) for radiating 304 and / or detecting 305 radar signals.
  • the semiconductor chip 301 can be, in particular, a gallium arsenide semiconductor, a silicon-germanium semiconductor or a BiCMOS or HF-CMOS semiconductor, which is suitable for realizing circuits for processing high-frequency signals.
  • the semiconductor chip 301 is designed to be connected to other conductive surfaces or semiconductor chips via electrically conductive contacting surfaces 306, 307, 308, for example metallized surfaces 306, 307, 308 that can be contacted with bond connections.
  • the chip 301 has at least one contact option 306 for introducing an external synchronization signal LO_IN, for example with a frequency above 1 GHz, and at least one additional one
  • This embodiment can be advantageously used in particular for radar frequencies in the range above 120 GHz, in particular also for radar frequencies in the range around 180 GHz or in the range around 240 GHz.
  • a plurality of such radar elements can be cascaded by mounting a plurality of such semiconductor chips in a package.
  • Figure 4 shows a corresponding structure.
  • the semiconductor chips 402, 403, both of which are of the semiconductor chip 301 type, are interconnected in a further development in a chip housing 401, for example a BGA housing, a QFN housing or other known housing forms, to form an electronic component 400 in the form of a cascaded radar system. It is characteristic here that the two radar chips 402, 403 are operated together in one operating phase.
  • radar signals 410 to be emitted with a first chip 402 via an antenna on chip (AoC) element 409 and to be received again 411 with a second chip 403 via an antenna 412 integrated thereon.
  • AoC antenna on chip
  • the synchronization of the two semiconductor chips 402, 403 required for this takes place by forwarding a local oscillator signal used in the first radar chip 402, which has a Output contact LO_OUT 308 of the first chip 402 can be forwarded to an input point LO_IN 306 of the second semiconductor chip 403 via a bonding wire connection 404 .
  • the electronic component 400 realized according to the scheme of FIG. 4 can thus have all antenna elements for beam shaping and can be further processed directly on a printed circuit board material.
  • the component 401 has at least one contacting option 406 for the external supply of a local oscillator signal LO_IN, which is forwarded via a bond connection 405 to a corresponding contacting area 306 of the first semiconductor chip 402.
  • the component has a further contacting option 408, which can provide an internal local oscillator signal LO_OUT to the outside via a bond connection 407.
  • FIG. 4 shows a first exemplary embedding in a component housing 401.
  • Other arrangements with a large number of integrated radar chips 301 are also possible, depending on the application. Since the cascadable radar elements with integrated antennas 301 that can be used for this purpose are always technically identical, there is the advantage of being able to produce them very cheaply through mass production. Different types of application-specific components 401 can nevertheless be derived therefrom through different forms of packaging.
  • Various antenna arrangements are known in the prior art, which make it possible to carry out a digital beam shaping method.
  • FIG. 5 shows an example of a cascadable radar element 501 and its antenna arrangement, which allows an arrangement on a printed circuit board to generate a larger, fully occupied linear array.
  • Edge area of the printed circuit board i.e. at the top, bottom, right or left edge 580,
  • the radar element 501 shown one-dimensional beam-forming radar systems in particular can be easily implemented. In order to protect the radar element 501 from environmental influences, this can also be provided to protect an additional assembly of a cover (radome), not shown here. This also applies to an arrangement made up of several radar elements.
  • FIG. 8 shows an example of another embodiment of an arrangement of three radar elements 501, 502 and 503. If at least two radar elements 501 and 502 in a first direction the distance of £? Radar elements generated virtual total array also possible to use larger element distances 2 D n 603, without aperture gaps in the largest virtual sub-array, which has the same size as the virtual total array 701 in Figure 7. Due to the larger distance 603 of the radar element 503, a smaller subarray is additionally generated. The angular resolution in the digital beam formation can be improved by the virtual overall aperture, which is larger in comparison to the virtual overall array in FIG.
  • FIG. 9 shows an arrangement of three radar elements 501, 502 and 503 in which the arrangement or the minimum distance between the radar elements has not been maintained at any position.
  • the virtual overall array generated by the transmitting (O) and receiving antennas (X) thus has a number of aperture gaps. On the one hand, this leads to the formation of grating and side lobes and significantly reduces the signal-to-noise ratio.
  • the corner elements each have a distance d 0 /2 or d x /2 (730 or 731) both in the first direction 540 and in the second direction 541 .
  • these distances are the same, but it is also conceivable that they can differ.
  • other angles such as 60°, are also conceivable through appropriate antenna arrangements, as a result of which hexagonally arranged, virtual arrays can be realized.
  • additional radar elements can be added to create larger arrays.
  • the radar elements are positioned along the basis vectors of the translation-periodic grid of the virtual array of an individual radar element. It only has to be ensured that the minimum distance of D n or D m is maintained at least once in the direction of the respective base vectors when positioning the individual radar elements.
  • the radar elements can be arranged according to a linear combination of the basis vectors of the translation periodic raster of the virtual array of a single radar element.
  • FIG. 12 shows a first exemplary embodiment of an arrangement made up of three radar elements 701, 702 and 703 in an L-shaped arrangement. The minimum distance 801 or 802 between the radar elements is maintained here both in a first direction 540 and in a second direction 541 .
  • FIG. 13 shows a further exemplary embodiment with three cascaded radar elements 701, 702 and 703 in a symmetrical, triangular arrangement.
  • the minimum distance 801 or 802 is maintained in two mutually independent directions 540, 541 by the lateral offset 802 of the third radar element 703 relative to the first two radar elements 701, 702.
  • FIG. 14 shows an exemplary embodiment of an arrangement of eight radar elements 701-708 for the construction of a larger, fully occupied array. Due to the redundancies resulting from the arrangement, no central radar element (between the elements 702, 703, 706 and 707) is required.
  • radar elements 701 in a linear arrangement in directions 540 and 541 can be added to radar elements 701, 704, 705 and 708 at distances Dn or n according to the diagram in FIG.
  • FIG 15 shows an example of an embodiment of an iterative arrangement of a plurality of radar elements 701.
  • the displacement vector 801 corresponds to the vector of the first iteration and 802 to that of the second.
  • the iteration becomes a second direction 541 and shifted each copy of the previously generated array by D m 3 fc_1 with (k GM ) from the position of the first radar element.
  • the vectors 803 and 804 represent the displacement vectors of the first and second iteration.
  • each iteration step is an arrangement of radar elements which, with a combined evaluation of all transmitting and receiving elements of the individual radar elements, produce a fully occupied virtual array, which in a can be appended back to the previously generated array in the next iteration step.
  • 16 shows a radar measuring device 1000 with an electronic component 400 according to an embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

Un radar comprend un réseau d'éléments radar en cascade (701) disposés sur un support, chaque élément radar comprenant une puce radar et au moins une antenne d'émission et au moins une antenne de réception.
EP21709930.8A 2021-03-02 2021-03-02 Dispositif de mesure radar comprenant un réseau d'éléments radar en cascade Pending EP4302125A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2021/055158 WO2022184239A1 (fr) 2021-03-02 2021-03-02 Dispositif de mesure radar comprenant un réseau d'éléments radar en cascade

Publications (1)

Publication Number Publication Date
EP4302125A1 true EP4302125A1 (fr) 2024-01-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP21709930.8A Pending EP4302125A1 (fr) 2021-03-02 2021-03-02 Dispositif de mesure radar comprenant un réseau d'éléments radar en cascade

Country Status (2)

Country Link
EP (1) EP4302125A1 (fr)
WO (1) WO2022184239A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9733340B2 (en) * 2014-11-21 2017-08-15 Texas Instruments Incorporated Techniques for high arrival angle resolution using multiple nano-radars
EP3255392B1 (fr) 2016-06-07 2020-04-22 VEGA Grieshaber KG Radar de niveau de remplissage pour la formation de faisceau utilisant du côté de l'émetteur des boucles de verrouillage de phase en parallèle
HUE046126T2 (hu) * 2017-10-06 2020-02-28 Grieshaber Vega Kg Radaros szintmérõ radarlapkával egy áramköri lap különbözõ szintjein
EP3696909B1 (fr) * 2019-02-15 2023-12-20 IMEC vzw Système multi-puce pour un réseau d'antennes
DE102019202144A1 (de) * 2019-02-18 2020-08-20 Vega Grieshaber Kg Radarsensor für die Fabrik- und Logistikautomation
CN110940957B (zh) * 2019-10-28 2022-03-22 惠州市德赛西威汽车电子股份有限公司 一种模块化毫米波雷达

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Publication number Publication date
WO2022184239A1 (fr) 2022-09-09

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