EP4244015A1 - Methods for removing dirt deposits on at least one geometric structure, produced by means of microtechnology and/or nanotechnology, of at least one body and use of an ultra-short pulsed laser with pulses in burst mode - Google Patents
Methods for removing dirt deposits on at least one geometric structure, produced by means of microtechnology and/or nanotechnology, of at least one body and use of an ultra-short pulsed laser with pulses in burst modeInfo
- Publication number
- EP4244015A1 EP4244015A1 EP21824465.5A EP21824465A EP4244015A1 EP 4244015 A1 EP4244015 A1 EP 4244015A1 EP 21824465 A EP21824465 A EP 21824465A EP 4244015 A1 EP4244015 A1 EP 4244015A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- pulse
- burst
- pulses
- dirt deposits
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000002679 ablation Methods 0.000 claims abstract description 9
- 238000001704 evaporation Methods 0.000 claims abstract description 9
- 230000008020 evaporation Effects 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 22
- 230000035939 shock Effects 0.000 claims description 21
- 230000003993 interaction Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000005422 blasting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003631 wet chemical etching Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 239000002894 chemical waste Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011538 cleaning material Substances 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
Definitions
- the invention relates to a method for removing dirt deposits (debris) on at least one geometric structure produced by means of microtechnology and/or nanotechnology at least one body, the dirt deposits being dirt deposits created during the creation of the geometric structure by ablation or evaporation of material , and uses of an ultrashort pulsed laser with burst mode pulses.
- a method for laser processing or laser modification of materials is known from publication US 2001/0 009 250 A1, a combination of ultra-fast laser pulses and bursts with a high repetition rate being used for material processing.
- One application listed is drilling a through-hole in foil with a single burst, followed by an additional shot to complete the Clean debris from borehole.
- the removal of the debris and thus the cleaning does not take place by removing said debris, but rather by increasing the diameter of the through-hole.
- a suitable selection of the laser parameters depending on the hole diameter can avoid significant melt fragments due to material ejection.
- Cleaning by removing dirt deposits (debris) on at least one geometric structure produced by means of microtechnology and/or nanotechnology of at least one body is not the subject of this publication.
- the publication DE 10 2019 219 121 A1 relates to a method for removing material from a surface.
- the publication relates to smoothing out unwanted surface structures that occur as cone-like projections at high fluences. These form a foam-like structure and thus reduce the quality of a treated surface.
- the surface is acted upon by means of high-frequency pulse packets, with the surface being smoothed by thermal effects and/or melting effects. A removal of deposits cannot be derived from this publication.
- the publication US 2010/0 096 371 A1 includes a method for continuous cleaning of flexible sheets transported on a conveyor.
- the laser beam is geometrically separated by means of a beam splitter, thus creating a large-area grid.
- a layer is removed over a large area by spallation, with the pulse itself generating shock waves to remove the layer.
- the process is limited to flat and flexible sheets that are transported on a conveyor belt.
- An Nd:YAG laser with pulse durations in the nanosecond range is used as the laser.
- a method for cleaning material surfaces is known from the document US 2007/0 251 543 A1, which is focused on cleaning lithographic apparatuses or for cleaning substrates.
- the process is carried out in a vacuum chamber.
- a shock wave is generated by thermal expansion in the material, so that thermally induced material removal is initiated.
- pulses in the nanosecond range are used to generate a shock wave in the material.
- a large number of pulses in the nanosecond range can be used to process a surface.
- the publication US 2006/0 108 330 A1 relates to the cleaning of surfaces using a plasma-induced shock wave. To do this, a plasma is ignited near the material surface and the emitted shock wave cleans the surface. A protective layer made of gold, silver, platinum or rhodium, for example, is used between the plasma and the surface to be cleaned due to the decisive thermal process.
- the method for removing dirt deposits (debris) on at least one geometric structure produced by means of microtechnology and/or nanotechnology of at least one body, the dirt deposits being dirt deposits created during the creation of the geometric structure by ablation or evaporation of material, and the uses of an ultra-short pulsed laser with pulses in burst mode are characterized in particular by the fact that the dirt deposits that have formed can be easily removed.
- the geometric structure of the body is exposed to ultra-short pulsed laser radiation from a laser with pulses in burst mode.
- the ultra-short pulsed laser radiation of the laser with pulses in burst mode is used to remove dirt deposits (debris) on at least one geometric structure produced by means of microtechnology and/or nanotechnology, the dirt deposits being removed during the creation of the geometric structure by ablation or dirt deposits caused by evaporation of material.
- the burst mode is a laser technique in which groups of pulses with a defined number of pulses per group (a pulse group is a burst) and a defined number of pulse energy per pulse in a group interact with the material surface.
- the pulse repetition frequency in a burst can be greater than or equal to 1 GHz.
- the pulse duration of a pulse in a group can be less than or equal to 1 ns.
- the first pulse of the pulse group generates a plasma on the dirt deposit (debris).
- a pulse group is a burst. Due to the very short pulse repetition time of a few to a few picoseconds, the subsequent pulse interacts with this plasma. This induces a strong shock wave and the dirt deposits (debris) are removed by the pressure wave.
- the number of shock waves can be regulated with the number of pulses in the burst.
- the power of the shock wave can be regulated with the pulse duration and the fluence per pulse.
- the method for removing dirt deposits and the use of an ultra-short pulsed laser with pulses in burst mode is also characterized by the fact that only a small or no amount of material is removed, which means that the nominal values of the geometric structure are approximately retained. Chemical waste does not occur.
- the method for removing dirt deposits or the use of an ultra-short pulsed laser with pulses in burst mode can thus be used advantageously in microelectronics, microsystems technology and microprocess technology for cleaning the geometric structures produced therewith.
- geometric structures can in particular be mechanical, optical, chemical or biochemical components.
- the method of removing dirt deposits or using an ultra-short pulsed laser with pulses in burst mode is a highly selective cleaning method.
- the pulse repetition frequency in a burst can be greater than or equal to 1 GHz and the pulse duration of a pulse in a burst can be less than or equal to 1 ns.
- a plasma is generated on the debris with a first pulse of the burst (pulse group). With the interaction of at least one subsequent pulse or subsequent pulses of the burst with the plasma, a shock wave as a pressure wave or shock waves as pressure waves is induced on the at least one dirt deposit and the dirt deposit is removed.
- the number of shock waves can be determined with the number of subsequent pulses in the burst.
- the force of the shock wave can be determined using the pulse duration and the fluence per subsequent pulse.
- ultra-short pulsed laser radiation from the laser with pulses in burst mode with a pulse repetition frequency in a burst equal to/greater than 1 GHz and a pulse duration of a pulse in a burst of less than/equal to 1 ns can be used to remove dirt deposits.
- a plasma generated on the debris with a first pulse of the burst (pulse group, pulse train) and a shock wave induced with the interaction of at least one subsequent pulse or subsequent pulses of the burst with the plasma and acting on the at least one dirt deposit as a pressure wave is used in one embodiment for removal of dirt deposit used.
- the laser with the ultra-short pulsed laser radiation and at least one scanner for guiding the laser radiation and/or a drive in connection with a wearer of the body can be used to remove dirt deposits.
- the pulse groups can be moved on the material with a defined burst repetition frequency.
- FIG. 1 shows a schematic representation of a pulsed laser radiation with a single-pulse mode
- Fig. 2 is a schematic representation of a pulsed laser radiation with a burst mode
- FIG. 3 shows a device for removing dirt deposits.
- FIG. 1 shows a schematic representation of a pulsed laser radiation with a single pulse mode
- FIG. 2 shows a schematic representation of a pulsed laser radiation with a burst mode.
- the burst mode is a laser technique in which pulse groups 2 interact with the material surface with a defined number of pulses per pulse group 2 and a defined number of pulse energy per pulse in a pulse group 2.
- a pulse group 2 is a burst.
- the pulse repetition rate in a burst is greater than or equal to 1 GHz.
- the pulse duration of a pulse in a pulse group 2 is less than or equal to 1 ns. 1 shows two individual pulses 1 with the pulse energy y as a function of the time x. Two pulse groups 2 and thus two bursts with the pulse energy y as a function of the time x are shown in FIG.
- the first pulse of pulse group 2 of a pulse train (burst) generates a plasma on the debris. Due to the very short pulse repetition time of a few to a few picoseconds, the subsequent pulse interacts with this plasma. This induces a powerful shock wave and removes the debris through a primarily mechanical process.
- the number of shock waves can be regulated with the number of pulses in the burst.
- the power of the shock wave can be regulated with the pulse duration and the fluence per pulse.
- FIG. 3 shows a device for removing dirt deposits in a basic representation.
- the laser 3 with the ultra-short pulsed laser radiation 4 and at least one scanner 5 for guiding the laser radiation 4 and/or at least one drive 6 as a movement mechanism in connection with a carrier 7 of the body 8 can be used to remove dirt deposits.
- the laser radiation 4 can be guided over the surface of the geometric structure of the body 8 by using a scanner 5 and a downstream f-theta optics 9 .
- the f-theta optics 9 focus the laser radiation 4 onto the focal point and, during scanning, causes the focal point to always lie in the working plane perpendicular to the optical axis of the f-theta optics 9 .
- the position in the working plane approximately follows the F-Theta condition
- the scan length (image height) is approximately proportional to the set scan angle.
- the drive 6 can in particular be a device for a movement in at least one direction of the carrier.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020007017.5A DE102020007017B4 (en) | 2020-11-12 | 2020-11-12 | Method for removing dirt deposits on at least one geometric structure produced by means of microtechnology and/or nanotechnology of at least one body and using an ultra-short pulsed laser with pulses in burst mode |
PCT/DE2021/000187 WO2022100775A1 (en) | 2020-11-12 | 2021-11-11 | Methods for removing dirt deposits on at least one geometric structure, produced by means of microtechnology and/or nanotechnology, of at least one body and use of an ultra-short pulsed laser with pulses in burst mode |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4244015A1 true EP4244015A1 (en) | 2023-09-20 |
Family
ID=78916579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21824465.5A Pending EP4244015A1 (en) | 2020-11-12 | 2021-11-11 | Methods for removing dirt deposits on at least one geometric structure, produced by means of microtechnology and/or nanotechnology, of at least one body and use of an ultra-short pulsed laser with pulses in burst mode |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230398582A1 (en) |
EP (1) | EP4244015A1 (en) |
DE (1) | DE102020007017B4 (en) |
WO (1) | WO2022100775A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6552301B2 (en) | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
KR100489853B1 (en) | 2004-11-24 | 2005-05-17 | 주식회사 아이엠티 | Apparatus for dry surface cleaning of materials using shock wave |
US7628865B2 (en) | 2006-04-28 | 2009-12-08 | Asml Netherlands B.V. | Methods to clean a surface, a device manufacturing method, a cleaning assembly, cleaning apparatus, and lithographic apparatus |
US7605343B2 (en) | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
US20100096371A1 (en) | 2008-10-20 | 2010-04-22 | Bousquet Robert R | System and method for surface cleaning using a laser induced shock wave array |
DE102012214335A1 (en) * | 2012-08-10 | 2014-02-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for ablating a layer |
DE102017121444A1 (en) * | 2017-09-15 | 2019-03-21 | Stabilus Gmbh | Method for producing a component for a damper, component for a damper, damper, production plant |
DE102019219121A1 (en) | 2018-12-10 | 2020-06-10 | Trumpf Laser Gmbh | Process for removing material from a surface |
-
2020
- 2020-11-12 DE DE102020007017.5A patent/DE102020007017B4/en active Active
-
2021
- 2021-11-11 WO PCT/DE2021/000187 patent/WO2022100775A1/en unknown
- 2021-11-11 US US18/252,483 patent/US20230398582A1/en active Pending
- 2021-11-11 EP EP21824465.5A patent/EP4244015A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022100775A1 (en) | 2022-05-19 |
US20230398582A1 (en) | 2023-12-14 |
DE102020007017A1 (en) | 2022-05-12 |
DE102020007017B4 (en) | 2022-10-06 |
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